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JPS579871A - Vapor depositing method for metal - Google Patents

Vapor depositing method for metal

Info

Publication number
JPS579871A
JPS579871A JP8129380A JP8129380A JPS579871A JP S579871 A JPS579871 A JP S579871A JP 8129380 A JP8129380 A JP 8129380A JP 8129380 A JP8129380 A JP 8129380A JP S579871 A JPS579871 A JP S579871A
Authority
JP
Japan
Prior art keywords
metal
pipe
vapor deposition
deposited
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8129380A
Other languages
Japanese (ja)
Inventor
Masataka Koyama
Haruo Tanmachi
Minoru Terajima
Toshiaki Naka
Kiyoshi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP8129380A priority Critical patent/JPS579871A/en
Publication of JPS579871A publication Critical patent/JPS579871A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To prevent the formation of deposited particles in the vapor deposition of a metal by using a ceramic pipe coated with a high m.p. metal as a resistance heating element. CONSTITUTION:A thin film 3 of a high m.p. metal such as Ta or W is formed on the surface of a high m.p. ceramic pipe 2, and a heating rod 4 made of W is inserted in the pipe 2 to form a heating element 1. After winding a metallic wire 5 for vapor deposition around the element 1, the element 1 is set in a vacuum vessel, and the rod 4 is electrically conducted to generate heat, whereby the metal 5 is heated through the pipe 2 and evaporated. Thus, the desired metal is vapor-deposited on products placed in the vessel. By this method, the occurrence of rejects due to depositied particles is prevented thoroughly, and the yield in the manufacture of hybrid IC, etc. is enhanced.
JP8129380A 1980-06-18 1980-06-18 Vapor depositing method for metal Pending JPS579871A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8129380A JPS579871A (en) 1980-06-18 1980-06-18 Vapor depositing method for metal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8129380A JPS579871A (en) 1980-06-18 1980-06-18 Vapor depositing method for metal

Publications (1)

Publication Number Publication Date
JPS579871A true JPS579871A (en) 1982-01-19

Family

ID=13742327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8129380A Pending JPS579871A (en) 1980-06-18 1980-06-18 Vapor depositing method for metal

Country Status (1)

Country Link
JP (1) JPS579871A (en)

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