JPS62276659A - Sheet-shaped compact electronic equipment - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] 3. Detailed description of the invention [Industrial application fields] The present invention relates to a sheet-like small electronic device'.

[Prior Art] A small electronic device such as a small electronic calculator houses an electronic component assembly in which an integrated circuit element is attached to a wiring board between a device case, that is, an upper case and a lower case.
In conventional small electronic devices, the thickness of the device case is determined according to the maximum thickness of the components of the electronic component structure housed between the device cases.

2. Description of the Related Art There is a trend toward thinner electronic devices to improve portability, and recently, the goal has been to make small electronic devices as thin as credit cards.

However, in conventional small electronic devices, where the thickness of the device case is set in accordance with the maximum thickness of the components mounted on the electronic component structure, the thickness of the device case cannot be made as thin as a credit card. There wasn't.

The present invention has been made based on the above-mentioned circumstances, and an object of the present invention is to provide a sheet-like small electronic device having a thin sheet-like device case that can be carried and used like a credit card.

[Means for Solving the Problems] In order to achieve the above object, the sheet-like small electronic device of the present invention has an electronic component structure in which a conductor integrated circuit element is attached to a wiring board. is less than 1 mm, both surfaces are flat, and the device is housed between device cases each having an electronic component component storage portion inside which has a shape corresponding to the shape of the electronic component component. be.

[Function] With this configuration, the sheet-like small electronic device of the present invention has a device case in the form of a sheet with a thickness of 1M or less and both surfaces are flat, so it can be carried and used as thin as a credit card. In addition, since the device case is provided with an electronic component structure storage portion having a shape corresponding to the electronic component shape of the electronic component structure, the thickness of the device case can be reduced to ll1lI! Despite being as thin as the following, electronic component components can be easily accommodated between the device cases.

[Example] Embodiments of the present invention illustrated in the drawings will be described below.

An embodiment in which the sheet-like small electronic device of the present invention is applied to a small electronic calculator will be described. Figures 1 to 25
The figure shows an embodiment of the invention.

FIG. 2 is an external view of the small electronic calculator of this embodiment. As shown in this figure, the small electronic calculator has a rectangular sheet shape. FIG. 1 is an exploded view of a small electronic calculator.

In the figure, 11 is an electronic component structure, 12 is a top sheet,
13 is a top sheet, 14 is a bottom sheet, 15 is a lower sheet, and 16 is a frame. Each of these sheets 12.1314.
15 and frame 16 each have a rectangular outer shape with the same size. The upper sheet 12 and the upper sheet 13 are laminated in close contact with each other to constitute the upper case 1 in the form of a sheet, and the lower sheet 14 and the lower sheet 15 are in close contact with each other to constitute the lower case 2 in the form of a sheet. are doing. and,
The electronic component structure 11 is surrounded and supported by the frame 16, and the upper case 1 is bonded and laminated on the upper side of the electronic component structure 11 and the frame 16.
The lower case 2 is glued and laminated on the lower side of the case 6.

In this way, a small electronic calculator in the form of a rectangular sheet is assembled.

The configuration of each part of the small electronic calculator is shown in Figures 3 to 1. ．． Figure 9 will be explained. 3 to 10 are plan views showing each component. Figures 11 to 14 are cross-sectional views showing the laminated structure. Figure 11 shows the boundary between the substrate and the frame (section A in Figure 2), and Figure 12 shows the part where the operation switch is provided (section A in Figure 2). FIG. 13 shows a cross section of a portion provided with a display element (part C in FIG. 2), and FIG. 14 shows a cross section of a portion provided with a battery (second diagrammed portion). Electronic component components】
1 will be described with reference to FIGS. 3 and 4, and FIGS. 1-19. As shown in FIGS. 3 and 4, the substrate 21
is a rectangular sheet with a thickness of about 190μ made of glass epoxy resin or bismaleide-triazine resin, and has a copper foil 22 about 35μ thick on its upper and lower surfaces to form a predetermined wiring pattern. It is bonded through an insulating adhesive 23 with a thickness of about 20 μm.

The wiring patterns formed by the copper foil 22 on the upper and lower surfaces of the substrate 21 include wiring, contacts, and terminals, and each wiring pattern on the upper and lower surfaces is formed by through holes (
(not shown). The wiring pattern on the upper surface of the substrate 21 is schematically shown in FIGS. 3 and 4, and connects fixed contacts, capacitors, display elements, batteries, light emitting diodes, etc. around the integrated circuit element.

A plurality of fixed contacts 24, which are switch elements, are arranged in a grid pattern on the upper half of the substrate 21 as part of the wiring pattern, and the fixed contacts 24 are composed of a pair of contacts. Each contact is connected to an integrated circuit element 26, which will be described later, via a wiring pattern. As shown in FIG. 15, a hole 25 is formed in the other part of the board 21, leaving the wiring pattern (copper foil 22 and adhesive 23) on the lower side.
A semiconductor integrated circuit board 26, ie, a large-scale integrated circuit (LSI), which performs predetermined calculations by turning on and off switch elements, is supported by a wiring pattern on the lower surface side. This integrated circuit element 26 is connected to the base via a gold wire 27! It is connected to the wiring pattern (copper foil 22) on the upper surface side of 1221, and is covered from above with an insulating resin 28 such as silicone rubber or epoxy resin to seal the whole. The integrated circuit element 26 is, for example, 4 x m long x 4 x wide
It consists of a square chip with a thickness of 200 μm, and the insulating resin 28 has a size of, for example, 10 MX vertically x 10 horizontally x 245 μm thick from the top surface of the integrated circuit. As shown in FIG. 16(C), a chip capacitor 30 is placed in the hole 29 formed on the other side of the board 21 while leaving the wiring pattern (copper foil 22 and adhesive 23) on the bottom side. The electrodes 30a formed at both ends of the capacitor 30 adhere to the cream solder 31 applied to the hole 29, and are connected to the wiring pattern (copper foil 22) on the top surface of the board 21. While connected, board 2
1. The periphery is covered with an insulating adhesive 32 applied to the top surface, such as ultraviolet curing ink. This capacitor 30 is connected to the integrated circuit element 26 via a wiring pattern. The corner of the other end of the board 21 is cut out leaving the wiring pattern (copper foil 22 and adhesive 23) on the bottom side, and this part is supported by the wiring pattern on the bottom side as shown in FIG. 17(e). A light emitting diode 33 for power supply voltage control is arranged, and this light emitting diode 33 is bonded to the cream solder 31 applied to the substrate 21, and the electrode 33a is bonded to the substrate 21.
Connect to the wiring pattern (copper foil 22) on the top surface side and connect to the board 21
The periphery is sealed with an insulating adhesive 32 applied to the upper surface, such as ultraviolet curable ink. light emitting diode 33
is connected to the integrated circuit element 26 via a wiring pattern. A display element 34, ie, a liquid crystal panel, is arranged on one side edge of the substrate 21, and is connected to the wiring pattern on the upper surface side of the substrate 21. As shown in FIG. 18, the display element (liquid crystal panel) 34 is made of a transparent resin film such as a polyester film with a polarizer layer therein, and a liquid crystal 37 is sealed between upper and lower substrates 35 and 36 provided with electrodes. The periphery thereof is sealed with a seal 38, and a reflecting plate 39 with a thickness of about 50 μm is adhered to the lower surface of the lower electrode base 36 with an adhesive having a thickness of about 15 μm. On the upper surface of the protrusion of the lower electrode base 36, a plurality of terminal electrodes 40 made of transparent conductive resin are formed in a longitudinal direction, each connected to an electrode of the electrode base 35, 36. Display element (liquid crystal panel)
No. 34 has a total thickness of about 550 μm, and has elasticity (toughness) due to the use of a film base.

Further, on one side edge of the upper surface of the board 21, a plurality of terminals 41 are formed by extending the copper foil 22 of the wiring pattern and arranged in the longitudinal direction. protruding towards the direction. The terminal electrodes 40 of the display element (liquid crystal panel) 34 and the terminals 41 of the substrate 21 are bonded and electrically connected to each other by applying a conductive adhesive 42 such as carbon ink to their respective contact surfaces. The surrounding area is covered with an insulating adhesive 32, such as an ultraviolet curable ink.

The display element 34 is connected to the integrated circuit cable 26 via the wiring pattern of the substrate 21, and displays predetermined information based on a signal from the integrated circuit cable 26. Board 2
On one side edge of 1, there is an integrated circuit element 2 along with a display element 34.
A battery 43, such as a solar battery, for supplying driving voltage to the circuit board 6 is disposed and connected to the wiring pattern of the substrate 21. As shown in FIG. 19, the battery (solar cell) 43 is made by depositing an amorphous solar cell 46 on the upper surface of a metal substrate 44 made of stainless steel or the like through an insulating layer 45 of about 25 μm thick, such as polyimide, and then depositing an amorphous solar cell 46 on the top of the solar cell 46. A polyester film 47 having a thickness of about 175 μm is covered as a protective layer, and a pair of terminal electrodes 48 and 48 are formed on the upper surface of the metal substrate 44 with an insulating layer 45 interposed therebetween. This cell (solar cell) 43 has a total thickness of about 300 μm and has elasticity (toughness) as a whole. Further, on one side edge of the substrate 21, at a location facing the battery (solar cell) 43,
A pair of terminals 49 are formed by protruding the copper foil of the wiring pattern to the side.
゜49 is the formation point. The terminal electrodes 48 of the battery (solar cell) 43 and the terminals 49 of the substrate 21 are electrically connected by applying a conductive adhesive 42 such as carbon ink and adhering them to each other, and the surroundings of the storage are insulating adhesive. The agent 32 is coated with, for example, ultraviolet curable ink. Therefore, the battery (solar cell) 43 is connected to the integrated circuit element 26 via the wiring pattern of the substrate 21.

The electronic component structure 11 configured in this manner is arranged inside the frame J6. The frame 6 is made of, for example, hard vinyl chloride and has a thickness of about 300μ, and this frame 16 has a rectangular frame shape as shown in FIG. It has a shape that follows and surrounds the periphery of the parts depending on the parts arrangement. The frame 16 is arranged around the electronic component structure 11 as shown in FIGS. 21, the display element 34 and the battery 43 are held by the frame 16 so as not to move laterally.

-L section The case 1 will be described with reference to FIGS. 5 to 7 and 11 to 14. The upper case 1 is a combination of a top sheet 12 and an upper sheet 13. The top sheet 12 is a rectangular sheet with excellent strength (toughness) made of a transparent resin sheet such as a polyester film with a thickness of about 80 μm, and has an electronic component configuration as shown in FIGS. 5 and 6. An operating section 50 is provided at a location corresponding to the fixed contact forming section of the substrate 21 of the body 1. The operating section 50 has a plurality of key name printed sections 51 on the bottom surface of the top sheet 12 corresponding to the fixed contacts 24 on the board 21.
are printed in a grid pattern, and each key name printing section 51
A plurality of movable contacts 52 each having a thickness of about 15 to 30 microns are lined up and formed by printing carbon ink or the like on the lower sides of the contacts.

On the lower surface of the top sheet 12, a frame-shaped display window printing section 5 forming a display window faces the display cord 34 of the electronic component structure 11.
3 is printed and formed, and a frame-shaped battery window printing portion 54 forming a battery window corresponding to the battery 43 is printed and formed. In addition,
In the figure, 55 is a blind printing section. The upper sheet 13 is a rectangular sheet made of a synthetic resin having excellent strength (toughness) and having a thickness of about 180 μm, such as hard vinyl chloride. As shown in FIG. 7, a plurality of holes 56 are formed in the upper sheet 13 in correspondence with the fixed contacts 24 of the substrate 21, and extend through the display element 34 and the battery 43. There are vertically penetrating holes 57 and 58 arranged in correspondence with each other to house and escape these parts. In addition, 59 in the figure is the integrated circuit element 26 of the substrate 21,
This is a hole for accommodating and escaping the capacitor 30 and the light emitting diode 33. As shown in FIGS. 11 to 14, this upper case 1 is made by laminating a two-part sheet 13 on the underside of the top sheet 12 via an insulating adhesive 60 with a thickness of approximately 20 μm. The upper sheet 13 provides mechanical strength to the upper sheet 12. The top sheet 13 covers the entire top surface of the top sheet 13, and the key name printed portions 51 of the top sheet 12 are blindfolded from above in correspondence with the holes 56 of the top sheet 13. Each movable contact 52...
* is located in each hole 56... Top sheet 12
The display window printing section 53 and the battery window printing section 54 are printed on the upper sheet 1.
Positioned above the periphery of the holes 57 and 58 in No. 3 and blindfolded,
The transparent top sheet portion surrounded by the printed portions 53 and 54, that is, the display window and the battery window, cover the holes 57 and 58 so that the inside thereof can be seen through. The blind printed portion 55 of the top sheet 12 covers the entire two sides of each hole 59 of the top sheet 13. The two-part sheet 13 serves as a spacer that separates the movable contact 52 of the top sheet 12 from the fixed contact 24 of the substrate 21 and maintains the switch operation interval.

The lower case 2 will be described with reference to FIGS. 8 and 9, and FIGS. 11 to 14. The lower case 2 has a lower sheet 14
and a lower sheet 15. Bottom sheet 1
4 is made of a synthetic resin such as a polyester film with a thickness of about 80 μm and has a rectangular sheet shape, and as shown in FIG. 8, a planar blindfold printing portion 61 is printed on the top surface. The lower sheet 15 is a rectangular sheet with a thickness of about 80 μm made of a synthetic resin with excellent strength (toughness) such as hard vinyl chloride, and as shown in FIG. LCD panel) 3
A hole 62 is formed for storing and escaping 4.

As shown in FIGS. 11 to 14, the lower case 2 has a lower sheet 15 on the upper side of the lower sheet 14 with a thickness of 2.
The lower sheet 14 covers the entire lower surface of the lower sheet 15 and the blind printed part 61 covers the holes 62 of the lower sheet 15 from below. It's hidden.

As shown in FIGS. 11 to 14, the upper case 1 is constructed by laminating the upper sheet 13 on the entire upper surface of the electronic component structure 11 and the frame 16 with an adhesive 60 having a thickness of about 20 μm. The lower case 2 is constructed by laminating the lower sheet 15 on the entire lower surface of the electronic component structure 11 and the frame 16 with an adhesive 60 having a thickness of about 20 μm. The upper case 1 includes a substrate 21 of the electronic component structure 11, a collector circuit element 26, a capacitor 30. The display element 34 and battery 43 are supported and covered from above. The lower case 2 supports and covers the substrate 21, display element 34, and battery 43 from below.

Further, the frame 16 is held tightly between the upper case 1 and the lower case 2 while surrounding the electronic component structure 11. Here, as shown in FIG. 12, each hole 56 of the upper sheet 13 in the upper case 1 is positioned so as to surround each fixed contact 24 of the board 21 on the upper side, and the upper sheet 12
Each movable contact 52... connects to the fixed contact 2 through the hole 56.
4...located above. The key name printed portion 51 of the top sheet 12, the movable contact 52, the hole 56 of the top sheet 13, and the fixed contact 24 of the board 21 constitute an operation switch, and the key name printed portion 51 of the top sheet 12 is pressed from above. The movable contact 52 can be brought into contact with the fixed contact 24 of the push-down board 21 through the hole 56 of the upper sheet 13 and turned on. Display element (liquid crystal panel) as shown in Figure 13
34 is a hole 57 of the upper sheet 13 in the upper case 1
The upper sheet 12 is surrounded by the display window printed portion 53 of the upper sheet 12, that is, faces the display window, and the display by the display element 34 can be viewed from outside the upper case 1 through the display window. As shown in Figure 14, the battery (solar cell) 4
3 is the top sheet 1 through the hole/portion 58 of the top sheet 13.
The portion of the sheet 12 surrounded by the battery official printing portion 53 of No. 2, that is, faces the battery window, and can receive external light such as sunlight from outside the upper case 1 through the battery window.

Incidentally, the display element 3'4 and the battery 43 have, for example, an ultraviolet curable ink 32 applied as a spacer and adhesive between their respective upper surfaces and the upper sheet 12.

In this way, the electronic component structure 11 is attached to the frame 16.
A sheet-shaped upper case 1 is laminated in close contact with the upper side of the electronic component structure 11 and the frame 16, and a sheet-shaped lower case 1 is surrounded and supported by the electronic component structure 11 and the frame 16. By stacking the two in close contact, a compact electronic calculator having an integral sheet shape is constructed. This small electronic calculator consists of a top sheet 12 (80μ), an adhesive 6
0 (20μ), top sheet 13 (180μ), adhesive 6
0 (20μ), substrate 21 (300μ), adhesive 60 (2
0μ), lower sheet 15 (80μ), adhesive 60 (20
The combination of 14 (80μ) and lower surface sheet (80μ) forms a very thin sheet with a total thickness of 800μ (0.8mm). Each sheet 12, 13, 14, 15 and frame 1
6 and the substrate 21 have sufficient mechanical strength and elasticity to withstand bending with a radius of curvature of about 40 mrtt, and the small electronic calculator as a whole has excellent toughness. The display element (liquid crystal panel) 34 and battery (solar cell) 43 of the electronic component structure 11 similarly have sufficient toughness against bending with a radius of curvature of about 40 mm.

In addition, the top and bottom surfaces of the small electronic calculator are formed by the top sheet 12 and the bottom sheet 14, and the top sheet 12 is used to provide an input key operation section, so the entire computer is flat. There are no uneven parts and the entire surface is flat. In addition, by interposing the frame 16 between the upper case 1 and the lower case 2, the electronic component structure 11 can be reliably supported from its periphery, and its strength can be increased by integrating with the upper and lower cases 1.2. In addition, by providing a gap close to the thickness of the electronic component structure 11 between the peripheral edges of the upper case 1 and the lower case 2 by the frame 16, the peripheral edges of each case 1 and 2 can be easily and securely sealed. can be worn.

Next, an embodiment of the method for manufacturing this small electronic calculator will be described with reference to FIGS. 16 to 25. The basic manufacturing process consists of assembling the electronic component structure 11, molding each of the sheets 12 to 15 and the frame 16, and then forming upper and lower sheets 13.1 on the upper and lower sides of the electronic component structure 11.
At the same time, the upper and lower sheets 12 and 14 are laminated in close contact with the upper and lower sheets 13 and 15, and the periphery of the obtained laminate is cut into a predetermined external shape.

The case of assembling the electronic component structure 11 will be described with reference to the process diagram of FIG. 20. A roll film made of glass epoxy resin or the like is prepared by continuously winding a large number of films of the substrate 21 formed with holes 25 and 29 into a roll shape, and this roll film is sequentially fed out and fed to each substrate 21. A predetermined wiring pattern is formed using copper foil 22 on the upper and lower surfaces of each board, and then holes 2 of each board 21 are formed.
5 houses an integrated circuit element (LSI) 26, and wire bonding and resin 28 are performed on the integrated circuit element 26.
After sealing with
Cut every 1. Then, the hole 29 of the cut substrate 21
16(a) and 17(a), and then apply solder 31 to the notch as shown in FIG. 16(a) and FIG. 17(b).
, (C) and FIGS. 17(b) and (e), a capacitor 30 is placed in the hole 29, and a light emitting diode (LE) is placed in the hole 29.
D) The capacitors 30 and the light emitting diodes 33 are placed in the notches, and the solder 31 is melted and the capacitors 30 and the light emitting diodes 33 are pressurized to fix them together. Next, a display element (liquid crystal panel) 34 and a battery (solar cell) 43 are arranged adjacent to the substrate 21, and each terminal (finger lead) 41.49 on the substrate 21 is marked, and each terminal 41 A conductive adhesive 42 such as carbon ink is applied to the terminal 41.49 by hot air drying (temperature 120°C, time 4 seconds).
The portion is left in a semi-dry state, and then the substrate 21 is positioned and the terminals 41.49 are bonded under pressure to the terminal electrodes 40.48 of the display element 34 and the battery 43, and this bonded portion is dried with hot air (temperature 120° C., 60 seconds) to completely dry and solidify. Finally, a capacitor 30, a light emitting diode 33,
An insulating adhesive 32, such as an ultraviolet curable ink, is applied to the terminal connection portions of the display element 34 and the battery 43, and is cured by irradiating ultraviolet rays. Note that the substrate 21 and the display element 34
A positioning hole 63 for an assembly jig is formed in each of the batteries 43 and 43 at a predetermined position.

The case of manufacturing the top and bottom sheets 12 and 14 will now be described. For both sheets 12 and 14, roll films made of, for example, polyester and having a predetermined thickness of 80 μm are prepared. In the case of the top sheet 12, the roll film is fed out,
Key name printing section 51 and display window printing section 5 for each sheet 12
3 and the battery official printing part 54 and coated with carbon ink, each sheet 12 is cut into a predetermined shape.

The lower sheet 14 is cut by each sheet 14 after a blind printing portion 61 is printed on each sheet 14 while the roll film is fed and fed. When cutting, the top sheet 12
As shown by the two-dot chain line in FIGS. 5 and 6, the lower sheet 14 is cut to have an outer dimension larger than that of the final product, as shown by the two-dot chain line in FIG. 8. Further, during this cutting, positioning holes 63 for assembly jigs are punched out in portions of the upper sheet 12 and lower sheet 14 located outside the external dimensions of the final product.

That is, the reason why each sheet 12, 14 is cut to have an outer dimension larger than that of the final product is to position and hold the sheet during the manufacturing process.

The case of manufacturing the upper and lower sheets 13, 15 and the frame 16 will now be described. A roll film made of synthetic resin, such as hard vinyl chloride, having a thickness corresponding to the thickness of each sheet 13.15 and frame 16 is prepared according to the manufacturing process of each sheet 13.15 and frame 16. Then, this roll film is sequentially fed out and cut and punched into predetermined shapes to form each sheet 13, 15 and frame 16. The upper sheet 13 is cut into a larger external dimension than the final product as shown by the two-dot chain line in FIG. 6, and holes 56 to 59 are punched out. lower sheet 1
5 is cut to have a larger external dimension than the final product as shown by the two-dot chain line in FIG. 9, and a hole 61 is punched out. The frame 16 is cut to have an outer dimension larger than that of the final product as shown by the two-dot chain line in FIG. 10, and the inside is punched into the frame shape shown. Additionally, positioning holes 63 are formed in the upper and lower sheets 13.15 and the frame 16 at predetermined positions in the portion that will become the final product and the outer portion of the final product, respectively, as shown in FIGS. 7, 9, and 10. Form by punching.

Furthermore, each of the parts manufactured in this way is assembled through the steps shown in the process diagram of FIG. 21.

Note that during this assembly, an assembly jig 64 shown in FIG.
and an assembly jig 65 shown in FIG. 23 are used, respectively. The assembly jig 64 has positioning pins 67 protruding from the upper surface of a table 66 at predetermined positions on the inner side of the external shape of the final product and at predetermined positions on the outer side. The assembly jig 65 is the stand 6
A positioning pin 67 is protrudingly provided at a predetermined position on the outer side of the outer shape of the final product on the upper surface of the product. In addition,
The stand 66 has a larger external dimension than the final product, and the position of each positioning pin 67 corresponds to the positioning hole 63 formed in each part. First, lower sheet 1
An insulating adhesive 60 is applied to the upper surface of the lower sheet 15, and the lower sheet 15 is positioned and held by an assembly jig 64. In this case, align the positioning pins 67 of the assembly jig 64 with the positioning holes 63 of the lower sheet 15, and insert the lower sheet 15 into the stand 6.
Can be grown on top of 6. Next, the substrate 21 and the display element 34
By inserting the positioning pins 67 of the assembly jig 64 into the positioning holes 63 of the battery 43, the electronic component structure 1
1 is positioned and held on a stand 66.
Lay it on the top surface of 5. In this state, the electronic component structure 11 and the lower sheet 15 are pressed and heated to be pressed together. Next, the frame 16 is inserted into the positioning hole 6 in the same manner as described above.
3 and positioning pins 67 of the assembly jig 64, and place the frame 16 overlappingly on the peripheral edge of the upper surface of the lower sheet 15, and pressurize and heat the frame 16 to press the frame 16 to the lower sheet 15.

In this case, the frame 16 will surround the electronic component structure 11. Next, an insulating adhesive 60 is applied to the lower surface of the upper sheet 13, and the upper sheet 13 is positioned using an assembly jig 64 and placed on top of the electronic component assembly 11 and the upper surface of the frame 16, and is pressed. , the upper sheet 13 is pressed onto the electronic component structure 11 and the frame 16 by applying heat. In this way, the electronic component structure 11, the upper sheet 13, and the lower sheet 1
5 and the frame 16 are combined to form a laminate in which they are closely laminated. The laminate of No. 249'\ is shown.

Next, an adhesive 60 is applied to the upper surface of this laminate, that is, the upper surface of the upper sheet 13, and the electronic component structure 1 is
The upper surfaces of the display element 34 and battery 43 in Step 1 are coated with ultraviolet curable ink, that is, adhesive 32. At this stage, an assembly jig 65 is used in place of the assembly jig 64. The laminate is positioned and placed on the upper surface of the stand 66 of the assembly jig 65 by passing the positioning pin 67 of the assembly jig 65 through the positioning hole 63 formed in the outer part of the final product in the laminate. . Next, the top sheet 12 is assembled using an assembly jig 6.
5 and placed on top of the upper surface of the upper sheet 13 in the laminate, and the upper sheet 1 is placed under pressure and heat.
2 to the upper sheet 13. Thereafter, ultraviolet rays are irradiated to cure the ultraviolet curable ink 32 on the display cord 34 and battery 43. Next, the laminate is turned upside down so that its vertical position is reversed, and is again positioned and held in the assembly jig 65, and the adhesive 60 is applied to the upper surface (lower surface) of the lower sheet 15. Next, the lower sheet 14 is positioned and held by the assembly jig 65 and placed on the surface (lower surface) of the lower sheet 15, and the lower sheet 1 is pressed and heated.
4 to the lower sheet 15. Through the manufacturing process up to this point, as shown in FIG. 25, the upper and lower sheets 13 are
．． A laminate is obtained in which the upper and lower sheets 12 and 14 are closely laminated between 15 and 15 sheets. That is, the electronic component structure 11
, a frame 16, an upper case 1, and a lower case 2 are laminated together.

Further, a portion of this laminate on the outer circumferential side that is larger than the outer shape of the final product is cut and formed into the outer shape of the final product shown in FIG. The top sheet 12, the top sheet 13, the bottom sheet 14, the bottom sheet 15, and the frame 16 are formed to have a larger outer shape than the final product, and the excess outer circumferential portion is cut off. That is, the outer circumferential portion of the laminate where the frame 16 surrounding the electronic component structure 11 is interposed is cut out to give the final product shape.

In this way, as shown in FIG.
A small electronic calculator having a sheet shape in which an upper case 1 and a lower case 2 are laminated is manufactured.

Therefore, in such a small electronic calculator, an electronic component structure having a semiconductor integrated circuit element attached to a wiring board is required to have a thickness of 1 μ or less, both surfaces are flat, and the electronic component structure is mounted inside. The electronic component structure has a shape corresponding to the shape of the base sheet 12. and bottom sheet 1
4 to form a flat surface, it can be made as thin as a credit card and have a surface condition similar to that of a credit card. Further, the upper sheet 13 of the upper case 1 is formed with a storage portion corresponding to the maximum external dimensions and maximum thickness dimensions of the electronic components of the electronic component structure 11. That is, the upper sheet 13 has a hole 59 for removing the integrated circuit element 26, the capacitor 30, and the light emitting diode 33, and an upper part 5 for releasing the display element 34 and battery 43.
7.58 and a hole 62 through which the display cable 34 escapes is formed in the lower sheet 15, so that the electronic component structure 11
The upper case 1, the electronic component assembly 11, the 16 frames, and the lower case 2 can be stacked and brought into close contact with each other while sandwiching the electronic component assembly 11 between the upper case 1 and the upper case 1.
It can be easily stored between the and the lower case.

Therefore, the sheet-like small electronic device of the present invention has a sheet-like upper case and a sheet-like lower case tightly laminated on the upper and lower sides of an electronic component structure, and furthermore, a frame is used to hold the electronic component structure between the two cases. It is designed to be surrounded and supported. The upper case has a switch operation section and a display window and is in the form of a sheet that is tightly laminated on the upper side of the electronic component structure, and the lower case is in the form of a sheet that is tightly laminated on the lower side of the electronic component structure. It is something that does.

The upper case and lower case will be explained using a small electronic calculator as an example. In the above-described embodiment, the upper case 1 is constructed by combining the upper sheet 12 with the upper sheet 13 as a reinforcing and switch spacer as an integral structure, but the upper case has the basic functions described above. By making the upper sheet 13 into an integral structure, the upper case 1 can be constructed only from the upper sheet 12 having the display window printing section (display window) 53 and the operation section 50. When the top sheet 12 is used as the upper case 1, a spacer for a switch may be provided on the lower side of the top sheet 12 corresponding to the operation section 50, and in this case, the lower case 2 and the frame 16 are It is preferably made of thick and hard resin to make it durable. FIG. 26 shows an example of this case, and 68 in the figure is a spacer.

In addition, instead of making the top sheet 12 thin as in the previous embodiment, it is formed thickly from hard vinyl chloride like the double-sided sheet 13 to increase its own strength and serve as the upper case 1 by itself. Can be used. FIG. 27 shows one embodiment thereof.

In this case, the operation part of the upper sheet 13 is made thin only in that part, for example, so that it can be suppressed, and a spacer 68 is provided on the lower side.
It is sufficient to provide the following. In other words, the upper case basically only needs to be a single sheet having an operating section and a display window, and can also have a multi-sided structure. The configuration of the operating section is also not limited to the embodiment. Further, in the above-described embodiment, the lower case 2 has a structure in which the lower sheet 14 and the lower sheet 15 are integrally laminated and combined, but the lower case 2 is laminated below the electronic component structure 11. Therefore, it is also possible to use only one of the lower sheet 14 and the lower sheet 15 as the lower case 2 without combining the two sheets 14 and 15 together. For example, as shown in FIGS. 26 and 27, the lower sheet 15 can be used alone as the lower case 2. Further, although not shown, only the lower sheet 14 can be used as the lower case 2. In this way, the upper case 1 and the lower case 2 can be constructed by laminating individual sheets in close contact with each other on the upper and lower sides of the electronic component structure 11 and the frame 16, respectively.

Let's talk about the frame. The frame is located between the upper case and the lower case, and its basic structure is to surround and support the electronic component structure.

In the embodiments described above and those shown in FIGS. 26 and 27, the frame 16 is formed separately from the upper case 1 and the lower case 2, and the periphery of the upper case 1 and the lower case 2 is Although the parts 1 are in close contact with each other with an independent frame body 16 interposed between them, the present invention is not limited to this structure. It is also possible to adopt a structure in which the upper case and the lower case are brought into close contact with each other via 16.

FIGS. 27 and 28 show an embodiment in which the frame 16 is integrally formed with the case. In this embodiment, the upper case 1 and the lower case 2 are constructed of a thick single sheet made of, for example, hard vinyl chloride. In this embodiment, a frame 16 having the same shape as the frame 16 described above is integrally formed at the peripheral edge of the lower case 2.

The electronic component structure 11 is disposed in a recess surrounded by a frame 16 of the lower case 2, and the upper case 1 is laminated in close contact with the upper side of the electronic component structure 11 and the frame 16.

Furthermore, the electronic component structure 11 is not limited to the substrate 21 of the embodiment, but may be divided into two parts and electrically connected to each other as shown in FIG. Components are electrically connected to form an electronic component structure. The battery is not limited to a solar cell, and a normal button-type battery may be used alone or in combination with a solar cell.

Note that the present invention is not limited to small electronic calculators, but can be widely applied to small sheet-shaped electronic devices.

[Effects of the Invention] As explained above, according to the present invention, an electronic component structure can be stored according to the shape of the electronic component structure inside an equipment case with a thickness of 1M or less and both surfaces of which are flat. By providing a section to accommodate the electronic component structure without difficulty, it is possible to obtain a sheet-like compact electronic device that is as thin as a credit card and convenient to carry.

[Brief explanation of the drawing]

1 to 19 show an embodiment of a small electronic calculator to which the present invention is applied, FIG. 1 is an exploded perspective view of the small electronic calculator, FIG. 2 is a perspective view showing the external appearance, 3 is a plan view showing the electronic component structure, FIG. 4 is an exploded perspective view, FIG. 5 is a top plan view of the top sheet, FIG. 6 is a bottom box 10 of the top sheet, and a top view of the frame. Figures 11 to 14 are enlarged cross-sectional views of parts of the small electronic calculator, Figure 15 is an enlarged cross-sectional view of the mounting portion between the integrated circuit element and the board, and Figure 16 (a). , (b), (c)
17(a), (b), and (c) are sectional views showing the case where a light emitting diode is attached to the substrate, and FIG. 18(a), 19(b) is a cross-sectional view showing the case where the display element is attached to the substrate, respectively, and FIGS. 19(a) and 19(b)
) is a cross-sectional view showing the case where the battery is attached to the board, and the second
Figures 0 to 25 show an example of manufacturing a small electronic calculator, Figure 20 is a process explanatory diagram showing the assembly process of electronic component components, and Figure 21 is a diagram showing the entire assembly process. FIGS. 22 and 23 are perspective views showing an assembly jig, FIGS. 24 and 25 are perspective views showing an intermediate assembled product, and FIGS. 26 and 27 are 28 and 29 are sectional views and perspective views showing other embodiments of the frame structure, respectively, and FIG. 30 is a sectional view showing other embodiments of the small electronic calculator. It is an exploded perspective view showing an example of this. 1... Upper case, 2... Lower case, 11...
Electronic component constituent, 12... Top sheet, 13... Top sheet, 14... Bottom sheet, 15... Bottom sheet, 16... Frame, 21... Board, 22... Copper foil,
24... fixed contact, 26... integrated circuit element, 30...
...Capacitor, 33...Light emitting diode, 34...
・Display element (liquid crystal panel), 43...Battery (solar cell), 50...Operation section, 51...Key name printing section, 5
2... Movable contact, 53... Display window printing section, 54...
・Battery public printing part, 57-59...hole part, 61...blind printing part, 62...hole part, 63...positioning hole,
64.65... Assembly jig, 66... Stand, 67...
Positioning pin, 68...spacer. Applicant's Representative Patent Attorney Takeshi Suzue 3rd Figure S1 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Figure 9 Figure 10 Figure 11 Figure 12 1J Figure 13 K14 Figure 15 Figure 16 Figure 17 Figure 18 Figure 19 rlA Figure 24 Figure 25

Claims (1)

[Claims] An electronic component structure in which a semiconductor integrated circuit element is attached to a wiring board has a thickness of 1 mm or less, both surfaces are flat, and the inside has a shape corresponding to the shape of the electronic component structure. What is claimed is: 1. A sheet-like small electronic device, characterized in that the sheet-like small electronic device is housed between device cases having an electronic component component storage section.