JPS57152490A - Surface treatment of copper foil - Google Patents
Surface treatment of copper foilInfo
- Publication number
- JPS57152490A JPS57152490A JP3730981A JP3730981A JPS57152490A JP S57152490 A JPS57152490 A JP S57152490A JP 3730981 A JP3730981 A JP 3730981A JP 3730981 A JP3730981 A JP 3730981A JP S57152490 A JPS57152490 A JP S57152490A
- Authority
- JP
- Japan
- Prior art keywords
- chromium
- foil
- water soluble
- zinc
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrochemical Coating By Surface Reaction (AREA)
Abstract
PURPOSE: To manufacture copper foil with superior heat resistance and rust preventiveness suitable for a printed circuit by forming an electrodeposited composite thin film of chromium and zinc on the roughened surface of copper foil.
CONSTITUTION: The surface of coper foil obtd. by electrolysis or rolling is roughened by supplyin an electric current exceeding limiting current density to the film as a cathode in a copper sulfate plating bath. The roughtened foil is immersed as a cathode in an electrolytic bath of ≤6.5 pH contg. a water soluble sexivalent chromium compound and a water soluble zinc compound or further contg. sodium sulfate, and it is electrolytically treated at ≤1.5A/dm2 current density to form a composite thin film of chromium and zinc on the surface of the foil. As the chromium compound 1W10g/l dichromate is used, and as the zinc compound 1W50g/l water soluble zinc salt is used. An electrolytic bath contg. 0.05W0.3g/l chromium trioxide, 1W10g/l water soluble zinc salt and 1W20g/l sodium sulfate may be used.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3730981A JPS57152490A (en) | 1981-03-17 | 1981-03-17 | Surface treatment of copper foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3730981A JPS57152490A (en) | 1981-03-17 | 1981-03-17 | Surface treatment of copper foil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57152490A true JPS57152490A (en) | 1982-09-20 |
Family
ID=12494089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3730981A Pending JPS57152490A (en) | 1981-03-17 | 1981-03-17 | Surface treatment of copper foil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57152490A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5338619A (en) * | 1991-05-16 | 1994-08-16 | Fukuda Metal Foil And Powder Co., Ltd. | Copper foil for printed circuits and method of producing same |
| US5389446A (en) * | 1992-02-19 | 1995-02-14 | Nikko Gould Foil Co., Ltd. | Copper foil for printed circuits |
| US5447619A (en) * | 1993-11-24 | 1995-09-05 | Circuit Foil Usa, Inc. | Copper foil for the manufacture of printed circuit boards and method of producing the same |
-
1981
- 1981-03-17 JP JP3730981A patent/JPS57152490A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5338619A (en) * | 1991-05-16 | 1994-08-16 | Fukuda Metal Foil And Powder Co., Ltd. | Copper foil for printed circuits and method of producing same |
| US5356528A (en) * | 1991-05-16 | 1994-10-18 | Fukuda Metal Foil & Powder Co., Ltd. | Copper foil for printed circuits and method of producing same |
| US5389446A (en) * | 1992-02-19 | 1995-02-14 | Nikko Gould Foil Co., Ltd. | Copper foil for printed circuits |
| US5447619A (en) * | 1993-11-24 | 1995-09-05 | Circuit Foil Usa, Inc. | Copper foil for the manufacture of printed circuit boards and method of producing the same |
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