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JPS57182461A - Heat dissipating substrate - Google Patents

Heat dissipating substrate

Info

Publication number
JPS57182461A
JPS57182461A JP6815281A JP6815281A JPS57182461A JP S57182461 A JPS57182461 A JP S57182461A JP 6815281 A JP6815281 A JP 6815281A JP 6815281 A JP6815281 A JP 6815281A JP S57182461 A JPS57182461 A JP S57182461A
Authority
JP
Japan
Prior art keywords
thin plate
ceramic thin
dissipating substrate
glue
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6815281A
Other languages
Japanese (ja)
Inventor
Nobuyuki Mizunoya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP6815281A priority Critical patent/JPS57182461A/en
Publication of JPS57182461A publication Critical patent/JPS57182461A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/375—Protection arrangements against overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate

Landscapes

  • Electronic Switches (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To efficiently dissipate heat produced by a heating element and at the same time to avoid deformation of the ceramic thin plate by attaching the metal plate to the undersurface of the ceramic thin plate for a dissipating substrate for the thermal head. CONSTITUTION:A dissipating substrate for thermal head is constituted with metal plate 8 made up of good heat conductive materials such as alumina glue and silica glue, and where a thermal resistant layer is formed on its top surface. As materials for the metal plate and glue have higher heat conductivity than the ceramic thin plate, the quantity of in-flowing heat of the ceramic thin plate dissipates efficiently into the atmosphere after flowing in, and the rise of temperature of the ceramic thin plate is supressed. Consequently, the thermal deformation of ceramic thin plate is reduced.
JP6815281A 1981-05-08 1981-05-08 Heat dissipating substrate Pending JPS57182461A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6815281A JPS57182461A (en) 1981-05-08 1981-05-08 Heat dissipating substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6815281A JPS57182461A (en) 1981-05-08 1981-05-08 Heat dissipating substrate

Publications (1)

Publication Number Publication Date
JPS57182461A true JPS57182461A (en) 1982-11-10

Family

ID=13365477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6815281A Pending JPS57182461A (en) 1981-05-08 1981-05-08 Heat dissipating substrate

Country Status (1)

Country Link
JP (1) JPS57182461A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60133690U (en) * 1984-02-15 1985-09-06 三菱電線工業株式会社 Substrate for electronic components
JPS60134631U (en) * 1984-02-17 1985-09-07 ロ−ム株式会社 thermal print head
JPS60152440U (en) * 1984-03-21 1985-10-11 ロ−ム株式会社 thermal print head
WO1989007049A1 (en) * 1988-01-28 1989-08-10 Eastman Kodak Company Improving image contrast by thermal printers

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60133690U (en) * 1984-02-15 1985-09-06 三菱電線工業株式会社 Substrate for electronic components
JPS60134631U (en) * 1984-02-17 1985-09-07 ロ−ム株式会社 thermal print head
JPS60152440U (en) * 1984-03-21 1985-10-11 ロ−ム株式会社 thermal print head
WO1989007049A1 (en) * 1988-01-28 1989-08-10 Eastman Kodak Company Improving image contrast by thermal printers

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