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JPS57195151A - Low-radioactive resin composition - Google Patents

Low-radioactive resin composition

Info

Publication number
JPS57195151A
JPS57195151A JP56079282A JP7928281A JPS57195151A JP S57195151 A JPS57195151 A JP S57195151A JP 56079282 A JP56079282 A JP 56079282A JP 7928281 A JP7928281 A JP 7928281A JP S57195151 A JPS57195151 A JP S57195151A
Authority
JP
Japan
Prior art keywords
coating
uranium
silica powder
fine silica
polymeric material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56079282A
Other languages
Japanese (ja)
Other versions
JPS644540B2 (en
Inventor
Masaji Ishii
Masashi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Priority to JP56079282A priority Critical patent/JPS57195151A/en
Publication of JPS57195151A publication Critical patent/JPS57195151A/en
Publication of JPS644540B2 publication Critical patent/JPS644540B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: The titled composition, prepared by incorporating fine silica powder with a very low content of an α-ray radioactive substance, e.g. uranium, in a high polymeric material, having improved heat resistance and heat conductivity, and particularly useful as packaging materials or coating materials.
CONSTITUTION: A composition prepared by kneading a high polymeric material, e.g. an epoxy resin or silicone resin, with 30W90wt% fine silica powder with a content of uranium and/or thorium ≤10ppb respectively having a particle diameter of 1W200μm as an inorganic filler. The resultant composition used as a packaging material eliminates the necessity for designing a capacitor for the electric charge accumulating of the MOSRAM having a large surface area, and the integration density can be increased. The coating with the general coating material becomes easy, and the moisture resistance is improved.
COPYRIGHT: (C)1982,JPO&Japio
JP56079282A 1981-05-27 1981-05-27 Low-radioactive resin composition Granted JPS57195151A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56079282A JPS57195151A (en) 1981-05-27 1981-05-27 Low-radioactive resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56079282A JPS57195151A (en) 1981-05-27 1981-05-27 Low-radioactive resin composition

Publications (2)

Publication Number Publication Date
JPS57195151A true JPS57195151A (en) 1982-11-30
JPS644540B2 JPS644540B2 (en) 1989-01-26

Family

ID=13685503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56079282A Granted JPS57195151A (en) 1981-05-27 1981-05-27 Low-radioactive resin composition

Country Status (1)

Country Link
JP (1) JPS57195151A (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56135510A (en) * 1980-03-26 1981-10-23 Japan Atom Energy Res Inst Halogenated acenaphthylene polymer and flame-retarding and radiation resistance-imparting agent therefrom
JPS5863152A (en) * 1981-10-09 1983-04-14 Fujikura Ltd Material for sealing semiconductor element
JPS58102546A (en) * 1981-12-14 1983-06-18 Mitsubishi Electric Corp Resin sealed semiconductor device
JPS58127354A (en) * 1982-01-25 1983-07-29 Shin Etsu Chem Co Ltd Semiconductor element sealing resin composition material
JPS59221352A (en) * 1983-05-31 1984-12-12 Sumitomo Bakelite Co Ltd Epoxy resin composition having low radioactivity
JPS6047032A (en) * 1983-08-24 1985-03-14 Oki Electric Ind Co Ltd Production of tablet
JPS60180911A (en) * 1984-02-27 1985-09-14 Nippon Chem Ind Co Ltd:The High purity silica and its manufacturing method
JPS60191016A (en) * 1984-03-12 1985-09-28 Nippon Chem Ind Co Ltd:The High-purity silica and its manufacture
JPS6117416A (en) * 1984-07-03 1986-01-25 Nippon Chem Ind Co Ltd:The High-purity silica and its preparation
JPS6140811A (en) * 1984-07-31 1986-02-27 Nippon Chem Ind Co Ltd:The Hydrated silica for melting and manufacture of melted silica by using it
JPS6148421A (en) * 1984-08-17 1986-03-10 Nippon Chem Ind Co Ltd:The High purity silica and its manufacturing method
JPS6148422A (en) * 1984-08-17 1986-03-10 Nippon Chem Ind Co Ltd:The High purity silica and its manufacturing method
JPS61190556A (en) * 1985-02-12 1986-08-25 Rishiyou Kogyo Kk Resin composition for sealing of electronic part
JPS6212609A (en) * 1985-07-11 1987-01-21 Nippon Chem Ind Co Ltd:The Modified fused spherical silica and production thereof
JPH0214807A (en) * 1989-05-24 1990-01-18 Nippon Chem Ind Co Ltd Modified fused spherical silica and production thereof
JPH0259416A (en) * 1988-08-25 1990-02-28 Nippon Chem Ind Co Ltd Fine fused spherical silica and its manufacturing method
JP2009215329A (en) * 2008-03-06 2009-09-24 Denki Kagaku Kogyo Kk Energy ray-curable resin composition, adhesive using the same, and cured form

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS515325A (en) * 1974-07-04 1976-01-17 Nippon Denshi Kinzoku Kk GOSEISEKIEIGARASUNO SEIZOHO
JPS5177612A (en) * 1974-12-28 1976-07-06 Toshiba Ceramics Co CHOKOJUNDOSEKIEIGARASUSEIHINNO SEIZOHOHO
JPS521720A (en) * 1975-06-19 1977-01-07 Commissariat Energie Atomique Thermallyyinsulating means for concrete containers prestressed against volatilefluid contents
JPS54141569A (en) * 1978-04-26 1979-11-02 Toshiba Corp Semiconductor device
JPS554952A (en) * 1978-06-28 1980-01-14 Toshiba Corp Semiconductor device
JPS5522816A (en) * 1978-08-04 1980-02-18 Hitachi Ltd Resin sealed electronic parts
JPS5529532A (en) * 1978-08-23 1980-03-01 Toshiba Corp Epoxy resin composition
JPS55118952A (en) * 1979-03-06 1980-09-12 Nitto Electric Ind Co Ltd Epoxy resin composition for sealing semiconductor
JPS55128850A (en) * 1979-03-28 1980-10-06 Hitachi Ltd Semiconductor device
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition
JPS5645053A (en) * 1979-09-21 1981-04-24 Hitachi Ltd Semiconductor device
JPS5659837A (en) * 1979-09-28 1981-05-23 Hitachi Chem Co Ltd Epoxy resin composition
JPS5698845A (en) * 1980-01-09 1981-08-08 Hitachi Ltd Semiconductor memory device
JPS56116647A (en) * 1980-02-20 1981-09-12 Hitachi Ltd Manufacturing of silica-alumina type filler for semiconductor memory element covering resin
JPS57187956A (en) * 1981-05-07 1982-11-18 Siemens Ag Electric insulating sealer for semiconductor device

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS515325A (en) * 1974-07-04 1976-01-17 Nippon Denshi Kinzoku Kk GOSEISEKIEIGARASUNO SEIZOHO
JPS5177612A (en) * 1974-12-28 1976-07-06 Toshiba Ceramics Co CHOKOJUNDOSEKIEIGARASUSEIHINNO SEIZOHOHO
JPS521720A (en) * 1975-06-19 1977-01-07 Commissariat Energie Atomique Thermallyyinsulating means for concrete containers prestressed against volatilefluid contents
JPS54141569A (en) * 1978-04-26 1979-11-02 Toshiba Corp Semiconductor device
JPS554952A (en) * 1978-06-28 1980-01-14 Toshiba Corp Semiconductor device
JPS5522816A (en) * 1978-08-04 1980-02-18 Hitachi Ltd Resin sealed electronic parts
JPS5529532A (en) * 1978-08-23 1980-03-01 Toshiba Corp Epoxy resin composition
JPS55118952A (en) * 1979-03-06 1980-09-12 Nitto Electric Ind Co Ltd Epoxy resin composition for sealing semiconductor
JPS55128850A (en) * 1979-03-28 1980-10-06 Hitachi Ltd Semiconductor device
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition
JPS5645053A (en) * 1979-09-21 1981-04-24 Hitachi Ltd Semiconductor device
JPS5659837A (en) * 1979-09-28 1981-05-23 Hitachi Chem Co Ltd Epoxy resin composition
JPS5698845A (en) * 1980-01-09 1981-08-08 Hitachi Ltd Semiconductor memory device
JPS56116647A (en) * 1980-02-20 1981-09-12 Hitachi Ltd Manufacturing of silica-alumina type filler for semiconductor memory element covering resin
JPS57187956A (en) * 1981-05-07 1982-11-18 Siemens Ag Electric insulating sealer for semiconductor device

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS626565B2 (en) * 1980-03-26 1987-02-12 Japan Atomic Energy Res Inst
JPS56135510A (en) * 1980-03-26 1981-10-23 Japan Atom Energy Res Inst Halogenated acenaphthylene polymer and flame-retarding and radiation resistance-imparting agent therefrom
JPS5863152A (en) * 1981-10-09 1983-04-14 Fujikura Ltd Material for sealing semiconductor element
JPS58102546A (en) * 1981-12-14 1983-06-18 Mitsubishi Electric Corp Resin sealed semiconductor device
JPS58127354A (en) * 1982-01-25 1983-07-29 Shin Etsu Chem Co Ltd Semiconductor element sealing resin composition material
JPS59221352A (en) * 1983-05-31 1984-12-12 Sumitomo Bakelite Co Ltd Epoxy resin composition having low radioactivity
JPS6047032A (en) * 1983-08-24 1985-03-14 Oki Electric Ind Co Ltd Production of tablet
JPS60180911A (en) * 1984-02-27 1985-09-14 Nippon Chem Ind Co Ltd:The High purity silica and its manufacturing method
JPH0121091B2 (en) * 1984-02-27 1989-04-19 Nippon Chemical Ind
JPS60191016A (en) * 1984-03-12 1985-09-28 Nippon Chem Ind Co Ltd:The High-purity silica and its manufacture
JPH05339B2 (en) * 1984-03-12 1993-01-05 Nippon Chemical Ind
JPS6117416A (en) * 1984-07-03 1986-01-25 Nippon Chem Ind Co Ltd:The High-purity silica and its preparation
JPH0121093B2 (en) * 1984-07-03 1989-04-19 Nippon Chemical Ind
JPS6140811A (en) * 1984-07-31 1986-02-27 Nippon Chem Ind Co Ltd:The Hydrated silica for melting and manufacture of melted silica by using it
JPH0127003B2 (en) * 1984-07-31 1989-05-26 Nippon Chemical Ind
JPH0121092B2 (en) * 1984-08-17 1989-04-19 Nippon Chemical Ind
JPS6148421A (en) * 1984-08-17 1986-03-10 Nippon Chem Ind Co Ltd:The High purity silica and its manufacturing method
JPH0124729B2 (en) * 1984-08-17 1989-05-12 Nippon Chemical Ind
JPS6148422A (en) * 1984-08-17 1986-03-10 Nippon Chem Ind Co Ltd:The High purity silica and its manufacturing method
JPS61190556A (en) * 1985-02-12 1986-08-25 Rishiyou Kogyo Kk Resin composition for sealing of electronic part
JPS635429B2 (en) * 1985-02-12 1988-02-03 Risho Kogyo Kk
JPS6212609A (en) * 1985-07-11 1987-01-21 Nippon Chem Ind Co Ltd:The Modified fused spherical silica and production thereof
JPH022804B2 (en) * 1985-07-11 1990-01-19 Nippon Chemical Ind
JPH0259416A (en) * 1988-08-25 1990-02-28 Nippon Chem Ind Co Ltd Fine fused spherical silica and its manufacturing method
JPH0696445B2 (en) * 1988-08-25 1994-11-30 日本化学工業株式会社 Fine fused spherical silica and method for producing the same
JPH0214807A (en) * 1989-05-24 1990-01-18 Nippon Chem Ind Co Ltd Modified fused spherical silica and production thereof
JPH0694369B2 (en) * 1989-05-24 1994-11-24 日本化学工業株式会社 Modified fused spherical silica and method for producing the same
JP2009215329A (en) * 2008-03-06 2009-09-24 Denki Kagaku Kogyo Kk Energy ray-curable resin composition, adhesive using the same, and cured form

Also Published As

Publication number Publication date
JPS644540B2 (en) 1989-01-26

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