JPS58210646A - IC chip molded product - Google Patents
IC chip molded productInfo
- Publication number
- JPS58210646A JPS58210646A JP57093031A JP9303182A JPS58210646A JP S58210646 A JPS58210646 A JP S58210646A JP 57093031 A JP57093031 A JP 57093031A JP 9303182 A JP9303182 A JP 9303182A JP S58210646 A JPS58210646 A JP S58210646A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- molded product
- mold
- substrate
- molding material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明はＩＤカードなどの如きば−ス板に埋設 ２−
するＩＣチップのモールド９成形品に関するものである
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an IC chip mold 9 embedded in a base board such as an ID card.
ＩＣチップを、ば−ス板として例えばＩＤカーｒなどの
か＝≠な六≠カービに埋設するのに、ＩＣチップを基板
に固定し、ＩＣチップの端子と基板上の端子とをボンデ
ィングしたチップ体を層厚１２００μｍ程度のカート９
に設けられた凹所又はＩＣ用の空所に埋込むことが行な
われる。このとき、埋込むまで□の間の取扱いに便なる
ようにチップ及びボンド９ワイヤケプラスチツク材でモ
ールド０しておおうことが多い。例えば第１図の如く基
板ｌにチップ２を接着し、端子を配線３にてリート９８
に接続した後エポキシ樹脂などのモールド材４によりモ
ールド１してモールｒ成形品となし、これをカードの本
体を形成するボトム９とボデー１０とに設けられた凹所
に埋込み接着剤を介して固定するようになっている。５
は外部接触端子である。A chip body in which the IC chip is fixed to a substrate and the terminals of the IC chip and the terminals on the substrate are bonded to each other to embed the IC chip in a base plate such as an ID card. Cart 9 with a layer thickness of about 1200 μm
The IC is embedded in a recess provided in the IC or in a cavity for the IC. At this time, the chip is often molded with a bond 9-wire plastic material for ease of handling during the period before embedding. For example, as shown in FIG.
After connecting to the card, it is molded with a molding material 4 such as epoxy resin to form a molded product, and this is embedded into the recesses provided in the bottom 9 and body 10 that form the main body of the card using an adhesive. It is designed to be fixed. 5
is an external contact terminal.
しかしこのような従来のＩＣチップモールド成形品にお
いてはモールド材はかなり大きな縦弾性係数を有するも
のが用いられており、カート９χポ−３−
ゲット内に入れて持ち歩いた場合などに曲げや捩りがか
かり、この曲げ又は捩り変形が硬いモールド９材によっ
て吸収しきれず、内部のＩＣチップ２に加わり、ＩＣチ
ップ２の破損、基板ｌからのばくり、などの事故ン招く
ことがあった。さらにカート９凹所からＸＣモジュール
が浮き上がり脱落する事故もあった。特にカードの層厚
欠一般の磁気カート０等と同様な７６０μｍ程度に薄肉
化する場合には極めて重大な問題であった。However, in such conventional IC chip molded products, the molding material used has a fairly large modulus of longitudinal elasticity, which prevents bending and twisting when carried around in a cart. This bending or torsional deformation cannot be fully absorbed by the hard mold material 9 and is applied to the IC chip 2 inside, resulting in accidents such as damage to the IC chip 2 or falling off the substrate 1. Furthermore, there was an accident in which an XC module rose up from the cart's 9th recess and fell off. This is a particularly serious problem when the thickness of the card layer is reduced to about 760 μm, which is the same as that of general magnetic carts such as 0.
本発明は、従来のものの上記の欠点を除き、カードなど
のば一ス板に曲げ力などの外力がかかつても、ＩＣチッ
プにまでその影響を及ぼさないようＫするＩＣチップモ
ールド成形品を提供することン目的とする。The present invention eliminates the above-mentioned drawbacks of the conventional products and provides an IC chip molded product that does not affect the IC chip even if an external force such as a bending force is applied to a base plate such as a card. The purpose is to do something.
本発明は、ば−ス板に埋込まれるＩＣチップモールド成
形品において、前記ＩＣチップのすぐ外側をモールド９
ｊる第１モールビ材の外側を、さらに第２モールド９材
でおおい、それぞれの材料の縦弾性係数を前記ば−ス板
にてＥＢ、前記第１モールド９材にてＥｉｍ前記第２モ
ールビ材にてＥ２とすると、
Ｅｌ とＥ２のうち少なくとも何れか一方が＜ＥＢなる
ことを特徴とするＩＣチップモールド成形品である。The present invention provides an IC chip molded product to be embedded in a base plate, in which the immediate outside of the IC chip is placed in a mold 9.
The outside of the first molding material 9 is further covered with a second molding material 9, and the longitudinal elastic modulus of each material is EB with the base plate, and Eim with the first molding material 9. The IC chip molded product is characterized in that at least one of El and E2 is <EB.
本発明の実施例を図面を用いて説明すれば、第２図にお
いて、ＩＣチップ２のすぐ外０１１１Ｙ第１モールド材
６でおおい、その外側をさらに第２モールド材７でおお
ってモールド成形品を形成する。To explain an embodiment of the present invention using the drawings, in FIG. 2, the immediate outside of the IC chip 2 is covered with a 0111Y first molding material 6, and the outside thereof is further covered with a second molding material 7 to form a molded product. Form.
このモールビ成形品なボトム９とボデーｌＯとにより形
成された凹所に埋込み接着剤で固定する。It is fixed in the recess formed by the molded molded bottom 9 and the body 10 with an embedded adhesive.
或イは、第１モールＰ材６のみをおおった状態のものケ
、凹所に第２モールド９材７を充填剤兼接着剤として充
填したところに埋込んで第２モールド材６のｌｉＹ形成
せしめるようにしてもよい。Alternatively, if only the first molding material P 6 is covered, the second molding material 7 is filled in the recess as a filler and an adhesive, and then the second molding material 6 is filled with liY. You may also force them to do so.
各部分の材料としては、一応の目安として次のようなも
のが用いられる。As a rough guide, the following materials are used for each part.
以下余白
５−
しかして、これらの材料を次の如き選択基準により選択
する。即ち、
ＥｌとＥ２のうち少な（とも何れか一方が〈ＥＢ・・・
・・・（１）
なる選択基準であり、これにより、ＥＢより小なる縦弾
性係数ケ有する材料の層の部分の剛性がカ ６−
一ト９本体（ボトム９．ボデー１０）の剛性よりも小に
なり、変形しやす（なり、カーｒ本体に加えられた曲げ
や捩りによる変形乞途中で吸収し、ＩＣチップ２に、及
ぼさないように−ｊることかできる。Margin below 5- Therefore, these materials are selected based on the following selection criteria. That is, the smaller of El and E2 (either one is <EB...
...(1) is the selection criterion, whereby the stiffness of the layer of material having a modulus of longitudinal elasticity smaller than EB is greater than the stiffness of the main body (bottom 9, body 10). It is small and easily deformed, and can absorb deformation due to bending or twisting applied to the car body during deformation, and prevent it from affecting the IC chip 2.
その結果ＩＣチップ２の破損、は（す、脱落ン防ぐこと
ができる。As a result, the IC chip 2 can be prevented from being damaged or falling off.
Ｅｌ 、Ｅ２ 、ＥＪＩとの関係は、さらにＥｌ
とＥ２のうち少なくとも何れか一方が＜１０ＥＢ・・・
・・・（１）′
とすれば一層好ましい。The relationship between El, E2, and EJI is further
and E2, at least one of which is <10EB...
...(1)' is more preferable.
（１）又は（１）′ の条件の他、各部分の縦弾性係
数相互の関係を種々選ぶことによってそれぞれ特殊な効
果を奏する。In addition to the conditions (1) or (1)', special effects can be produced by variously selecting the mutual relationship between the longitudinal elastic modulus of each part.
例えば、
ＥＬＪＦＥ２ ・・・・・・（２）とするこ
とにより、曲げ、捩りの外力乞受けても基板ｌからＩＣ
チップ２がはくすすることン防ぐことができる。For example, by using ELJFE2 (2), even if external forces such as bending and twisting are applied, the IC can be removed from the board l.
It is possible to prevent the chip 2 from being exposed.
また、
Ｅｌ ＞Ｅ２ ・・・・・・（３）−
７−
とすれば第１モールｒ材６によりＩＣチップ２を直接１
強度的に保護することができ、曲げ、捩りなどの外力に
対し、ＩＣモジュールが薄い場合に特に秀れた効果を示
す。（３）の条件におけるさらに具体的な例として
ＥＣ＞Ｅ、〉ＥＢ＞Ｅ２中Ｅ Ｌ−・・・・（３Ｙの如
く選択すると、（２）と（３）との効果を併せ奏するこ
とができる。Also, El > E2 (3) -
7- If so, the IC chip 2 is directly connected to the first molding material 6 by
It can provide strong protection and is particularly effective against external forces such as bending and twisting when the IC module is thin. A more specific example of the condition (3) is EC>E,>EB>E2 in E L-...(3Y), it is possible to have the effects of (2) and (3) together. can.
また、この（３）′の組合せの場合次の如き効果が見ら
れた。即ち、基板ｌが円形の場合には、（３）′の場合
でも後述の＜４Ｙの場合でも好い結果ンもたらしたが、
基板ｌが矩形や楕円形の場合、捩り外力による基板ｌの
変形がその全周に対して均等ではなく、このような場合
に特Ｋ（３）′の如く第２モールド９材７と基板ｌとに
柔い材料χ用いることにより、秀れた結果が見られ、基
板１のは（りのおそれがな（なった。Further, in the case of the combination (3)', the following effects were observed. That is, when the substrate l is circular, good results were obtained in both the case (3)' and the case <4Y described below.
When the substrate 1 is rectangular or elliptical, deformation of the substrate 1 due to torsional external force is not uniform over its entire circumference, and in such cases, the second mold 9 material 7 and the substrate 1 are By using a softer material χ, excellent results were obtained, and there was no risk of the substrate 1 being bent.
また、
Ｅｌ＜Ｅ２ ・・・・・・（４）とすれ
ば、第１モールド９材６の部に変形が最も大きく発生す
るが、その結果基板ｌと第２モールｒ材７との間のは（
りが発生しにくくなり、製品の品質が安定する。（４）
の条件における更に具体的な例として。Also, if El<E2 (4), the largest deformation occurs in the first mold 9 material 6, but as a result, the deformation between the substrate l and the second mold r material 7 teeth(
This reduces the chance of oxidation and stabilizes the quality of the product. (4)
As a more specific example of the condition.
ＥＣ＞Ｅ２＝：＝ＥＬ＞ＥＢ＞Ｅｌ （４）
′なる如く選んだ場合は（２） 、 （４）の効果を併
せ奏することができ、一般ＩＣモジュールの場合及び大
形チップの場合など、既存のＩＣに対して、曲げ、捩り
、などの外力に対して極めて秀れた柔軟性を示し、この
結果ボトム９．ボデー１０Ｙ薄（して、カーＹｗ極めて
薄型にすることができる。EC>E2=:=EL>EB>El (4)
'If selected, the effects of (2) and (4) can be combined, and external forces such as bending and twisting can be applied to existing ICs, such as in the case of general IC modules and large chips. As a result, the bottom 9. The body 10Y is thin (so the car Yw can be made extremely thin.
ボンディングには、配線３によるワイヤボンド０やイン
ナーリーｒボンディングなどにて行なうが、変形の余裕
を持たせて施工すれば、外力による変形を吸収し、破断
な防ぐことができる。Bonding is performed by wire bonding using the wiring 3 or innerly R bonding, but if the bonding is performed with a margin for deformation, deformation due to external force can be absorbed and breakage can be prevented.
本発明により、カードなどの４−ス板に曲げや捩りの外
力がかかつても、第１或いは第２モールド材の何れかで
変形ｌ吸収し、かつＩＣチップを強度的に保護し、ＩＣ
チップや基板の破損、は（す、脱落などの事故を未然に
防止するＩＣチップ ９−
モールド９成形品を提供することができ、実用上極めて
大なる効果な奏することができろ。According to the present invention, even if an external force such as bending or twisting is applied to a 4-space board such as a card, the deformation is absorbed by either the first or second molding material, the IC chip is strongly protected, and the IC chip is
It is possible to provide an IC chip mold 9 molded product that prevents accidents such as chip and substrate damage, cracking, and falling off, and is extremely effective in practical use.
第１図は従来例の断面図、第２図は本発明の実施例の断
面図である。
ｌ・・・・・・基板、２・・・・・・チップ、３・・・
・・・配線、４・・・・・・モールド材、５・・・・・
・外部接触端子、６・・・・・・第１モールド材、７・
・・・・・第２モールＮ材、ｓ・・・・・・リード、９
・・・・・・ボトム、ｌＯ・・・・・・ボデー。
特許出願人 共同印刷株式会社FIG. 1 is a sectional view of a conventional example, and FIG. 2 is a sectional view of an embodiment of the present invention. l...Substrate, 2...Chip, 3...
...Wiring, 4...Mold material, 5...
・External contact terminal, 6...First mold material, 7.
...Second molding N material, s...Lead, 9
...Bottom, lO...Body. Patent applicant Kyodo Printing Co., Ltd.
Claims (1)
おいて、前記ＩＣチップのすぐ外側をモールドする第１
モールド９材の外側を、さらに第２モールＶ材でおおい
、それぞれの材料の縦弾性係数を前記ば一ス板にてＥＢ
、前記第１モールド９材にてＥｌ 、前記第２モール
ド材にてＥ２とすると、 Ｅｌ とＥ２のうち少な（とも何れか一方が（ＥＢなる
ことを特徴とするＩＣチップモールド成形品。 ２、前記Ｅｊ 、Ｅ２ 、ＥＢとの関係が、Ｅｌ とＥ
２のうち少なくとも何れか一方が ＜１０ＥＢである特
許請求の範囲第１項記載のＩＣチップモールド９成形品
。[Claims] 1. In an IC chip molded product to be embedded in a hearth plate, a first
The outside of the mold 9 material is further covered with a second mold V material, and the longitudinal elastic modulus of each material is EB with the base plate.
, where El is the first mold material 9 and E2 is the second mold material, an IC chip molded product characterized in that one of El and E2 is (EB).2. The relationship between Ej, E2, and EB is as follows: El and E
2. The IC chip mold 9 molded product according to claim 1, wherein at least one of 2 is <10EB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57093031A JPS58210646A (en) | 1982-06-02 | 1982-06-02 | IC chip molded product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57093031A JPS58210646A (en) | 1982-06-02 | 1982-06-02 | IC chip molded product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58210646A true JPS58210646A (en) | 1983-12-07 |
Family
ID=14071120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57093031A Pending JPS58210646A (en) | 1982-06-02 | 1982-06-02 | IC chip molded product |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58210646A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0189039A2 (en) * | 1985-01-21 | 1986-07-30 | Lupa Finances S.A. | Card with a microprocessor and/or at least an electronic memory |
| JPS6276747A (en) * | 1985-09-30 | 1987-04-08 | Shindengen Electric Mfg Co Ltd | Resin-sealed semiconductor device |
| JPS6318277U (en) * | 1986-07-21 | 1988-02-06 | ||
| US4764803A (en) * | 1986-03-17 | 1988-08-16 | Mitsubishi Denki Kabushiki Kaisha | Thin semiconductor card |
| JPH01171992A (en) * | 1987-12-28 | 1989-07-06 | Ibiden Co Ltd | Printed circuit board for ic card |
| US4921160A (en) * | 1988-02-29 | 1990-05-01 | American Telephone And Telegraph Company | Personal data card and method of constructing the same |
| WO1990008365A1 (en) * | 1989-01-19 | 1990-07-26 | W. & T. Avery Limited | Portable electronic token |
| US5272596A (en) * | 1991-06-24 | 1993-12-21 | At&T Bell Laboratories | Personal data card fabricated from a polymer thick-film circuit |
| FR2745929A1 (en) * | 1996-03-11 | 1997-09-12 | Solaic Sa | Integrated circuit smart card with partly detached zone round integrated circuit chip |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4940068A (en) * | 1972-08-17 | 1974-04-15 |
-
1982
- 1982-06-02 JP JP57093031A patent/JPS58210646A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4940068A (en) * | 1972-08-17 | 1974-04-15 |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0189039A2 (en) * | 1985-01-21 | 1986-07-30 | Lupa Finances S.A. | Card with a microprocessor and/or at least an electronic memory |
| JPS6276747A (en) * | 1985-09-30 | 1987-04-08 | Shindengen Electric Mfg Co Ltd | Resin-sealed semiconductor device |
| JPH0435908B2 (en) * | 1985-09-30 | 1992-06-12 | Shindengen Electric Mfg | |
| US4764803A (en) * | 1986-03-17 | 1988-08-16 | Mitsubishi Denki Kabushiki Kaisha | Thin semiconductor card |
| US5031026A (en) * | 1986-03-17 | 1991-07-09 | Mitsubishi Denki Kabushiki Kaisha | Thin semiconductor card |
| JPS6318277U (en) * | 1986-07-21 | 1988-02-06 | ||
| JPH0524554Y2 (en) * | 1986-07-21 | 1993-06-22 | ||
| JPH01171992A (en) * | 1987-12-28 | 1989-07-06 | Ibiden Co Ltd | Printed circuit board for ic card |
| US4921160A (en) * | 1988-02-29 | 1990-05-01 | American Telephone And Telegraph Company | Personal data card and method of constructing the same |
| WO1990008365A1 (en) * | 1989-01-19 | 1990-07-26 | W. & T. Avery Limited | Portable electronic token |
| US5272596A (en) * | 1991-06-24 | 1993-12-21 | At&T Bell Laboratories | Personal data card fabricated from a polymer thick-film circuit |
| FR2745929A1 (en) * | 1996-03-11 | 1997-09-12 | Solaic Sa | Integrated circuit smart card with partly detached zone round integrated circuit chip |
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