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JPS5456653A - Resin composition - Google Patents

Resin composition

Info

Publication number
JPS5456653A
JPS5456653A JP12317477A JP12317477A JPS5456653A JP S5456653 A JPS5456653 A JP S5456653A JP 12317477 A JP12317477 A JP 12317477A JP 12317477 A JP12317477 A JP 12317477A JP S5456653 A JPS5456653 A JP S5456653A
Authority
JP
Japan
Prior art keywords
resin
hydroxyl group
resin composition
epoxy
cyclohexane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12317477A
Other languages
Japanese (ja)
Other versions
JPS5530729B2 (en
Inventor
Masayoshi Maeda
Kazuyoshi Yamagishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP12317477A priority Critical patent/JPS5456653A/en
Publication of JPS5456653A publication Critical patent/JPS5456653A/en
Publication of JPS5530729B2 publication Critical patent/JPS5530729B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: An epoxy resin composition especially suitable for the production of a copper-clad laminate, consisting of a resin having a phenolic hydroxyl group in a molecule and an epoxy resin derived from xylylenediamine or bis-aminomethyl- cyclohexane.
CONSTITUTION: A resin composition consisting of (A) a resin having a phenolic hydroxyl group in a molecule and (B) an epoxy resin obtained by the reaction of xylylenediamime or bis-amino methyl-cyclohexane with an epihalohydrin or β- methylepihalohydrin. The resin A is blended with the rsin B in amounts to give 0.15W7.0moles of epoxy groups in the resin B per eqnivalent weight of hydroxyl group in the resin A. A condensation product of α.α-dimethoxy-p-xylene and a phenol, an aromatic hydrocarbon formaldehyde resin modified by phenol, etc. may be cited as the resin A
COPYRIGHT: (C)1979,JPO&Japio
JP12317477A 1977-10-14 1977-10-14 Resin composition Granted JPS5456653A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12317477A JPS5456653A (en) 1977-10-14 1977-10-14 Resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12317477A JPS5456653A (en) 1977-10-14 1977-10-14 Resin composition

Publications (2)

Publication Number Publication Date
JPS5456653A true JPS5456653A (en) 1979-05-07
JPS5530729B2 JPS5530729B2 (en) 1980-08-13

Family

ID=14854008

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12317477A Granted JPS5456653A (en) 1977-10-14 1977-10-14 Resin composition

Country Status (1)

Country Link
JP (1) JPS5456653A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS598718A (en) * 1982-07-08 1984-01-18 Sumitomo Bakelite Co Ltd Epoxy resin composition
JPS6327575A (en) * 1986-07-22 1988-02-05 Nok Corp Curing adhesive blend and bonding procedure using same
JP2008156493A (en) * 2006-12-25 2008-07-10 Sumitomo Bakelite Co Ltd Resin composition, prepreg and laminated board

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58116154U (en) * 1982-01-29 1983-08-08 マツダ株式会社 Molten metal distribution supply device for casting

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4993494A (en) * 1972-11-01 1974-09-05
JPS501373A (en) * 1973-05-10 1975-01-08

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4993494A (en) * 1972-11-01 1974-09-05
JPS501373A (en) * 1973-05-10 1975-01-08

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS598718A (en) * 1982-07-08 1984-01-18 Sumitomo Bakelite Co Ltd Epoxy resin composition
JPS6248974B2 (en) * 1982-07-08 1987-10-16 Sumitomo Bakelite Co
JPS6327575A (en) * 1986-07-22 1988-02-05 Nok Corp Curing adhesive blend and bonding procedure using same
JP2008156493A (en) * 2006-12-25 2008-07-10 Sumitomo Bakelite Co Ltd Resin composition, prepreg and laminated board

Also Published As

Publication number Publication date
JPS5530729B2 (en) 1980-08-13

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