JPS58151619A - Sheet-like small-sized electronic apparatus and its manufacture - Google Patents

Abstract

PURPOSE:To obtain a sheet-like small-sized electronic apparatus which is convenient for carrying, by laminating upper and lower sheets, and upper and lower face sheets, having toughness, so that they are made to closely adhere onto the upper side and the lower side of an electronic parts constitution body, and supporting the electronic parts constitution body by surrounding it by a frame. CONSTITUTION:A titled electronic apparatus is provided with an electronic parts constitution body 11 to which an integrated circuit element 26 for executing the operation by a switch part 51 which is turned on and off by an external operation, a display element 34 for executing the display by a signal of the element 26, and a solar battery 43 for driving them, etc. are connected, and on the upper and lower parts of the constitution body 11, an upper sheet 13 and a lower sheet 15 which have toughness, respectively are made to closely adhere and are laminated. The sheet 13 has a hole part 56 opposed to the switch part, and hole parts 57, 58 opposed to the element 34 and the battery 43, respectively. On the upper part of the sheet 13, an upper face sheet having toughness, which has an operating part 50 for operating the switch through the hole part 50, and a display window 53 is made to closely adhere and is laminated. On the lower part of the sheet 15, a lower face sheet 14 having toughness is made to closely adhere and is laminated, and between the sheets 13, 15, a supporting frame 16 supports the constitution body by suprrounding it, of which a sheet-like electronic apparatus is constituted.

Description

[Detailed description of the invention] and its manufacturing method.

2. Description of the Related Art Recently, there has been a trend toward thinning of small electronic devices such as small electronic calculators, small electronic watches, and electronic game machines in order to improve portability.

Taking a small electronic calculator as an example, a portable calculator is a small and thin seed-like computer (like a credit card).
The goal is to create a card-shaped product. That is,
There is a need for the development of a small electronic calculator that is as thin as a sheet and has a flat outer surface without any protrusions.

However, Toshi's conventional small electronic calculator has a case made of synthetic resin molded or a combination of metal plates, and inside this case there is a wiring board, a display panel, This is where parts such as batteries are placed.

However, the case structure of such conventional small electronic calculators is based on the idea of increasing the inner thickness of the case to provide rigidity in order to protect the parts inside the case from external forces. For this reason, the inner thickness of the case cannot be made very thin, and therefore the thickness of the entire case has been limited to about 1.6 pips at the thinnest part. This has led to the problem that the small electronic calculator, ie, its case, cannot be made extremely thin like a credit card.

Additionally, in many conventional small electronic calculators, the display and input keys protrude from the surface of the case, and the surface is not flat like a sheet, making it difficult to carry. There was also.

The present invention has been made in view of the above-mentioned circumstances, and is a sheet-like small electronic device in which a case in which an electronic component component is housed has a flat sheet structure, and the case is made thinner while maintaining its strength, thereby improving portability. and its manufacturing method.

That is, the present invention provides a structure in which an upper sheet and a lower sheet having toughness are closely laminated on the upper and lower sides of an electronic component structure, and an upper sheet and a lower sheet having toughness are closely attached to the surfaces of the upper sheet and the lower sheet. By laminating the upper sheet and the lower sheet, and by forming a sheet structure in which the child parts structure is supported by a frame between the upper sheet and the lower sheet, a sheet-like case that is tough, extremely thin, and has a flat surface can be obtained. The present invention provides a sheet-like small electronic device and a method for manufacturing the same, in which the electronic component structure can be reliably supported and protected by the case.

Embodiments of the present invention illustrated in the drawings will be described below.

An embodiment in which the sheet-like small electronic device of the present invention is applied to a small electronic calculator will be described.

1 to 24 show one embodiment of the present invention.

FIG. 1 is an external view of the small electronic calculator of this embodiment. As shown in this figure, the small electronic calculator has a rectangular sheet shape. Figure 2 is an exploded view of a small electronic calculator.
In the figure, 1 is an electronic component component, 12 is a top sheet,
13 is an upper sheet, 14 is a lower sheet, 15 is an upper sheet, and 16 is a frame. Each of these sheets 12.

13, 14, 15 and the frame 16 each have a rectangular outer shape with the same size. Then, the electronic component structure 11 is surrounded and supported by the frame 16, and the upper sheet 13 is closely laminated on the upper side of the electronic component structure 11, and the top sheet 12 is closely attached to the upper surface of the upper sheet 13. Laminated,
The lower sheet 15 is closely attached to the lower side of the electronic component structure 11 and the lower sheet 14 is laminated to the lower surface of the lower sheet 15.

In this way, a small electronic calculator in the form of a rectangular sheet is assembled.

The structure of the valley in a small electronic calculator will be explained with reference to FIGS. 3 to 18. 3 to 9 are plan views showing each component. Figures 10 to 13 are cross-sectional views showing the laminated structure. Figure 10-1 is the boundary between the substrate and the frame (part A in Figure 1), and Figure 11 is the part where the operation switch is provided (part 1). FIG. 12 shows a cross section of a portion provided with a display element (part C of FIG. 1), and FIG. 13 shows a cross section of a portion provided with accommodation (first drawing portion). The electronic component structure 11 will be described with reference to FIGS. 3 and 14 to 18. Third
As shown in the figure, the substrate 21 is made of glass epoxy resin or bismaleimide-triazine resin and has a thickness of 190 mm.
It is in the form of a rectangular sheet with a thickness of approximately 35 μm, and a copper foil 22 of approximately 35 μm thick, which forms a predetermined wiring pattern, is placed on the upper and lower surfaces of the sheet through an insulating adhesive 23 of approximately 20 μm thickness. It is glued. The wiring patterns formed by the copper foil 22 on the upper and lower surfaces of the substrate 21 include wiring, contacts, and terminals, and each wiring pattern on the upper and lower surfaces is formed through through holes (not shown) formed at predetermined locations on the substrate 2. Connected. The wiring pattern on the upper surface of the substrate 21 is schematically shown in FIG. 3, and connects fixed contacts, capacitors, display elements, batteries, light emitting diodes, etc. around the integrated circuit element. On the top half of the board 21, a plurality of fixed contacts 24, which are switch elements, are provided as part of the wiring pattern.
... are arranged in a grid pattern, and these fixed contacts 24
consists of a pair of contacts, each of which is connected to an integrated circuit element 26, which will be described later, via a wiring pattern. As shown in FIG. 14, in the other half of the board 21, a hole 25 is formed leaving the wiring pattern (copper foil 22 and adhesive 23) on the lower surface side, and a predetermined calculation is performed by turning on and off the switch element. A semiconductor integrated circuit element 26, that is, a large-scale integrated circuit (LSI), which performs (- foil 22
), and is covered from above with an insulating resin 28 such as silicone rubber or epoxy resin to seal the entire body. The integrated circuit element 26 is, for example, 4711JI vertically.
It consists of a rectangular chip with IX width 4uX thickness 200μ.
10 tuAx Width 10 mm x Thickness from top of integrated circuit 2
45μ. As shown in FIG. 15(0), a chip capacitor 30 is placed in the hole 29 formed in the other half of the board 21, leaving the wiring pattern (copper foil 22 and adhesive 23) on the bottom side. The capacitor 30 is arranged so as to be supported by the wiring pattern (
The substrate 21 is connected to a copper foil 22), and one area of the substrate 21 is covered with an insulating adhesive 32 applied to the upper surface of the substrate 21, such as ultraviolet curing ink. This capacitor 30 is connected to the integrated circuit element 26 via a wiring pattern. Board 2
The corner of the other end of 1 is cut out leaving the wiring pattern (copper foil 22 and adhesive 23) on the bottom side, and the 16th
As shown in Figure (0), a light emitting diode 33 for voltage control is arranged supported by the wiring pattern on the lower surface side, and the electrode 33a of this light emitting diode 33 is adhered to the cream solder 31 applied to the substrate 21. It is connected to the wiring pattern (copper foil 22) on the upper surface of the substrate 21, and the periphery is sealed with an insulating adhesive 32, such as ultraviolet curable ink, applied to the upper surface of the substrate 21. The light emitting diode 33 is connected to the integrated circuit element 26 via a wiring pattern. Board 2
On one side edge side of 1 is a display element 34F, that is, ? ffA1
& panel is arranged and connected to the wiring pattern on the upper surface side of the board 21. As shown in FIG. 17, the display element (liquid crystal panel) 34 is made of a transparent resin film such as a polyester film containing a polarizer, and a liquid crystal 37 is sealed between upper and lower substrates 35 and 36 provided with electrodes. The periphery thereof is sealed with a seal 38, and a thickness of 5 mm is applied to the lower surface of the lower electrode base 35.
A reflecting plate 39 having a thickness of approximately 0 μm is bonded to the reflector plate 39 using an adhesive having a thickness of approximately 15 μm. A plurality of terminal electrodes 40 made of transparent conductive ink connected to the electrodes of each electrode base 35, 36 are arranged in the longitudinal direction and formed on the upper surface of the protrusion of the lower base 35. The display element (liquid crystal panel) 34 has a total thickness of about 550 μm, and has elasticity (toughness) due to the use of a film base. Further, on one side of the upper surface of the board 2, a plurality of terminals 41 are formed by extending the copper foil 22 of the wiring pattern and are arranged in the longitudinal direction. protruding towards the direction.

Both terminal poles 4o of the display element (liquid crystal panel) 34 and the substrate 21
The terminals 41 are bonded together and electrically connected by applying a conductive adhesive 42 such as carbon ink to their respective contact surfaces, and an insulating adhesive 32 such as ultraviolet curable ink is applied around the terminals 41 to each other. It's covered. And display element 3
4 is an integrated circuit element 26 via the wiring pattern of the substrate 21.
It is connected to the integrated circuit element 26 and displays predetermined information based on the signal from the integrated circuit element 26. A battery 43, for example a solar battery, for supplying driving pressure to the integrated circuit element 26 is arranged on one side edge of the substrate 21, alongside the display element 34.
It is connected to the wiring pattern of the board 21. As shown in FIG. 18, the battery (solar cell) 43 is made by depositing an amorphous solar cell layer 46 on the upper surface of a related substrate 44 such as a stainless steel plate through an insulating layer 45 with a thickness of about 25 μm, for example, polyimide. In addition, a protective layer with a thickness of 1
A polyester film 47 with a punch strength of 75 μm is covered, and a pair of terminal doublets 48 and 48 are formed on the upper surface of the metal cut plate 44 with an insulating layer 45 interposed therebetween. This cell (solar cell) 43 has a total thickness of about 300 μm and has elasticity (toughness) as a whole.

In addition, on one side edge of the board 2, there is a copper foil 22 in the wiring pattern at a location opposite to the 112 (solar cell) 43.
A pair of terminals 49 and 49 are formed by protruding in one direction. The terminals 48 of the battery (solar battery) 43 and the terminals 49 of the substrate 21 are electrically connected by applying an electrically conductive adhesive 42 such as carbon ink and adhering them to each other. The surrounding area is covered with an insulating adhesive 32, such as ultraviolet curing ink. For this reason, the battery (
The circuit board 43 is connected to the integrated circuit element 26 via the wiring pattern of the board 21.

The terminal component structure 11 configured in this way is arranged inside the frame 16. The frame 16 is made of, for example, hard vinyl chloride and has a thickness of about 300 μm.The frame 16 has a rectangular frame shape as shown in FIG. Depending on the part's own device, it spreads around the part and forms a nozzle that surrounds it.

As shown in FIG. 3, FIG. 10, FIG. 12, and FIG. , the display element 34, and the pond 43 are laterally pressed by the frame 16, and will be described with reference to FIGS. 10 to 13.

The top sheet 12 is a rectangular sheet with excellent strength (toughness) made of a transparent resin sheet such as a polyester film with a thickness of about 80 μm, and has a four-electron structure as shown in FIGS. An operating section 50 is provided at a location corresponding to the fixed contact forming section of the substrate 2 of the three-component structure 11. This operation section 5θ is provided with each fixed contact 24 of the board 21 on the lower surface of the upper sheet 12.
A plurality of key name printing parts 51... are arranged and printed in a grid pattern corresponding to the key name printing parts 51..., and a plurality of movable parts with a thickness of about 15 to 30 μm are printed corresponding to the lower side of each key name printing part 51... The contacts 52 are formed by arranging them and printing carbon ink or the like. A frame-shaped display window printing part 53 that forms a display window is printed on the lower surface of the top sheet 12, facing the display element 34 of the one-thousand component assembly 11, and a frame that forms a battery window corresponding to the battery 43. A battery window closing portion 54 of the shape of the shape is printed. In addition, numeral 55 in the figure is a blind printing section.

The upper sheet 13 is made of hard vinyl chloride or the like for strength (toughness)
It is a rectangular sheet made of a growth resin having a thickness of about 180μ with excellent properties. As shown in FIG. 6, a plurality of holes 56 are formed in the upper sheet 13 in correspondence with the fixed contacts 24 of the substrate 21, and the holes 56 extend vertically through the display element 34 and the battery. Holes 57 and 5B are formed side by side in pairs of holes 57 and 5B penetrating vertically through the holes 43, respectively.

Note that 59 in the figure is a hole through which the integrated circuit element 26, capacitor 30, and light emitting diode 33 of the substrate 2 can escape.

The Tm1 sheet 14 and the lower sheet 15 are shown in FIGS. 7 and 8.
10 to 13 will be described. The lower sheet 14 is made of synthetic resin such as polyester film with a thickness of about 80 μm, and has a rectangular sheet shape with excellent strength (toughness).As shown in FIG. 7, the upper surface has a blind printed portion 6. The stamp part 1j is marked. The upper sheet 15 is a rectangular sheet with a thickness of about 80 μm made of a synthetic resin with excellent strength (toughness) such as vinyl chloride.
As shown in FIG. 8, the display element 34 of the Nobuko component structure 11
A hole 62 is formed to allow the water to escape.

The upper sheet 13 includes the magnet component structure 11 and the frame 16.
The entire upper surface of the sheet 15 is glued in a dense layer with an insulating adhesive 60 having a thickness of about 20 μm, and the lower part 5 sheet 15 is covered with an adhesive 60 having a thickness of about 20 μm over the entire upper surface of the Nobuko component structure 11 and the frame 16. They are laminated in close contact. Therefore, the upper sheet 13 captures and supports the substrate 21, integrated circuit element 26, capacitor 30, display element 34, and battery 43 of the electronic component structure 11 on the upper side. The lower sheet 15 covers and supports the substrate 21, display element 34, and battery 43 from above. Further, the frame 16 is sandwiched between the upper sheet 13 and the lower sheet 15 at a position surrounding the Nobuko component structure 11. Further, the top sheet 12 is laminated in close contact with the top surface of the top sheet 13 with an adhesive 60 having a thickness of about 20 μm, and the top surface of the top sheet 13 (Table 1Irl) is laminated. The lower sheet 14 has a thickness of 20μ on the surface of the lower sheet 150.
The lower sheet 15 is tightly pressed with adhesive 60 to cover the lower surface of the lower sheet 15.

Furthermore, a description will be given of a structure in which a top sheet 12 and a top sheet 13, a bottom sheet and a -F section sheet 15 are inserted into the child component structure 11 at the upper and lower portions. The top sheet 12 covers the upper m1 of the upper six sheets 13, so that the top sheet 1
The key name printed portions 51 of No. 2 cover the holes 56 of the upper sheet 13, and the movable contacts 52 are located within the holes 56. The display window printing section 53 and the pocket window printing section 54 of the top sheet 12 are located above the holes 57 and 58 of the top sheet 13 to cover the eyes, and the transparent window surrounded by these printing sections 53 and 54 The sheet portion, ie, the display window and the battery window, cover the holes 57, 5B from above. Further, the lower sheet 14 is placed on the lower surface of the lower sheet 15, so that the blind printing portion 6 covers the hole portion 62 of the lower sheet 15 from below, thereby blindfolding the holes 62 of the lower sheet 15. moreover,
As shown in FIG. 11, the holes 56 of the upper sheet 13...
are positioned so as to surround each fixed contact 24... of the board 21 on the upper side, and each movable contact 52... of the sheet 12 is positioned above the fixed contact 24... through the hole 56... To position. Key name printing section 51 and movable contact 52 on top sheet 12
An operation switch is constructed by the hole 56 of the upper sheet 13 and the fixed contact 24 of the board 21. The key name printed part 51 of the upper sheet 7 12 is expanded from above and the movable contact 52 is inserted into the hole of the -L part sheet 13. It can be brought into contact with the fixed contact 24 of the push-down board 2 via the portion 56 and turned on. As shown in FIG. 12, display element (liquid crystal panel) 3
4 faces the portion of the sheet 12 surrounded by the display window print section 53 of the upper ml sheet 12, that is, the display window, through the hole 57 of the upper sheet 13 in the upper case 1, and the display by the display element 34 is displayed on the display window. It is visible from the outside of the upper case 1 through the upper case 1. As shown in Fig. 13, f/il: battery (fat@
The battery) 43 faces the area of the sheet 12 surrounded by the =a window side printing portion 53 of the top sheet 12 through the hole 58 of the top sheet 13, that is, the battery window, and is exposed to the outside of the top case 1 through the battery window. It can receive external light such as sunlight. Note that the display element 34 and the '4 pond 43 are coated with an ultraviolet curable ink 32 or jelly as a spacer and adjoining agent on the respective upper surfaces and the upper sheet 12. The electronic component structure 8 and 11 are surrounded and supported by a frame 16, and the upper and lower sheets 13 and 15 are closely attached to the upper and lower sides of the electronic component structure 11 and the frame 16, respectively. By laminating the top sheet 12 and the bottom sheet 14 in close contact with each other on the upper side and the F side of the calculators 13 and 15, a compact electronic calculator having an integral sheet shape is constructed. This small electronic calculator consists of a top sheet 12 (80μ), an adhesive 60 (20μ), an upper sheet) J, ? (180μ),
Adhesive 60 (20μ), substrate 21 (300μ), adhesive 60 (20μ), ■ section sheet 15 (80μ), adhesive 6
0 (20μ) and the lower sheet 14 (80μ), a thick KN sheet with an overall thickness of 800μ (0,B)(un) is formed. Each sheet 12゜13.
14.15, frame 16 and substrate 21 have a radius of curvature 4Q11L?
It has sufficient mechanical strength and elasticity to withstand bending of about N, and has excellent toughness as a whole for a small electronic calculator.゛The display teeth 9 (liquid crystal panel) 34 and battery 43 of the microscope component component 1 also have a radius of curvature of 40ru, n
l It has sufficient toughness against bending of the rod 5.

By interposing the frame 16 between the upper sheet 13 and the lower sheet 15, the four-child component structure 11 is reliably supported from its periphery, and the upper and lower sheets 13, 15 are
In addition to being able to increase strength by integrating with the
This allows the peripheral edges of each sheet 13, 15 to be easily and reliably sealed with a distance close to the thickness of the electronic component structure 11. Furthermore, this small-sized electronic calculator has an electronic component structure 11, particularly a substrate 2, from the upper and lower sides of the upper sheet 13 and the lower sheet 15 (in this embodiment, the substrate 2).
Sheet l 3,15 made of synthetic resin with higher strength than 1.
Since it has a sandwich structure in which the sheets are sandwiched between the sheets (forming the sheets), when bending force is applied, the stress is dispersed between the substrate 21 and the upper and lower sheets 13 and 15, respectively, and especially when laminated on the outside. When the sheets 13 and 15 have high strength,
Both sheets 130. Since the sheet 15 absorbs a large amount of bending force, the sheet can protect the substrate 21 and has excellent strength. moreover,
The upper sheet 12 and the lower sheet 14 enhance the aesthetic value of the computer's appearance, prevent the upper sheet 13 and the lower sheet 15 from being scratched, and have a sand inch structure for the upper sheet 13 and the lower sheet 15. This increases the strength against bending stress. Moreover, the top sheet 12
is provided with an operating section 50 that can be suppressed from the outside by utilizing the elasticity of the sheet, and the fixed contact 22 of the board 21 is opened via the hole 56 of the upper sheet 13 by the suppressing operation of the operating section 50.
can be turned on and off. That is, by combining the top sheet 12 and the top sheet 13, the top sheet 12
By providing a flat operation part 50 with no protrusion 1 on the surface, and in combination with the fact that the top sheet 12 covers the surface of the upper sheet 13, it is possible to obtain a flat sheet-like case with no protrusion on the case surface. can.

Next, method 1 of manufacturing this small electronic calculator One embodiment will be described with reference to FIGS. 19 to 24.

The basic manufacturing process consists of (4) assembling the electronic component structure 11, molding each of the sheets 12 to 15 and the frame 16,
Next, the upper and lower sheets 13 and 15 are laminated in close contact with each other on the upper and lower sides of the electronic component structure 11, and the upper and lower sheets 12.
14 are stacked in close contact with each other, and the resulting integral gap is cut into a predetermined external shape.

'The case of assembling the heavy element component structure 11 will be described with reference to the process diagram of FIG. 19. A roll film made of glass epoxy resin or the like is prepared by continuously winding a large number of films of the substrate 21 formed with each hole 25° 29 into a roll, and this roll film is fed out three times and each @Foil 2 on the top and bottom surfaces of each board 21
2 to form a predetermined wiring pattern, and then each board 2
After bonding an integrated circuit element (LSI) 26 to the hole 25 of 1 and performing wire bonding and sealing with resin 282 to this integrated circuit tooth 26, the roll film is attached to each substrate 2.
Cut every 1. Then, the hole 2 of the cut substrate 21 is
9 and the notch in Fig. 15fa) and Fig. 16(a)
Solder 31 is applied as shown in FIG. 15(b).
, (C) and FIG. 16(b).

As shown in fc), a capacitor 30 is placed in the hole 29 and a light emitting diode (LED) 33 is placed in the notch, and the solder 31 is melted and the capacitor 30 and the light emitting diode 33 are pressurized to fix them together. . Next, a display cable (finished product panel) 34 and an enemy territory (
It is adhered under pressure to Taiyoden 40.48, and the adhesive part is completely dried and fixed by hot air drying (temperature 120° C. 9, time 60 seconds). Finally, an insulating adhesive 32 such as ultraviolet curing ink is applied to the terminal connection parts of the capacitor 30, light emitting diode 33, display cable 34 and battery 43.
This is cured by irradiating it with ultraviolet light. Note that the substrate 21,
A positioning hole 6J for an assembly jig is formed in each of the display cable 34 and the battery 43 at a predetermined position.

The case of manufacturing the upper and lower sheets 12 and 14 will be described. Both sheets 12 and 14 are roll films made of, for example, polyester and have a predetermined thickness of 80 μm. In the case of the top sheet 12, the roll film is fed out, and after printing the key name printing section 51, display window printing section 53, and battery window printing section 54 on each sheet 12 and applying carbon ink, Cut into a predetermined shape. The lower sheet 14 is cut by each sheet 14 after a blind printing portion 61 is printed on each sheet 14 while the roll film is fed and fed. When cutting, the top sheet 12 has an external dimension larger than that of the final product, as shown by the two-dot chain line in FIGS. disconnect.

Further, during this cutting, positioning holes 64J for assembly jigs are punched out in portions of the upper sheet 12 and the lower sheet 14 located outside the external dimensions of the final product. That is, each sea)2. ? , 14 are cut to have larger external dimensions than the final product for the purpose of positioning and holding during the manufacturing process.

The case of manufacturing the upper and lower sheets 13, 15 and the frame 16 will be described. A roll film made of synthetic resin, such as hard vinyl chloride, having a thickness corresponding to the thickness of each sheet 13.15 and frame 16 is prepared according to the manufacturing process of each sheet 13.15 and frame 16. Then, this roll film is sequentially fed out and cut and punched into predetermined shapes to form each sheet 13, 15 and frame 16. The upper sheet 13 is cut to a larger external size than the final product as shown by the two-dot chain line in FIG. 6, and five holes 56 to 59 are punched out. The lower sheet 15 is cut to have a larger external dimension than the final product as shown by the two-dot chain line in FIG. 8, and holes 62 are punched out. The frame 16 is cut to have an outer dimension larger than that of the final product as shown by the two-dot i line in FIG. 9, and the inside is punched into the frame shape shown. Also, the upper and lower sheets 13.1
As shown in FIGS. 6, 8, and 9, positioning holes 63 are punched into the frame 5 and the frame 16 at predetermined positions in the portion that will become the final product and in the outer portion of the final product.

Further, each of the parts manufactured in this way is assembled through the steps shown in the process diagram of FIG. 20. In this assembly, an assembly jig 64 shown in FIG. 21 and an assembly jig 65 shown in FIG. 22 are used, respectively. The assembly jig 64 is a stand 66
Positioning pins 67 are protruded from the top surface of the final product at predetermined positions on the inner side and at predetermined positions on the outer side of the final product. The assembly jig 65 has a positioning pin 67 protruding from the upper surface of a table 66 at a predetermined position on the outside 6 of the external shape of the final product. Note that the stand 66 has a smaller external dimension than the final product, and the position of each positioning bin 67 corresponds to the positioning hole 63 formed in each part. First, an insulating adhesive 60 is applied to the upper surface of the lower sheet 15, and the lower sheet 15 is positioned and held by an assembly jig 64. In this case, the positioning bin 67 of the assembly jig 64 is inserted into the positioning hole 63 of the lower sheet 15, and the lower sheet 15 is placed on the upper surface of the stand 66. Next, the assembly jig 6 is inserted into the positioning holes 63 of the substrate 21, display element 34, and battery 43.
By inserting the positioning bin 67 of No. 4, the electronic component assembly 11 is positioned and placed on the upper surface of the lower sheet 15 held on the stand 66. In this state, the electronic component structure 11 and the lower sheet 15 are pressed and heated to be pressed together. Next, the frame 16 is positioned by the positioning hole 63 and the positioning pin 67 of the assembly jig 64 in the same way as in the above-mentioned operation, and is placed on the upper surface periphery of the lower sheet 15 by 71 degrees. It is crimped to the lower sheet 15 by pressure and heating. In this case, the frame 16 will surround the naruto of the electronic component structure 1.

Next, an insulating adhesive 60 is applied to the lower surface of the upper sheet 13, and the upper sheet 13 is positioned using an assembly jig 64 and placed on top of the electronic component structure 1 and the upper surface of the frame 16, and then processed. The upper sheet 13 is pressed onto the electronic component structure 11 and the frame 16 by applying pressure and heat. In this way, an integral ram j is obtained in which the electronic component structure 11, the upper sheet 13, the lower sheet 15, and the frame 16 are combined and laminated in close contact. Second
Figure 3 shows this laminate.

Next, an adhesive 60 is applied to the upper surface of the upper sheet 13, that is, the upper surface of the upper sheet 13. At this stage, an assembly jig 65 is used in place of the assembly jig 64. The positioning bin 67 of this assembly jig 65 is attached to a positioning hole 63 formed in the outer part of the final product in the laminate.
The laminate is positioned and placed on the upper surface of the stand 66 of the assembly jig 65 by passing it through the assembly jig 65. Next, the top sheet 12 is positioned using the assembly jig 65 to form the top sheet 13 in the laminate.
The upper sheet 12 is placed flat on the upper surface of the sheet, and the upper sheet 12 is pressed onto the upper sheet 13 by applying pressure and heating. Thereafter, ultraviolet rays are irradiated to cure the ultraviolet curable ink 32 on the display element 34 and battery 43. Next, the ram j is reversed so that its vertical position is reversed, and the assembly jig 65 positions and holds it again, and the adhesive 60 is applied to the upper surface (lower surface) of the lower sheet 15. Next, the lower sheet 14 is positioned and held by the assembly jig 65 and placed over the surface (lower surface p) of the lower sheet 15, and the lower sheet 14 is pressed onto the lower sheet 15 by pressure and heating.

Through the manufacturing process up to this point, as shown in FIG.
A laminate in which 2 and 14 are laminated in close contact is obtained. That is, the electronic component structure 1), the top sheet 12, the top sheet 13, the bottom sheet 914, and the bottom sheet 15 are closely adhered together to obtain a laminate with a uniform appearance.

Further, the outer peripheral side portion of this laminate is cut from the outer shape of the final product and molded into the outer shape of the final product shown in FIG. The top sheet 12, the top sheet 13, the bottom sheet 14, the bottom sheet 15, and the frame 16 are formed to have a larger outer shape than the final product, and the excess outer circumferential portion is cut off. That is, the outer circumferential portion of the laminate where the frame 16 surrounding the electronic component structure 1 is interposed is cut out to give the final product shape.

In this way, as shown in FIG.
The upper sheet 13 and the F section sheet 15 are laminated on the electronic component structure 11, and the upper sheet 12 and the lower sheet 1 are laminated on these two sheets 13.15.
It is possible to manufacture a sheet-like small electronic calculator by laminating 4.

Therefore, the sheet-like small electronic device of the present invention is basically composed of an electronic component component, an upper sheet, a lower sheet, an upper sheet, a lower sheet, and a frame. The materials and thicknesses of the upper and lower sheets and the upper and lower sheets are not limited to those of the embodiments described above; for example, the upper and lower sheets can be made of vinyl chloride. The frame 16 is not limited to being configured separately from the upper sheet 13 and the lower sheet 15;
It is also possible to have a configuration in which it is formed integrally with one or both of the above. For example, as shown in FIGS. 25 and 26, a frame 16 is attached to the upper surface l@edge of the lower sheet 15.
The electronic component structure 1 is arranged in a portion surrounded by the frame 16, and the upper sheet 12 is formed integrally with the frame 16.
It is also possible to adopt a structure in which the lower sheet 15 and the lower sheet 15 are laminated in close contact with each other. The configuration of the operation unit 50 provided on the upper sheet 12 is not limited to the embodiment, and for example, piezoelectric rubber may be provided in the hole of the upper sheet 13 instead of the movable contact. Electronic component structure II is also q! r'I! This is to electrically connect the if child parts, and the structure of part 1 is not limited to the embodiment, and the board 21 may be divided, for example, as shown in FIG. 27. Furthermore, the 'heavy oil 43' is not limited to a solar cell, but a button-shaped pond can also be used.

In the manufacturing method of the present invention, an upper sheet and a lower sheet are closely laminated together with a frame on an electronic component structure, then an upper sheet and a lower sheet are closely laminated on the surfaces of the upper sheet and lower sheet, and then the lower sheet At a predetermined position on the upper surface of the sheet 15, a product of the sheet 13 and the electronic component structure 1 is placed.
A boss 69 made of hard vinyl chloride with a height corresponding to the height of the lower sheet 15 is molded and closed by a printing method, and the boss 69 of the lower sheet 15 is used to connect the lower sheet 15. By adhesively laminating the upper sheet 11 and the upper sheet 13 while positioning and holding them, there is no need to use the assembly jig 64 during the manufacturing process, and it is possible to save labor and reduce costs in manufacturing. As shown in the example, the sheets are not limited to being laminated by bonding each sheet with the adhesive 60, but as shown in FIG. 30, the sheets may be laminated in close contact using a thermocompression bonding method in which the sheets are melted and bonded together by heat. In this case, the J-thickness of each sheet is set to include the thickness of the contact M layer in the above-described embodiment.

In order to adhere the upper sheet 13 and the lower sheet 15 to the upper and lower surfaces of the substrate, the adhesive 60 is used instead of thermocompression bonding.

It should be noted that the present invention is not limited to small scale calculators, but can be widely applied to small electronic devices such as sheet-shaped electronic watches and electronic game machines.

As explained above, the sheet-like small electronic device and the method for manufacturing the same of the present invention include laminating an upper sheet and a lower sheet in close contact with an electronic component structure, and a top sheet and a lower sheet in close contact with the surfaces of both sheets. By stacking them together and further supporting the electronic components by surrounding them with a frame between the two-part sheet and the lower sheet, the entire case becomes an integrated sheet structure, providing excellent toughness. For example, it is possible to realize a large thickness reduction of 1'urs or less. In addition, since the top sheet that covers the back of the top sheet is provided with an operating section that operates switches by operating pressure on itself, the operating section cannot be mounted on the surface of the case, and the case is constructed in the form of a sheet with a flat surface. It is possible, -1-
Ditto for portability. Furthermore, since the top sheet and the upper sheet and the bottom sheet and the bottom sheet are respectively placed on the upper and lower sides of the electronic component structure, the electronic component structure can be sufficiently protected from external forces. Moreover, since the frame is interposed between the upper sheet and the lower sheet, the electronic component can be supported more reliably, and the adhesion between the upper sheet and the lower sheet is strong, providing excellent waterproofness and expandability.

[Brief explanation of drawings]

1 to 18 show an embodiment of a small electronic calculator to which the present invention is applied. FIG. 1 is a perspective view showing the external appearance of the small electronic calculator, FIG. 2 is an exploded perspective view, and FIG. 3 shows the electronic component structure, (a) is a plan view, (b) is an exploded perspective view, FIG. 4 is a top plan view of the top sheet, and FIG. 5 is a top plan view of the top sheet. Fig. 6 is a plan view of the upper sheet, Fig. 7 is a plan view of the bottom sheet, Fig. 8 is a plan view of the lower sheet, Fig. 9 is a plan view of the frame, and Figs. FIG. 14 is a partial cross-sectional view of the equation calculator, and FIG. 14 is a cross-sectional view showing the mounting portion between the integrated circuit element and the board.
16(a), 16(b), and 16(c) are sectional views showing the case where a light emitting diode is attached to a substrate, respectively, and FIG. 17(al(bl is 18(a) and 18(b) are sectional views showing the case in which the display element is attached to the substrate, respectively, FIGS. 19 to 24 are sectional views showing the case in which the battery is attached to the substrate, and FIGS. 19 to 24 are for manufacturing a small electronic calculator. 19 is a process explanatory diagram showing the assembly process of an electronic component assembly, FIG. 20 is a process explanatory diagram showing the entire assembly process, and FIGS. 21 and 22 are FIGS. 23 and 24 are perspective views showing the assembly jig, respectively, FIGS. 23 and 24 are perspective views showing intermediate assembled products, and FIGS. 25 and 26 are sectional views showing other embodiments of the structure of the frame, respectively. A perspective view, FIG. 27 is an exploded perspective view showing another embodiment of the electronic component structure, and FIGS. 28 and 29 show other embodiments of the manufacturing method, respectively.
FIG. 28 is a cross-sectional view showing the assembled state, FIG. 29 is a perspective view showing the lower sheet, and FIG. 30 is a cross-sectional view of a small electronic calculator manufactured by a still different embodiment of the manufacturing method. 11... Electronic component constituent body, 12... Top sheet, 1
3...Top sheet, 14...Bottom sheet, 15...
・Lower sheet, frame...16.21...Substrate, 22.
...Copper foil, 24...Fixed contact, 26...Integrated circuit element, 30...Capacitor, 33...Light emitting diode, 34...Display element (liquid crystal panel), 43...Heavy oil ( 50... Operation unit, 51... Key name printing unit, 52... Movable contact, 53... Display window printing unit, 54... Battery window printing unit, 57-59...・Hole, 6
DESCRIPTION OF SYMBOLS 1... Blindfold printing part, 62... Hole part, 63... Positioning hole, 64.65... Assembly jig, 66... Stand,
67...6 Positioning pin. 7 Fig. 1 3 Fig. 4 51 Fig. 5 et al. 1 Fig. 6 Fig. 7 Fig. 8 Fig. 9 Fig. 10 Fig. 11 Fig. 14 Fig. 15 Fig. 16 Fig. 17 Fig. 18 Fig. 26 27Figure 1 3 Figure 28Figure 29

Claims (2)

[Claims] (1) A switch section that is turned on and off by external operation, a semiconductor integrated circuit element that performs calculations by turning on and off this switch section, a display element that performs display by signals from this integrated circuit element, and a drive for the integrated circuit element. an electronic component structure to which batteries that supply voltage are electrically connected; and a tough upper sheet having a hole facing the switch element and laminated in close contact with the top of the electronic component structure. , a tough top sheet laminated in close contact with the top surface of the top sheet, the top sheet having an operating section for operating the switch element through a hole in the top sheet, and a display window facing the display element; a lower sheet with toughness that is accumulated and laminated on the lower side of the electronic component structure; a lower sheet with toughness that is laminated in close contact with the lower surface of the lower sheet; 1. A sheet-like small electronic device, characterized in that it comprises a frame that is located in between and supports the child component structure by surrounding the opening therebetween. (2) A switch element that is turned on and off by external operation,
An electronic component that electrically connects a semiconductor integrated circuit element that performs calculations by turning on and off switching elements, a display element that displays information based on signals from this integrated circuit element, and a battery that supplies driving voltage to the integrated circuit element. A tough upper sheet is laminated on the upper side of the structure, and a tough lower sheet is laminated on the lower side of the structure, and the electronic component is surrounded and supported by a tough frame between these two sheets. a step of applying a tough top sheet to the top surface of the top sheet that has been pierced in this step;
The method includes the steps of stacking tough bottom sheets in close contact with the bottom surfaces of the bottom sheets, and cutting a peripheral portion of the laminate obtained in this step where the frame is present into a predetermined shape. A manufacturing method of a sheet-like small electronic device with features.