JPS5787973A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS5787973A JPS5787973A JP16408680A JP16408680A JPS5787973A JP S5787973 A JPS5787973 A JP S5787973A JP 16408680 A JP16408680 A JP 16408680A JP 16408680 A JP16408680 A JP 16408680A JP S5787973 A JPS5787973 A JP S5787973A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- thermal head
- heating body
- etching
- photoregist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Abstract
PURPOSE:To obtain a thermal head which is excellent in a printing quality, high in reliability, and can be reduced in a manufacturing cost, by a method wherein a taper is formed on a lead part in the proximity of a heater. CONSTITUTION:A heating body 5 made of tantalum nitride or the like is formed on an alumina substrate 6, whereon a glaze layer 7 is partially formed, by a spattering to obtain a desired pattern by a hot etching. A film, in which 4% Cu is doped at Al, is vacuum-evaporated on the pattern, and after a regist pattern is formed by means of a photoregist method, the work is treated by an etching to form a lead electrode 4 being tapered. This improves the adhesion of a heat sensitive sheet 1 to the heating body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16408680A JPS5787973A (en) | 1980-11-21 | 1980-11-21 | Thermal head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16408680A JPS5787973A (en) | 1980-11-21 | 1980-11-21 | Thermal head |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5787973A true JPS5787973A (en) | 1982-06-01 |
Family
ID=15786504
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16408680A Pending JPS5787973A (en) | 1980-11-21 | 1980-11-21 | Thermal head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5787973A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60165265A (en) * | 1984-02-07 | 1985-08-28 | Oki Electric Ind Co Ltd | thermal head |
JPS6430769A (en) * | 1987-07-28 | 1989-02-01 | Toshiba Corp | Thermal head |
WO1996013389A1 (en) * | 1994-10-31 | 1996-05-09 | Seiko Instruments Inc. | Thermal head and method of manufacturing same |
JP2004320002A (en) * | 2003-03-31 | 2004-11-11 | Canon Inc | Method of manufacturing circuit board, circuit board, and liquid discharging device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5151339A (en) * | 1974-10-31 | 1976-05-06 | Tokyo Shibaura Electric Co | |
JPS5511850A (en) * | 1978-07-11 | 1980-01-28 | Mitsubishi Electric Corp | Thermal head |
-
1980
- 1980-11-21 JP JP16408680A patent/JPS5787973A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5151339A (en) * | 1974-10-31 | 1976-05-06 | Tokyo Shibaura Electric Co | |
JPS5511850A (en) * | 1978-07-11 | 1980-01-28 | Mitsubishi Electric Corp | Thermal head |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60165265A (en) * | 1984-02-07 | 1985-08-28 | Oki Electric Ind Co Ltd | thermal head |
JPS6430769A (en) * | 1987-07-28 | 1989-02-01 | Toshiba Corp | Thermal head |
WO1996013389A1 (en) * | 1994-10-31 | 1996-05-09 | Seiko Instruments Inc. | Thermal head and method of manufacturing same |
JP2004320002A (en) * | 2003-03-31 | 2004-11-11 | Canon Inc | Method of manufacturing circuit board, circuit board, and liquid discharging device |
JP4587443B2 (en) * | 2003-03-31 | 2010-11-24 | キヤノン株式会社 | Circuit board manufacturing method |
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