JPS57205420A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPS57205420A JPS57205420A JP9134581A JP9134581A JPS57205420A JP S57205420 A JPS57205420 A JP S57205420A JP 9134581 A JP9134581 A JP 9134581A JP 9134581 A JP9134581 A JP 9134581A JP S57205420 A JPS57205420 A JP S57205420A
- Authority
- JP
- Japan
- Prior art keywords
- water absorption
- epoxy resin
- epoxy
- resin composition
- polyvinylphenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title 1
- 229920001187 thermosetting polymer Polymers 0.000 title 1
- 238000010521 absorption reaction Methods 0.000 abstract 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 3
- 229920001665 Poly-4-vinylphenol Polymers 0.000 abstract 2
- 239000005062 Polybutadiene Substances 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 239000003822 epoxy resin Substances 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- 150000001451 organic peroxides Chemical class 0.000 abstract 2
- 229920002857 polybutadiene Polymers 0.000 abstract 2
- 229920000647 polyepoxide Polymers 0.000 abstract 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 abstract 1
- 239000000654 additive Substances 0.000 abstract 1
- 230000000996 additive effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: The titled composition having excellent heat resistance and improved water absorption property, prepared by mixing an epoxy resin with a polyvinylphenol as a curing agent, an epoxy-modified polybutadiene and an organic peroxide.
CONSTITUTION: To an epoxy resin composition prepared by mixing a liquid epoxy resin with a polyvinylphenol as a curing agent and, if necessary, a cure accelerator and an additive are added an epoxy-modified polybutadiene and an organic peroxide (e.g., dicumyl peroxide).
EFFECT: It is possible to improve water absorption, electrostatic properties and insulation properties after water absorption treatment.
USE: Copper-clad laminated sheet, substrate for heat bonding.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9134581A JPS57205420A (en) | 1981-06-12 | 1981-06-12 | Thermosetting resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9134581A JPS57205420A (en) | 1981-06-12 | 1981-06-12 | Thermosetting resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57205420A true JPS57205420A (en) | 1982-12-16 |
Family
ID=14023824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9134581A Pending JPS57205420A (en) | 1981-06-12 | 1981-06-12 | Thermosetting resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57205420A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006241252A (en) * | 2005-03-01 | 2006-09-14 | Sekisui Chem Co Ltd | Epoxy resin cured product, sheet made thereof and manufacturing method of the epoxy resin cured product |
| JP2014055233A (en) * | 2012-09-12 | 2014-03-27 | Panasonic Corp | Liquid epoxy resin composition and semiconductor electronic component |
| CN104002538A (en) * | 2014-04-18 | 2014-08-27 | 南通诺德电子有限公司 | Making method for super-thick copper foil and high heat-conducting copper clad laminate |
-
1981
- 1981-06-12 JP JP9134581A patent/JPS57205420A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006241252A (en) * | 2005-03-01 | 2006-09-14 | Sekisui Chem Co Ltd | Epoxy resin cured product, sheet made thereof and manufacturing method of the epoxy resin cured product |
| JP2014055233A (en) * | 2012-09-12 | 2014-03-27 | Panasonic Corp | Liquid epoxy resin composition and semiconductor electronic component |
| CN104002538A (en) * | 2014-04-18 | 2014-08-27 | 南通诺德电子有限公司 | Making method for super-thick copper foil and high heat-conducting copper clad laminate |
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