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JPS5484835A - Surface treatment of al and al alloy for soldering - Google Patents

Surface treatment of al and al alloy for soldering

Info

Publication number
JPS5484835A
JPS5484835A JP15171077A JP15171077A JPS5484835A JP S5484835 A JPS5484835 A JP S5484835A JP 15171077 A JP15171077 A JP 15171077A JP 15171077 A JP15171077 A JP 15171077A JP S5484835 A JPS5484835 A JP S5484835A
Authority
JP
Japan
Prior art keywords
water
washed
plating
sec
treated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15171077A
Other languages
Japanese (ja)
Other versions
JPS6015706B2 (en
Inventor
Yuzo Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP52151710A priority Critical patent/JPS6015706B2/en
Publication of JPS5484835A publication Critical patent/JPS5484835A/en
Publication of JPS6015706B2 publication Critical patent/JPS6015706B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C23C2/024—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by cleaning or etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C23C2/026—Deposition of sublayers, e.g. adhesion layers or pre-applied alloying elements or corrosion protection

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

PURPOSE:To raise adhesion, corrosion resistance, and solderability by the procedure in which a pretreatment for plating is made, then Zn-replacement is made, then a nickel-phosphorus alloy plating is applied, and then a solderable copper plating is made. CONSTITUTION:In the first place, a part to be treated is cleansed with Trichlene, etched with 5% caustic soda at 40 deg.C for 10 sec., and then washed with water. Then, it is treated for smut removal with nitric acid at ordinary temperature for approx. 30 sec., and then dipped, after sufficient water washing, in a Zn-replacement solution at 15 to 25 deg.C for 1 min. to form Zn film and then washed with water. Then, it is treated with nitric acid for the removal of Zn film at ordinary temperature for 30 sec. and then washed with water and subsequently dipped in a solution containing 30 g/l nickel nitrate, 15 g/l sodium hypophosphite, and 10 g/l sodium citrate at 90 deg.C for 5 min. to form Ni film approx. 0.5 microns in thick with P crystals. Afterwards, it is washed with water and then coated with solderable Cu plating. Thus, the enhancement of adhesion, corrosion resistance, and solderability can be attained.
JP52151710A 1977-12-19 1977-12-19 Surface treatment method of Al and Al alloy for soldering Expired JPS6015706B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52151710A JPS6015706B2 (en) 1977-12-19 1977-12-19 Surface treatment method of Al and Al alloy for soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52151710A JPS6015706B2 (en) 1977-12-19 1977-12-19 Surface treatment method of Al and Al alloy for soldering

Publications (2)

Publication Number Publication Date
JPS5484835A true JPS5484835A (en) 1979-07-06
JPS6015706B2 JPS6015706B2 (en) 1985-04-20

Family

ID=15524569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52151710A Expired JPS6015706B2 (en) 1977-12-19 1977-12-19 Surface treatment method of Al and Al alloy for soldering

Country Status (1)

Country Link
JP (1) JPS6015706B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58187260A (en) * 1982-04-26 1983-11-01 Mitsubishi Electric Corp Solder sticking method to aluminum metal
EP0153369A1 (en) * 1983-08-22 1985-09-04 Enthone Electroless nickel plating of aluminum.
JPH01201484A (en) * 1987-10-06 1989-08-14 Hitachi Ltd Chemical nickel plating liquid and method of using said liquid
CN102226283A (en) * 2011-05-18 2011-10-26 王定志 Surface treatment method of spray gun
JP2015010233A (en) * 2013-06-26 2015-01-19 富士電機機器制御株式会社 Aluminum conductor for energization
CN105803432A (en) * 2016-03-15 2016-07-27 国网安徽省电力公司电力科学研究院 Preparation method for Cu/Al composite board with Ni-P alloy layer as interfacial barrier layer

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58187260A (en) * 1982-04-26 1983-11-01 Mitsubishi Electric Corp Solder sticking method to aluminum metal
EP0153369A1 (en) * 1983-08-22 1985-09-04 Enthone Electroless nickel plating of aluminum.
JPH01201484A (en) * 1987-10-06 1989-08-14 Hitachi Ltd Chemical nickel plating liquid and method of using said liquid
CN102226283A (en) * 2011-05-18 2011-10-26 王定志 Surface treatment method of spray gun
JP2015010233A (en) * 2013-06-26 2015-01-19 富士電機機器制御株式会社 Aluminum conductor for energization
CN105803432A (en) * 2016-03-15 2016-07-27 国网安徽省电力公司电力科学研究院 Preparation method for Cu/Al composite board with Ni-P alloy layer as interfacial barrier layer

Also Published As

Publication number Publication date
JPS6015706B2 (en) 1985-04-20

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