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JPS58148944U - Heat generating circuit element connection structure - Google Patents

Heat generating circuit element connection structure

Info

Publication number
JPS58148944U
JPS58148944U JP4608582U JP4608582U JPS58148944U JP S58148944 U JPS58148944 U JP S58148944U JP 4608582 U JP4608582 U JP 4608582U JP 4608582 U JP4608582 U JP 4608582U JP S58148944 U JPS58148944 U JP S58148944U
Authority
JP
Japan
Prior art keywords
circuit element
generating circuit
connection structure
heat generating
element connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4608582U
Other languages
Japanese (ja)
Inventor
新居 道明
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP4608582U priority Critical patent/JPS58148944U/en
Publication of JPS58148944U publication Critical patent/JPS58148944U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の発熱回路素子接続構造を示す親図図、第
2図はこの考案に係る発熱回路素子接続構造の一実施例
を示す分解斜視図、第3図、第4図は第2図の接続部の
具体例を示すリード曲げ前後の状態図である。
Fig. 1 is a parent diagram showing a conventional heat generating circuit element connection structure, Fig. 2 is an exploded perspective view showing an embodiment of the heat generating circuit element connection structure according to this invention, and Figs. FIG. 6 is a state diagram showing a specific example of the connection portion shown in the figure before and after lead bending.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 予め印刷配線板の所定部に適数個の筒状導電性ピンを半
田付けし、この筒状導電性ピンに対して予め放熱器に取
着された発熱回路素子のリードを挿入して弾接せしめる
構成としたことを特徴とする発熱回路素子接続構造。
An appropriate number of cylindrical conductive pins are soldered to predetermined portions of the printed wiring board in advance, and the leads of the heating circuit element, which has been previously attached to the heat sink, are inserted into the cylindrical conductive pins to make elastic contact. A heat-generating circuit element connection structure characterized by having a configuration in which a heat generating circuit element is connected.
JP4608582U 1982-03-31 1982-03-31 Heat generating circuit element connection structure Pending JPS58148944U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4608582U JPS58148944U (en) 1982-03-31 1982-03-31 Heat generating circuit element connection structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4608582U JPS58148944U (en) 1982-03-31 1982-03-31 Heat generating circuit element connection structure

Publications (1)

Publication Number Publication Date
JPS58148944U true JPS58148944U (en) 1983-10-06

Family

ID=30057089

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4608582U Pending JPS58148944U (en) 1982-03-31 1982-03-31 Heat generating circuit element connection structure

Country Status (1)

Country Link
JP (1) JPS58148944U (en)

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