JPS57153454A - Resin molded type semiconductor device - Google Patents
Resin molded type semiconductor deviceInfo
- Publication number
- JPS57153454A JPS57153454A JP56037831A JP3783181A JPS57153454A JP S57153454 A JPS57153454 A JP S57153454A JP 56037831 A JP56037831 A JP 56037831A JP 3783181 A JP3783181 A JP 3783181A JP S57153454 A JPS57153454 A JP S57153454A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- hardener
- epoxy
- novolac type
- added
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 title abstract 5
- 239000011347 resin Substances 0.000 title abstract 5
- 239000004065 semiconductor Substances 0.000 title 1
- 229920003986 novolac Polymers 0.000 abstract 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 3
- 239000003822 epoxy resin Substances 0.000 abstract 3
- 229920000647 polyepoxide Polymers 0.000 abstract 3
- 239000004848 polyfunctional curative Substances 0.000 abstract 3
- 239000004593 Epoxy Substances 0.000 abstract 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 abstract 2
- 239000013522 chelant Substances 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 abstract 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Natural products P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 239000003446 ligand Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 239000005011 phenolic resin Substances 0.000 abstract 1
- -1 phosphine compound Chemical class 0.000 abstract 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 150000003377 silicon compounds Chemical class 0.000 abstract 1
- 230000003245 working effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To seal with high reliability by adding the fixed quantities of an organic phosphine compound, a metallic chelate compound and an organic silicon compound having a silanolic hydroxyl group to the novolac type epoxy resin of 170-300 epoxy equivalent and a novolac type phenol resin hardener. CONSTITUTION:The phenol novolac resin as the hardener is compounded to the resin such as the phenol novolac type epoxy resin of 170-300 epoxy equivalent at 0.5-1.5 in the number of the phenolic hydroxyl groups/the number of the epoxy groups of the epoxy resin. Triphenyl phosphine is added by the 0.01- 20wt% of resin+the hardener to promote curing, the metallic chelate compound, the central metal thereof is Al, etc. and ligands thereof are acetyl acetone, etc., is added by a 1-100pts.wt./100pts.wt. accelerating agent, and (CH3)3SiOH, etc. are further added by a 0.05-10wt.pt. to a resin component. Accordingly to such composition, the resin sealing device having excellent wetproof property and also excellent electrical characteristics at a high temperature is obtained in superior formability and working property.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56037831A JPS57153454A (en) | 1981-03-18 | 1981-03-18 | Resin molded type semiconductor device |
| DE8181104126T DE3163054D1 (en) | 1980-06-05 | 1981-05-29 | Resin encapsulation type semiconductor device |
| EP19810104126 EP0041662B1 (en) | 1980-06-05 | 1981-05-29 | Resin encapsulation type semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56037831A JPS57153454A (en) | 1981-03-18 | 1981-03-18 | Resin molded type semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57153454A true JPS57153454A (en) | 1982-09-22 |
| JPS6137789B2 JPS6137789B2 (en) | 1986-08-26 |
Family
ID=12508467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56037831A Granted JPS57153454A (en) | 1980-06-05 | 1981-03-18 | Resin molded type semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57153454A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5876455A (en) * | 1981-11-02 | 1983-05-09 | Matsushita Electric Works Ltd | Thermosetting resin molding material for sealing and molded electronic parts using the same |
| JPS5967660A (en) * | 1982-10-12 | 1984-04-17 | Toshiba Corp | Resin sealed type semiconductor device |
| JP2001288338A (en) * | 2000-04-10 | 2001-10-16 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
| JP2003003044A (en) * | 2001-06-26 | 2003-01-08 | Matsushita Electric Works Ltd | Semiconductor-sealing resin composition and semiconductor device |
| JP2016183309A (en) * | 2015-03-27 | 2016-10-20 | アイカＳｄｋフェノール株式会社 | Epoxy resin and thermosetting resin composition |
-
1981
- 1981-03-18 JP JP56037831A patent/JPS57153454A/en active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5876455A (en) * | 1981-11-02 | 1983-05-09 | Matsushita Electric Works Ltd | Thermosetting resin molding material for sealing and molded electronic parts using the same |
| JPS5967660A (en) * | 1982-10-12 | 1984-04-17 | Toshiba Corp | Resin sealed type semiconductor device |
| JP2001288338A (en) * | 2000-04-10 | 2001-10-16 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
| JP2003003044A (en) * | 2001-06-26 | 2003-01-08 | Matsushita Electric Works Ltd | Semiconductor-sealing resin composition and semiconductor device |
| JP2016183309A (en) * | 2015-03-27 | 2016-10-20 | アイカＳｄｋフェノール株式会社 | Epoxy resin and thermosetting resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6137789B2 (en) | 1986-08-26 |
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