JPS5829874U - Printed circuit board combination equipment - Google Patents
Printed circuit board combination equipmentInfo
- Publication number
- JPS5829874U JPS5829874U JP1981124598U JP12459881U JPS5829874U JP S5829874 U JPS5829874 U JP S5829874U JP 1981124598 U JP1981124598 U JP 1981124598U JP 12459881 U JP12459881 U JP 12459881U JP S5829874 U JPS5829874 U JP S5829874U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- board combination
- combination equipment
- slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案に係る装置を以って組合せられたプリン
ト基板の斜視図、第２図及び第３図は本考案に適用され
る第１及び第２の副プリント基板の斜視図、第４図は上
記第１、第２の副プリント基板の結合したものを主プリ
ント基板に結合する直前の状態図ミ第５図は第１図の要
部断面図、第６図は上記第１及び第２の副プリント基板
の結合時にふける要部斜視図である。
１：主プリント基板、２及び３：第１及び第２の副プリ
ント基板、４． ７：スリット。FIG. 1 is a perspective view of a printed circuit board assembled using the device according to the present invention, and FIGS. 2 and 3 are perspective views of first and second sub-printed circuit boards applied to the present invention. Figure 4 shows the state of the first and second sub-printed circuit boards just before they are joined to the main printed circuit board. FIG. 6 is a perspective view of the main parts when the second sub-printed circuit board is connected. 1: Main printed circuit board, 2 and 3: First and second sub printed circuit boards, 4. 7: Slit.
Claims (1)
１の副プリント基板と、該第１の副プリント基板の上記
スリットに下縁に設けたスリットを以って挿通結合され
ることにより上記型及び第１の副プリント基板に電気的
に接続される第２の副プリント基板とから成るプリント
基板の組合せ装置。A first sub printed circuit board having a slit at its upper edge and standing upright on the main printed circuit board, and being inserted into and coupled to the slit of the first sub printed circuit board through a slit provided at its lower edge. A printed circuit board combination device comprising the above mold and a second sub printed circuit board electrically connected to the first sub printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981124598U JPS5829874U (en) | 1981-08-21 | 1981-08-21 | Printed circuit board combination equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981124598U JPS5829874U (en) | 1981-08-21 | 1981-08-21 | Printed circuit board combination equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5829874U true JPS5829874U (en) | 1983-02-26 |
Family
ID=29918463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981124598U Pending JPS5829874U (en) | 1981-08-21 | 1981-08-21 | Printed circuit board combination equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5829874U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018032780A (en) * | 2016-08-25 | 2018-03-01 | 田淵電機株式会社 | Substrate set and sub-substrate for fixation |
| JP2018125458A (en) * | 2017-02-02 | 2018-08-09 | 三菱電機株式会社 | Printed Wiring Board |
| KR20190077843A (en) * | 2017-12-26 | 2019-07-04 | 엘지이노텍 주식회사 | Subatrate fixation structure |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4818646B1 (en) * | 1969-04-14 | 1973-06-07 |
-
1981
- 1981-08-21 JP JP1981124598U patent/JPS5829874U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4818646B1 (en) * | 1969-04-14 | 1973-06-07 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018032780A (en) * | 2016-08-25 | 2018-03-01 | 田淵電機株式会社 | Substrate set and sub-substrate for fixation |
| JP2018125458A (en) * | 2017-02-02 | 2018-08-09 | 三菱電機株式会社 | Printed Wiring Board |
| KR20190077843A (en) * | 2017-12-26 | 2019-07-04 | 엘지이노텍 주식회사 | Subatrate fixation structure |
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