JPS58139495A - Printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention is adjacent to the structure of the conductor pattern of the printed wiring board (To#), and is further formed by a dosing, luminescent, electroless metal molding process. Full additive method and knowledge
) Concerning the structure of the conductor pattern C (hereinafter referred to as pattern), 6. The five two-meter fists that are formed in the conventional Fukucho date method (the five two-meter fists arranged mainly below in the turn structure) Firstly, as shown in FIG. 1, a nickel thin film 21 is provided on the lI! surface of the insulating base material 1, and secondly, as shown in FIG. The former lamp has excellent close contact between the metal thin film and the insulating base material, but the pattern solution gI [but the cost of the insulating base material does not affect the shape of the frame]. However, since pattern darkness tends to occur one by one, there is a drawback that it cannot be applied to printer layouts that require very detailed patterns. However, the adhesion I!I- between the metal thin film and the insulating base material is low (the thickness of the copper thin film increases, and the thickness of the copper thin film increases). As the process progresses, gunk accumulates between the copper thin film and the insulating base material, causing frequent so-called blistering, which eventually leads to the key thin film breaking - AX.

This invention eliminates the drawbacks of the present invention, and its purpose is to improve the solution of conductive patterns formed by the fully additive method.
The purpose of this article is to sufficiently increase the degree of interaction with the insulating base material.In addition, glass-epoxy base tube, paper-phenol base material, which can be applied to this article, are Tube, plastic ivy film, narrow side full! All the base materials applied to general print layouts 5III7I, such as lit-treated gold '141/Il, are listed below.
〉 Adhesion strength of nickel thin film and pattern resolution of copper thin film in metal thin film formed by this apt-z fully additive method
Focusing on IIIf 〇L shown in Figure 5 Sea urchin glass-epoxy group 1 #1 (mu) Salt tin (4) Water soluble (concentration 1 g @ rl) 41 (soot on the surface after immersion 0 [) An ion layer 2 is provided* (B) - A photomask S is placed on top of this and exposed to ultraviolet rays, and the irradiated area becomes S:R (trans) ions.7? (c), This was immersed in palladium chloride (11 (il[2 g @/-1) to form palladium @ medium nucleus 4), and was then plated on alkaline electroless steel containing a formaldehyde-based reducing agent. Soak it to a thickness of 5~toosmli! Shape the copper pattern 5 of the station 901) and add it to a palladium chloride 0 [) aqueous solution (concentrated [2
palladium @ medium nucleus 4 on the copper surface by immersing it in
(G), nickel 7 was deposited on the second side of the copper by immersing it in an unsealed nickel plating solution containing a hypophosphorous acid-based reducing agent (G). 5 to 1
00 snow and limited? However, if it is less than 5W, the pattern will not dance to the light and the pattern will break, resulting in 1θO-
If this is the case, the blistering described above will occur, and even if a nickel layer is formed, no improvement in adhesion strength will be observed.
The adhesion strength between the copper-nickel layer and the glass-epoxy base tube by this actual weaving is on average T8 noodles e51""l, far exceeding the standard A8 noodles am""1, Average adhesion strength between conventional glass-epoxy base tube and steel only: 17 kg-
A significant improvement was observed in ox"" wealth. Also, pattern resolution was possible down to a minimum of 30μ, which is the same as pattern formation using only copper.As described above, the present invention has excellent resolution. It makes it possible to manufacture printed circuit boards with high precision and strong adhesion to the base material.The main application is in various electronic devices such as watches, calculators, cameras, and computers. Jakuden supplies circular aS has been raised.

[Brief explanation of the drawing]

! 111tj full day pre-event method, Ame Feng Motoki Murakami made a pattern of 11 nickel wins, 764t> fault diagram, figure 2, full day 1,000-day method on a super soft base material-*
*Cross-sectional diagram of the pattern formed 5th IltjA
~G Kemoto W-Print IP Sotai's Ichizukou lj! body a#
Figure 1 and Figure 21 of the expansion of JY are shown as a partial comparison with the t-IF error. The above-mentioned person shares the company - Visit Seiko ◆ Patent attorney Mogami Written amendment of administrative procedures (voluntary) March 31, 1950 To the Commissioner of the Japan Patent Office 1, Indication of the case Patent Application No. 8671 of 1986 2, Name of the invention Print S* 3. Person making the amendment Relationship to the case Applicants 1 and 4 amend the scope of the claims as shown in the attached sheet. 2. Specification 1#5, line 12, ``Soot (1) ion layer 2 on the surface'' is corrected to ``Tin seal ion layer 2 on the surface.'' 5. Specification, page 4, line 4, “Limited to 5 to 100 pieces when the size is 5 mm or less.”
The limit is corrected to ``5 to 1100n, but %5nm or less is 6.'' Tun Specification, page 4, line 6, it says “100II8 or more” t “100nJn
Corrected to ``Moyo de 6 Toto''. In a printed wiring machine manufactured by forming a conductor pattern using photo-selective electroless plating, the conductor pattern formed on the insulating base material has a thickness of 5 m or more. ~1
100n long steel exhibition, printed layout 443 featuring a two-layered structure with a thin nickel film on its surface.

Claims (1)

[Claims] In printed circuit boards manufactured by forming a conductor pattern using selective foldable electroless plating, the conductor pattern formed on the F gloss base material using selective foldable electroless plating has a thickness of 5~
Printed wiring tube characterized by a two-layer structure consisting of a 100-si+ copper thin film and a nickel thin film on its surface.