JPS57180633A - Curable polyimide resin composition - Google Patents
Curable polyimide resin compositionInfo
- Publication number
- JPS57180633A JPS57180633A JP6417981A JP6417981A JPS57180633A JP S57180633 A JPS57180633 A JP S57180633A JP 6417981 A JP6417981 A JP 6417981A JP 6417981 A JP6417981 A JP 6417981A JP S57180633 A JPS57180633 A JP S57180633A
- Authority
- JP
- Japan
- Prior art keywords
- polyimide
- curable
- acid
- resin composition
- polyamide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001721 polyimide Polymers 0.000 title abstract 7
- 239000000203 mixture Substances 0.000 title abstract 3
- 239000009719 polyimide resin Substances 0.000 title abstract 3
- 239000004642 Polyimide Substances 0.000 abstract 4
- 239000002253 acid Substances 0.000 abstract 3
- 239000002904 solvent Substances 0.000 abstract 3
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 abstract 1
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 abstract 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 abstract 1
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 230000018044 dehydration Effects 0.000 abstract 1
- 238000006297 dehydration reaction Methods 0.000 abstract 1
- 150000004985 diamines Chemical class 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 229940018564 m-phenylenediamine Drugs 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 abstract 1
- 239000005011 phenolic resin Substances 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 239000011253 protective coating Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- -1 tetracarboxylic acid dianhydride Chemical class 0.000 abstract 1
Landscapes
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
PURPOSE: A curable polyimide resin composition having excellent solvent resistance and low moisture absorption and being suitable as a protective coating material for semiconductor devices, prepared by mixing a polyimide or a polyamide-acid with a curable resin.
CONSTITUTION: An organic tetracarboxylic acid dianhydride (e.g., pyromellitic dianhydride, benzophenonetetracarboxylic dianhydride) is reacted with an organic diamine (e.g., m-phenylenediamine, 1,5-diaminonaphthalene) to produce a polyamide-acid or the latter is further ring-closed by dehydration to form a polyimide. Then, the resulting polyimide or polyamide-acid is mixed with a curable resin (e.g., phenol resin, epoxy resin) to form the purpose curable polyimide resin composition. Thus, the polyimide skeleton which is poor in solvent resistance is fixed in a three-dimensional network, and its solvent resistance is improved.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6417981A JPS57180633A (en) | 1981-04-30 | 1981-04-30 | Curable polyimide resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6417981A JPS57180633A (en) | 1981-04-30 | 1981-04-30 | Curable polyimide resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57180633A true JPS57180633A (en) | 1982-11-06 |
Family
ID=13250569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6417981A Pending JPS57180633A (en) | 1981-04-30 | 1981-04-30 | Curable polyimide resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57180633A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59168030A (en) * | 1983-03-15 | 1984-09-21 | Hitachi Chem Co Ltd | Production of thermoplastic polyether-imide |
| WO1984004102A1 (en) * | 1983-04-11 | 1984-10-25 | Hitachi Ltd | Fluorine-containing polyamic acids and polyimides |
| JPS6211727A (en) * | 1985-07-09 | 1987-01-20 | Ube Ind Ltd | Aromatic polyimide and composition thereof |
| US4952662A (en) * | 1988-02-12 | 1990-08-28 | Huels Aktiengaellscaft | Molding compounds comprising a thermoplastically processible, aromatic polyamide |
| CN111440440A (en) * | 2020-04-17 | 2020-07-24 | 华北电力大学 | Film applied to high-frequency transformer cladding insulation and preparation method thereof |
-
1981
- 1981-04-30 JP JP6417981A patent/JPS57180633A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59168030A (en) * | 1983-03-15 | 1984-09-21 | Hitachi Chem Co Ltd | Production of thermoplastic polyether-imide |
| JPH0433809B2 (en) * | 1983-03-15 | 1992-06-04 | Hitachi Chemical Co Ltd | |
| WO1984004102A1 (en) * | 1983-04-11 | 1984-10-25 | Hitachi Ltd | Fluorine-containing polyamic acids and polyimides |
| JPS6211727A (en) * | 1985-07-09 | 1987-01-20 | Ube Ind Ltd | Aromatic polyimide and composition thereof |
| JPH0374702B2 (en) * | 1985-07-09 | 1991-11-27 | ||
| US4952662A (en) * | 1988-02-12 | 1990-08-28 | Huels Aktiengaellscaft | Molding compounds comprising a thermoplastically processible, aromatic polyamide |
| CN111440440A (en) * | 2020-04-17 | 2020-07-24 | 华北电力大学 | Film applied to high-frequency transformer cladding insulation and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS559626A (en) | Epoxy resin composition | |
| JPS57180633A (en) | Curable polyimide resin composition | |
| JPS5536406A (en) | 3-methyl-5-succinic anhydrous-3-cyclohexene-1,2-dicarboxylic anhydride | |
| JPS54142298A (en) | Heat-resistant curable resin composition | |
| JPS51131526A (en) | Resin composition for use in powder coating | |
| JPS52108497A (en) | Preparation of polyimide resins | |
| JPS5573726A (en) | Heat-resistant resin composition | |
| JPS52108496A (en) | Preparation of polyimide resins | |
| JPS55165915A (en) | Thermosetting resin composition | |
| JPS57182316A (en) | Polyvinylphenol resin composition | |
| JPS5537351A (en) | Method of forming fiber reinforced plastic | |
| JPS57205420A (en) | Thermosetting resin composition | |
| JPS53144958A (en) | Epoxy resin composition | |
| JPS5698228A (en) | Curing agent for epoxy resin | |
| JPS5486599A (en) | Thermosetting epoxy resin composition | |
| JPS5653129A (en) | Curable resin composition | |
| JPS55144027A (en) | Production of polyamidic acid and polyimide copolymer | |
| JPS53128664A (en) | Production of prepreg | |
| JPS5550019A (en) | Thermosetting resin composition | |
| JPS51117800A (en) | A process for preparing epoxy resin composition | |
| JPS5548216A (en) | Epoxy resin composition | |
| JPS55732A (en) | Preparation of polyimide/polyhydantoin resin coating composition | |
| JPS5638319A (en) | Heat-resistant resin composition | |
| JPS55740A (en) | Unsaturated epoxyester resin composition | |
| JPS5352600A (en) | Preparation of epoxy resin curing agent |