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JPS5757711A - Resin composition for low-pressure molding - Google Patents

Resin composition for low-pressure molding

Info

Publication number
JPS5757711A
JPS5757711A JP13491880A JP13491880A JPS5757711A JP S5757711 A JPS5757711 A JP S5757711A JP 13491880 A JP13491880 A JP 13491880A JP 13491880 A JP13491880 A JP 13491880A JP S5757711 A JPS5757711 A JP S5757711A
Authority
JP
Japan
Prior art keywords
resin composition
vinylphenol
poly
low
pressure molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13491880A
Other languages
Japanese (ja)
Inventor
Shigeru Kushibe
Takashi Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RISHIYOU KOGYO KK
Risho Kogyo Co Ltd
Original Assignee
RISHIYOU KOGYO KK
Risho Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RISHIYOU KOGYO KK, Risho Kogyo Co Ltd filed Critical RISHIYOU KOGYO KK
Priority to JP13491880A priority Critical patent/JPS5757711A/en
Publication of JPS5757711A publication Critical patent/JPS5757711A/en
Pending legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: Titled epoxy resin composition capable of providing cured products excellent in heat resistance, water resistance and dimensional stability, containing a combination of novolak phenol and poly-p-vinylphenol as a curing agent.
CONSTITUTION: To an epoxy resin is added about 0.6W1.3 equivalent, perequivalent epoxy, of novolak phenol, MW about 128W1,300, and poly-p-vinylphenol, MW about 3,000W12,000, hydroxyl equivalent weight about 120. Here, the novolak to poly-p-vinylphenol ratio is preferably about (2W55):(98W45) by weight.
COPYRIGHT: (C)1982,JPO&Japio
JP13491880A 1980-09-22 1980-09-22 Resin composition for low-pressure molding Pending JPS5757711A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13491880A JPS5757711A (en) 1980-09-22 1980-09-22 Resin composition for low-pressure molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13491880A JPS5757711A (en) 1980-09-22 1980-09-22 Resin composition for low-pressure molding

Publications (1)

Publication Number Publication Date
JPS5757711A true JPS5757711A (en) 1982-04-07

Family

ID=15139572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13491880A Pending JPS5757711A (en) 1980-09-22 1980-09-22 Resin composition for low-pressure molding

Country Status (1)

Country Link
JP (1) JPS5757711A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4866133A (en) * 1986-09-24 1989-09-12 Ciba-Geigy Corporation Solid solutions of polymeric phenols and polyamines as epoxy curing agents

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4866133A (en) * 1986-09-24 1989-09-12 Ciba-Geigy Corporation Solid solutions of polymeric phenols and polyamines as epoxy curing agents

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