JPH027470Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to a heat sink for electronic components for dissipating heat from various electronic components that generate heat, such as transistors.

[Conventional technology]

When mounting a printed circuit board, the area for mounting electrical components is small, but there is plenty of space for height, or conversely, there is not enough space for the height, but the mounting area for electrical components can be wide enough, depending on the design conditions. Accordingly, the shape of the heat sink is also divided into two types: a vertical type with a small mounting area but high height relative to the printed circuit board, and a horizontal type with a low height but a large mounting area. I had it ready.

[Problem that the invention attempts to solve]

For this reason, the heat sink requires two types of parts: a vertical type and a horizontal type, which poses problems in terms of manufacturing costs and parts management. Therefore, an object of the present invention is to provide a heat sink that can be used both vertically and horizontally, by making such a heat sink into one type of component.

[Means for solving problems]

To achieve this objective, the present invention includes first protrusions that protrude from the heat sink toward the printed circuit board and engage with the engagement holes of the board, and a second protrusion that is perpendicular to the first protrusions. It is characterized in that the protrusions are provided integrally with each other in a protruding manner.

[Effect]

According to the present invention, if one of the protrusions is made into a vertical type mounting leg, the other protrusion can be used as a horizontal type mounting leg.

〔Example〕

Hereinafter, the present invention will be explained in detail with reference to an embodiment shown in the drawings.

1 and 2 show a heat sink 1 according to the present invention.
FIG. 2 is a perspective view showing a state in which the printer 0 is attached to printed circuit boards A and B in a vertical type and a horizontal type, respectively.

The heat sink 10 is a relatively thick metal body with good thermal conductivity, such as aluminum, and has an approximately rectangular shape, and an electric component 15 that generates heat, such as a transistor, is tightly attached to the flat surface 12 by mounting screws 13. and fixed. A pair of protrusions 14 are integrally provided at both ends of one opposing side of the heat sink 10. Further, on the other opposing sides, two pairs of second protrusions 1 are provided at both ends thereof, which are bent in a direction perpendicular to the protrusion direction of the protrusion 14.
6 are integrally provided.

To explain the case where the heat sink 10 having such a configuration is mounted on a printed circuit board, in FIG. Assume it is small. Therefore, in this case, the first protrusion 14 of the heat sink 10 is engaged with an engagement hole (not shown) provided in the board A, and the mounting area of the heat sink and the electric component 15 is reduced. It is mounted in an upright state that requires less space, that is, in a vertical type.

Note that the means for fixing the heat sink 10 to the printed circuit board is as follows after inserting the protrusion of the heat sink into the board.
Various methods can be considered, such as bending the tip of the protrusion on the back side of the board, soldering it to a copper foil, or utilizing elastic deformation of the protrusion.

Next, in Figure 2, the printed circuit board B has sufficient mounting area but has a height restriction.
In this case, the second protrusion 16 of the heat sink 10 is used as a mounting leg. That is, the two pairs of bent protrusions 16 of the heat sink 10 are engaged with the engagement holes (not shown) of the board B, and therefore the lead terminals 17 of the electrical component 15 are also aligned in the same direction as the protrusions 16. It is mounted in a horizontal type with a low height, which is folded and laid horizontally on the board.

FIG. 3 is a perspective view showing another embodiment of the present invention. In the figure, a heat dissipation plate 20 according to the present invention is formed in a substantially U-shape, and first protrusions 24 are provided from the opposite ends of the side plates 21, respectively, and an electrical component 25 is attached to a mounting screw 23. From the end of the bottom surface 22 to which the first protrusion 2 is fixed
A pair of bent protrusions 26 are formed, which are bent in a direction perpendicular to the protruding direction of 4.

Therefore, if the first protrusion 24 is inserted into an engagement hole of a printed circuit board (not shown) and used as a mounting leg, the first protrusion 24 will be inserted in the same direction as the lead terminal 27 of the electrical component 25. Since they protrude, the electrical components and the heat sink stand up against the board, requiring less mounting area. Furthermore, if the other protruding portion 26 is used as a mounting leg, the lead terminal 27 can be mounted in a low-height horizontal type in which the lead terminal 27 is bent and laid horizontally on the board.

[Effect of idea]

As described above, according to the present invention, since the first and second protrusions are provided protruding from the heat sink in directions perpendicular to each other, these protrusions can be easily removed when mounted on a printed circuit board. One type of heat sink can be used to reduce the mounting area or to lower the height by selecting an appropriate heat sink, which is effective in reducing costs and standardizing parts.

[Brief explanation of drawings]

FIGS. 1 and 2 are perspective views showing different types of mounting forms of a heat sink according to one embodiment of the present invention, and FIG. 3 is a perspective view showing another embodiment of the present invention. 10, 20... Heat sink, 14, 24... First protrusion, 15, 25... Electronic component, 16, 26...
...Second protrusion.

Claims (1)

[Scope of utility model registration request] A heat sink made of a metal plate with good thermal conductivity such as aluminum, which radiates heat from various electronic components that generate heat, such as transistors, and which is inserted into the printed circuit board in directions perpendicular to each other from the heat sink. and a second protruding portion integrally protruding from each other.