JPS57188664A - Electroless plating method for insulation substrate - Google Patents
Electroless plating method for insulation substrateInfo
- Publication number
- JPS57188664A JPS57188664A JP7405881A JP7405881A JPS57188664A JP S57188664 A JPS57188664 A JP S57188664A JP 7405881 A JP7405881 A JP 7405881A JP 7405881 A JP7405881 A JP 7405881A JP S57188664 A JPS57188664 A JP S57188664A
- Authority
- JP
- Japan
- Prior art keywords
- electroless plating
- patterns
- insulation substrate
- soln
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Surface Treatment Of Glass (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE: To form patterns by electroless plating films having high adhesive power by forming the patterns of an underlying metal and a metallic oxide film on an insulation substrate, immersing this in a plating soln. of a specific compsn. contg. a Pd compd. to allow Pd to deposit then subjecting the same to electroless plating.
CONSTITUTION: After an insulation substrate such as heat resistant glass, plastics or the like is degreased and cleaned with an alkali or the like, it is formed thereon with patterns of a metal such as Cu, Sn or In or their oxide film by a photoresist method or the like. This is immersed in a soln. prepd. by dissolving a metal such as Fe, Zn or the like of a larger ionization tendency than that of hydrogen in hydrochloric acid and is oscillated for a certain period so that the Pd is deposited on the pattern. This is immersed in an electroless plating soln. of Ni, Cu, etc., whereby the electroless plating film of Ni or Cu having high adhesive power is formed on the Pd patterns.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7405881A JPS6021226B2 (en) | 1981-05-16 | 1981-05-16 | Electroless plating method for insulating substrates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7405881A JPS6021226B2 (en) | 1981-05-16 | 1981-05-16 | Electroless plating method for insulating substrates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57188664A true JPS57188664A (en) | 1982-11-19 |
| JPS6021226B2 JPS6021226B2 (en) | 1985-05-25 |
Family
ID=13536205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7405881A Expired JPS6021226B2 (en) | 1981-05-16 | 1981-05-16 | Electroless plating method for insulating substrates |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6021226B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6886922B2 (en) * | 2002-06-27 | 2005-05-03 | Matsushita Electric Industrial Co., Ltd. | Liquid discharge head and manufacturing method thereof |
| CN115110071A (en) * | 2022-07-29 | 2022-09-27 | 电子科技大学 | Pretreatment method for chemical plating of insulating substrate and chemical plating method |
-
1981
- 1981-05-16 JP JP7405881A patent/JPS6021226B2/en not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6886922B2 (en) * | 2002-06-27 | 2005-05-03 | Matsushita Electric Industrial Co., Ltd. | Liquid discharge head and manufacturing method thereof |
| CN1308146C (en) * | 2002-06-27 | 2007-04-04 | 松下电器产业株式会社 | Liquid spraying nozzle and producing method thereof |
| CN115110071A (en) * | 2022-07-29 | 2022-09-27 | 电子科技大学 | Pretreatment method for chemical plating of insulating substrate and chemical plating method |
| CN115110071B (en) * | 2022-07-29 | 2023-09-01 | 电子科技大学 | Electroless plating pretreatment method and electroless plating method for insulating substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6021226B2 (en) | 1985-05-25 |
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