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JPS57152485A - Copper foil and its surface treatment - Google Patents

Copper foil and its surface treatment

Info

Publication number
JPS57152485A
JPS57152485A JP3730881A JP3730881A JPS57152485A JP S57152485 A JPS57152485 A JP S57152485A JP 3730881 A JP3730881 A JP 3730881A JP 3730881 A JP3730881 A JP 3730881A JP S57152485 A JPS57152485 A JP S57152485A
Authority
JP
Japan
Prior art keywords
foil
chromium
copper foil
magnesium
roughened
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3730881A
Other languages
Japanese (ja)
Other versions
JPS6145720B2 (en
Inventor
Mutsumi Shinozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIHON DENKAI KK
Nippon Denkai Co Ltd
Original Assignee
NIHON DENKAI KK
Nippon Denkai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIHON DENKAI KK, Nippon Denkai Co Ltd filed Critical NIHON DENKAI KK
Priority to JP3730881A priority Critical patent/JPS57152485A/en
Publication of JPS57152485A publication Critical patent/JPS57152485A/en
Publication of JPS6145720B2 publication Critical patent/JPS6145720B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Electrochemical Coating By Surface Reaction (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: To manufacture copper foil with superior heat resistance and rust preventiveness used in a wiring plate for a printed circuit by forming an electrodeposited composite film of chromium and magnesium on the roughened surface of copper foil.
CONSTITUTION: Using the face of copper foil laminating on the side of a circuit as a cathode the surface of the foil is roughened in a copper sulfate plating bath with an electric current exceeding limiting current density. An electrolytic bath contg. 1W10g/l sodium dichromate, 1W20g/lmagnesium sulfate and 1W20g/l sodium solfate is adjusted to ≤7.0pH which sulfuric acid, and the roughened foil is immersed in the bath as a cathode and electolytically treated at room temp. and ≤2A/dm2 current density to form a composite thin film of chromium and magnesium on the foil. A water soluble sexivalent chromium compound such as chromium trioxide may be used in place of the dichromate, and the magnesium sulfate may be replaced with other water soluble magnesium salt.
COPYRIGHT: (C)1982,JPO&Japio
JP3730881A 1981-03-17 1981-03-17 Copper foil and its surface treatment Granted JPS57152485A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3730881A JPS57152485A (en) 1981-03-17 1981-03-17 Copper foil and its surface treatment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3730881A JPS57152485A (en) 1981-03-17 1981-03-17 Copper foil and its surface treatment

Publications (2)

Publication Number Publication Date
JPS57152485A true JPS57152485A (en) 1982-09-20
JPS6145720B2 JPS6145720B2 (en) 1986-10-09

Family

ID=12494061

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3730881A Granted JPS57152485A (en) 1981-03-17 1981-03-17 Copper foil and its surface treatment

Country Status (1)

Country Link
JP (1) JPS57152485A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015038253A (en) * 2013-08-01 2015-02-26 長春石油化學股▲分▼有限公司 Electrolytic copper foil
CN110983386A (en) * 2019-12-30 2020-04-10 中国科学院青海盐湖研究所 Method for preparing porous copper foil by one-step electrolysis method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5142575A (en) * 1974-10-08 1976-04-10 Matsushita Electric Ind Co Ltd KOONDOSENSAA

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5142575A (en) * 1974-10-08 1976-04-10 Matsushita Electric Ind Co Ltd KOONDOSENSAA

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015038253A (en) * 2013-08-01 2015-02-26 長春石油化學股▲分▼有限公司 Electrolytic copper foil
CN110983386A (en) * 2019-12-30 2020-04-10 中国科学院青海盐湖研究所 Method for preparing porous copper foil by one-step electrolysis method
CN110983386B (en) * 2019-12-30 2021-09-28 中国科学院青海盐湖研究所 Method for preparing porous copper foil by one-step electrolysis method

Also Published As

Publication number Publication date
JPS6145720B2 (en) 1986-10-09

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