JPS58118752U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS58118752U JPS58118752U JP1447182U JP1447182U JPS58118752U JP S58118752 U JPS58118752 U JP S58118752U JP 1447182 U JP1447182 U JP 1447182U JP 1447182 U JP1447182 U JP 1447182U JP S58118752 U JPS58118752 U JP S58118752U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- semiconductor equipment
- circuit board
- printed circuit
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 5
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａ、 ｂは従来の表面実装型プリント基板使用
の半導体装置の正面図および側面図、第２図ａ、 ｂ
はこの考案の一実施例を示す正面図および端子を取り付
ける前の側面図である。
図中、１は表面実装型プリント基板、２は端子、３．４
は電子部品、５は穴、６は凸部、７ははんだである。な
お、図中の同一符号は同一または相当部分を示す。Figures 1a and b are front and side views of a conventional semiconductor device using a surface-mounted printed circuit board, and Figures 2a and b are
FIG. 1 is a front view and a side view of an embodiment of the invention before terminals are attached; FIG. In the figure, 1 is a surface-mounted printed circuit board, 2 is a terminal, 3.4
5 is an electronic component, 5 is a hole, 6 is a convex portion, and 7 is a solder. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
半導体装置において、別記表面実装型プリント基板に所
定間隔の穴をあけ、一方、前記端子に前記穴とのはめあ
いによ〜り位置決めを行う凸部を設けたことを特徴とす
る半導体装置。In a semiconductor device using a surface-mounted printed circuit board with terminals extending to the outside, holes are formed at predetermined intervals in the surface-mounted printed circuit board, and the terminals are positioned by fitting with the holes. A semiconductor device characterized in that a semiconductor device is provided with a section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1447182U JPS58118752U (en) | 1982-02-03 | 1982-02-03 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1447182U JPS58118752U (en) | 1982-02-03 | 1982-02-03 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58118752U true JPS58118752U (en) | 1983-08-13 |
Family
ID=30026938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1447182U Pending JPS58118752U (en) | 1982-02-03 | 1982-02-03 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58118752U (en) |
-
1982
- 1982-02-03 JP JP1447182U patent/JPS58118752U/en active Pending
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