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JPS58131743A - Method of ball formation for wire bonder and device thereof - Google Patents

Method of ball formation for wire bonder and device thereof

Info

Publication number
JPS58131743A
JPS58131743A JP57014230A JP1423082A JPS58131743A JP S58131743 A JPS58131743 A JP S58131743A JP 57014230 A JP57014230 A JP 57014230A JP 1423082 A JP1423082 A JP 1423082A JP S58131743 A JPS58131743 A JP S58131743A
Authority
JP
Japan
Prior art keywords
electric torch
torch electrode
ball
capillary
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57014230A
Other languages
Japanese (ja)
Inventor
Hiroshi Ushiki
博 丑木
Motoaki Kadosawa
門沢　元昭
Yuji Tanaka
祐二 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP57014230A priority Critical patent/JPS58131743A/en
Publication of JPS58131743A publication Critical patent/JPS58131743A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85053—Bonding environment
    • H01L2224/85054—Composition of the atmosphere
    • H01L2224/85075—Composition of the atmosphere being inert
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01007—Nitrogen [N]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To improve the bondability as well as to prevent the contamination of an electric torch electrode and a capillary of the titled device by a method wherein the ball is formed in the atmosphere of gas which blows out of a nozzle. CONSTITUTION:N2 is blown out at all times or when the ball is being formed into the space between the capillary 2 and the electric torch electrode 13 from the nozzle 12 through a tube 15 and a pipe 11, a high voltage current is applied to the electric torch electrode 13, and the ball 3a is formed by the spark generated between the point of a wire 3 and the electric torch electrode 13. The flowing quantity of said N2 gas changes a little according to the diameter of the wire 3, but 2-4l/min or thereabout is considered to be suitable. As the ball 3a is formed by blowing inert gas as above and by generating sparks in the gaseous atmosphere, the ball can be formed without inflicting the effect of the oxygen, vapor, dust, ozone and the like contained in the air, thereby enabling to improve the bondability and to prevent the contamination of the electric torch electrode 13 and the capillary 2.

Description

【発明の詳細な説明】 本発明はワイヤボンダにおけるワイヤの先端に放電して
ポールを形成する方法及びその装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method and apparatus for forming a pole by discharging at the tip of a wire in a wire bonder.

従来、ワイヤの先端にポールを形成して半導体のペレッ
トと外部リードとの間をワイヤで接続するワイヤボンダ
は、第１図に示すように図示しない高電圧印加発生器か
ら電気トーチ電極１に高電圧電流を流し、キャピラリ２
に挿通されてキャピラリ２の下端に突出したワイヤ３の
先端と前記電気トーチ電極１との間をスパークさせ、ポ
ール３ａを形成してワイヤポンディング作業を行ってい
る。なあ、４は電極ホルダーを示す。Conventionally, a wire bonder that forms a pole at the tip of a wire to connect a semiconductor pellet and an external lead with a wire applies a high voltage to an electric torch electrode 1 from a high voltage application generator (not shown) as shown in FIG. Apply current to capillary 2
A spark is created between the tip of the wire 3 inserted through the capillary 2 and protruding from the lower end of the capillary 2 and the electric torch electrode 1 to form a pole 3a to perform wire bonding work. By the way, 4 indicates the electrode holder.

ところで、前記ポール３ａ形成時にはワイヤ先端周辺の
Ａ部分の空気中に含まれている酸素、水蒸気、粉塵、オ
ゾン等の影響を受け、形成されたポール３ａの組成にこ
れらのものが溶は込み、ポール３ａが硬くなり、ボンダ
ビリティが悪くなるという欠点があった。また電気トー
チ電極１についても酸化被膜及び不純物の焼き付きが起
り、長時間の使用に支障をきたす。才たキャピラリ２に
ついても同様に先端ｌζ不純物の焼き付きが起り、汚れ
て良いワイヤボッディフグ作業ができなくなる。このた
め、電気トーチ電極ｌ及びキャピラリ２を一′定すイク
ル毎に交換することが必要であった。By the way, when the pole 3a is formed, it is affected by oxygen, water vapor, dust, ozone, etc. contained in the air in the area A around the tip of the wire, and these things dissolve into the composition of the formed pole 3a. There was a drawback that the pole 3a became hard and bondability deteriorated. Furthermore, the oxide film and impurities are baked into the electric torch electrode 1, which hinders its long-term use. In the case of the old capillary 2, the impurities at the tip lζ will be burned in the same way, and the wire body blowing operation will become dirty and impossible. Therefore, it was necessary to replace the electric torch electrode 1 and the capillary 2 at regular intervals.

本発明は上記従来技術の欠点に鑑みなされたもので、ボ
ノダビリテイの向上及び電気トーチ電極、キャピラリの
汚れを防止することができるワイヤボンダにおけるボー
ル形成方法及びその装置を提供することを目的とする。The present invention has been made in view of the above-mentioned drawbacks of the prior art, and it is an object of the present invention to provide a method and apparatus for forming a ball in a wire bonder, which can improve bondability and prevent contamination of electric torch electrodes and capillaries.

以下、本発明の一実施例を第２図により説明する。電極
ホルダー１０には導電性の剛体よりなるパイプ１１が固
定されている。パイプ１１にはキャピラリ２側の一端に
導電性のノズル１２が固定され、このノズル１２の下面
ｌこ電気トーチ電極１３が固定されている。またパイプ
１１の他端にはホースニップル１４を介して絶縁材より
なるチューブ１５の一端が連結されており、チューブ１
５の他端はＮ、ガス等の不活性ガスを送り込む送風器（
図示せず）に接続されている。図示しない電線ケーブル
はパイプ１１に接続されている。An embodiment of the present invention will be described below with reference to FIG. A pipe 11 made of a conductive rigid body is fixed to the electrode holder 10 . A conductive nozzle 12 is fixed to one end of the pipe 11 on the capillary 2 side, and an electric torch electrode 13 is fixed to the lower surface of this nozzle 12. Further, one end of a tube 15 made of an insulating material is connected to the other end of the pipe 11 via a hose nipple 14.
The other end of 5 is a blower (
(not shown). An electric wire cable (not shown) is connected to the pipe 11.

そこで、Ｎ、ガスをチューブ１５、パイプ１１を通して
ノズル１２からキャピラリ２と電気トーチ電極１３間に
常時、またはボール形成時ｌこ吹き出させ、電気トーチ
電極１３に高電圧電流を流し、ワイヤ３の先端と電気ト
ーチ電極１３間をスパークさせてボール３ａを形成させ
る。前記Ｎ２ガスの流量はワイヤ３の径によって若干変
るが、２〜４Ｌ紹ｎ＠度吹き出させる。Therefore, N gas is blown out from the nozzle 12 through the tube 15 and the pipe 11 between the capillary 2 and the electric torch electrode 13 at all times or when forming a ball, and a high voltage current is passed through the electric torch electrode 13. A spark is generated between the electric torch electrode 13 and the electric torch electrode 13 to form a ball 3a. The flow rate of the N2 gas varies slightly depending on the diameter of the wire 3, but 2 to 4 L is blown out.

このように、不活性ガスを吹き出し、このガス雰囲気中
でスパークさせてボール３ａを形成するので、空気中に
含まれている酸素、水蒸気、粉塵、オゾン等の影響を受
けることがなくボール３ａが形成され、ボノダビリテイ
が向上すると共に、電気トーチ電極１３及びキャピラリ
２の汚れが防止される。In this way, the ball 3a is formed by blowing out an inert gas and causing sparks in this gas atmosphere, so the ball 3a is not affected by oxygen, water vapor, dust, ozone, etc. contained in the air. This improves bondability and prevents the electric torch electrode 13 and capillary 2 from becoming contaminated.

なお、前記実施例においては、パイプ１１及びノズル１
２を導電材としたが、絶縁材でもよい。In addition, in the embodiment, the pipe 11 and the nozzle 1
Although 2 is made of a conductive material, an insulating material may be used.

この場合は高電圧印加発生器に接続する電線ケーブルを
直接電気トーチ電極１３に接続すればよい。In this case, the electric wire cable connected to the high voltage application generator may be directly connected to the electric torch electrode 13.

また電気トーチ電極１３はノズル１２に固定しなく、ノ
ズル１２より独立して配設してもよい。Further, the electric torch electrode 13 may not be fixed to the nozzle 12, but may be arranged independently from the nozzle 12.

以上の説明から明らかな如く、本発明によれば、不活性
ガス雰囲気中でボールを形成するので、ポノダビリテイ
の向上及び電気トーチ電極、キャピラリの汚れが防止さ
れる。As is clear from the above description, according to the present invention, since the balls are formed in an inert gas atmosphere, ponodability is improved and the electric torch electrode and capillary are prevented from becoming contaminated.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来例の概略正面図、第２図は本発明の一実施
例を示す断面図である。 ２・・・キャピラリ、　　　　３・・・ワイヤ、３ａ・
・・ボール、　　　　　１２・・・ノズル、１３・・・
電気トーチ電極。 第１図 第２図FIG. 1 is a schematic front view of a conventional example, and FIG. 2 is a sectional view showing an embodiment of the present invention. 2... Capillary, 3... Wire, 3a.
...Ball, 12...Nozzle, 13...
Electric torch electrode. Figure 1 Figure 2

Claims (3)

【特許請求の範囲】[Claims] （１）キャピラリの下端より伸びたワイヤの先端に電気
トーチ電極のスパークによりポールを形成するワイヤボ
ンダにおいて、ノズルから不活性ガスを吹き出し、この
ガス雰囲気中で前記ポールを形成するワイヤボンダにお
けるポール形成方法。(1) A method for forming a pole in a wire bonder in which a pole is formed at the tip of a wire extending from the lower end of a capillary by a spark from an electric torch electrode, and in which an inert gas is blown out from a nozzle and the pole is formed in this gas atmosphere. （２）キャピラリの下端より伸びたワイヤの先端に電気
トーチ電極のスパークによりポールを形成するワイヤボ
ンダにおいて、前記キャピラリと前記電気トーチ電極間
に不活性ガスを吹き出すノズルを配設してなるワイヤボ
ンダにおけるポール形成装置。(2) A pole in a wire bonder in which a pole is formed at the tip of a wire extending from the lower end of a capillary by a spark of an electric torch electrode, and a nozzle for blowing out an inert gas is disposed between the capillary and the electric torch electrode. Forming device. （３）電気トーチ電極はノズルに固定してなる特許請求
の範囲第２項記載のワイヤボンダにおけるポール形成装
置。(3) A pole forming device for a wire bonder according to claim 2, wherein the electric torch electrode is fixed to a nozzle.
JP57014230A 1982-01-29 1982-01-29 Method of ball formation for wire bonder and device thereof Pending JPS58131743A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57014230A JPS58131743A (en) 1982-01-29 1982-01-29 Method of ball formation for wire bonder and device thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57014230A JPS58131743A (en) 1982-01-29 1982-01-29 Method of ball formation for wire bonder and device thereof

Publications (1)

Publication Number Publication Date
JPS58131743A true JPS58131743A (en) 1983-08-05

Family

ID=11855265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57014230A Pending JPS58131743A (en) 1982-01-29 1982-01-29 Method of ball formation for wire bonder and device thereof

Country Status (1)

Country Link
JP (1) JPS58131743A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9825000B1 (en) * 2017-04-24 2017-11-21 International Test Solutions, Inc. Semiconductor wire bonding machine cleaning device and method
US9833818B2 (en) 2004-09-28 2017-12-05 International Test Solutions, Inc. Working surface cleaning system and method
US10195648B2 (en) 2009-12-03 2019-02-05 International Test Solutions, Inc. Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware
US10717618B2 (en) 2018-02-23 2020-07-21 International Test Solutions, Inc. Material and hardware to automatically clean flexible electronic web rolls
US10792713B1 (en) 2019-07-02 2020-10-06 International Test Solutions, Inc. Pick and place machine cleaning system and method
US11035898B1 (en) 2020-05-11 2021-06-15 International Test Solutions, Inc. Device and method for thermal stabilization of probe elements using a heat conducting wafer
US11211242B2 (en) 2019-11-14 2021-12-28 International Test Solutions, Llc System and method for cleaning contact elements and support hardware using functionalized surface microfeatures
US11318550B2 (en) 2019-11-14 2022-05-03 International Test Solutions, Llc System and method for cleaning wire bonding machines using functionalized surface microfeatures

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51147174A (en) * 1975-05-15 1976-12-17 Welding Inst Method and apparatus for connecting wires
JPS54160540A (en) * 1978-06-09 1979-12-19 Toshiba Corp Bonding of aluminium wire
JPS5789232A (en) * 1980-11-26 1982-06-03 Hitachi Ltd Forming device of spherical lump

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51147174A (en) * 1975-05-15 1976-12-17 Welding Inst Method and apparatus for connecting wires
JPS54160540A (en) * 1978-06-09 1979-12-19 Toshiba Corp Bonding of aluminium wire
JPS5789232A (en) * 1980-11-26 1982-06-03 Hitachi Ltd Forming device of spherical lump

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9833818B2 (en) 2004-09-28 2017-12-05 International Test Solutions, Inc. Working surface cleaning system and method
US10239099B2 (en) 2004-09-28 2019-03-26 International Test Solutions, Inc. Working surface cleaning system and method
US10406568B2 (en) 2004-09-28 2019-09-10 International Test Solutions, Inc. Working surface cleaning system and method
US10195648B2 (en) 2009-12-03 2019-02-05 International Test Solutions, Inc. Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware
US9825000B1 (en) * 2017-04-24 2017-11-21 International Test Solutions, Inc. Semiconductor wire bonding machine cleaning device and method
US10361169B2 (en) 2017-04-24 2019-07-23 International Test Solutions, Inc. Semiconductor wire bonding machine cleaning device and method
US10717618B2 (en) 2018-02-23 2020-07-21 International Test Solutions, Inc. Material and hardware to automatically clean flexible electronic web rolls
US10843885B2 (en) 2018-02-23 2020-11-24 International Test Solutions, Inc. Material and hardware to automatically clean flexible electronic web rolls
US11434095B2 (en) 2018-02-23 2022-09-06 International Test Solutions, Llc Material and hardware to automatically clean flexible electronic web rolls
US10792713B1 (en) 2019-07-02 2020-10-06 International Test Solutions, Inc. Pick and place machine cleaning system and method
US11211242B2 (en) 2019-11-14 2021-12-28 International Test Solutions, Llc System and method for cleaning contact elements and support hardware using functionalized surface microfeatures
US11318550B2 (en) 2019-11-14 2022-05-03 International Test Solutions, Llc System and method for cleaning wire bonding machines using functionalized surface microfeatures
US11035898B1 (en) 2020-05-11 2021-06-15 International Test Solutions, Inc. Device and method for thermal stabilization of probe elements using a heat conducting wafer

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