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JPS57115852A - Microwave transistor mount - Google Patents

Microwave transistor mount

Info

Publication number
JPS57115852A
JPS57115852A JP250081A JP250081A JPS57115852A JP S57115852 A JPS57115852 A JP S57115852A JP 250081 A JP250081 A JP 250081A JP 250081 A JP250081 A JP 250081A JP S57115852 A JPS57115852 A JP S57115852A
Authority
JP
Japan
Prior art keywords
line
substrate
transistor
microwave
impedance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP250081A
Other languages
Japanese (ja)
Inventor
Masaaki Nakatani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP250081A priority Critical patent/JPS57115852A/en
Publication of JPS57115852A publication Critical patent/JPS57115852A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32153—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
    • H01L2224/32175—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic
    • H01L2224/32188—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic the layer connector connecting to a bonding area protruding from the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To obtain an element configuration without low frequency oscillations by a method wherein a high impedance microstrip line is led from a part of a microstrip line having a characteristic impedance of 50OMEGA and which is formed on a substrate such as alumina ceramic or the like, and with a capacitor and a resistor connected to it. CONSTITUTION:An alumina ceramic substrate 2 is mounted in a brass chamber 1, and a microstrip line 3 is formed on the substrate, and in the middle of this substrate is placed a microwave transistor 4, and each electrode terminal is connected to the chamber 1 and the line 3. Subsequently from bias stays 5 provided at both outsides of the configuration a bias voltage and an RF signal are applied to the transistor 4 and the characteristics of the transistor 4 for microwave is measured. And for the puroose of setting the impedance of the measuring system to be 50OMEGA, the relation between the width W of the line 3 and the thickness t is taken to be W=t. In this constitution a high impedance line 6 is led from the middle of the line 3, and by capacitor 7 and a resistor connected at its tip, the low frequency oscillation is suppressed.
JP250081A 1981-01-10 1981-01-10 Microwave transistor mount Pending JPS57115852A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP250081A JPS57115852A (en) 1981-01-10 1981-01-10 Microwave transistor mount

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP250081A JPS57115852A (en) 1981-01-10 1981-01-10 Microwave transistor mount

Publications (1)

Publication Number Publication Date
JPS57115852A true JPS57115852A (en) 1982-07-19

Family

ID=11531073

Family Applications (1)

Application Number Title Priority Date Filing Date
JP250081A Pending JPS57115852A (en) 1981-01-10 1981-01-10 Microwave transistor mount

Country Status (1)

Country Link
JP (1) JPS57115852A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4612566A (en) * 1983-11-30 1986-09-16 Alps Electric Co., Ltd. Microwave transistor mounting structure
US4841353A (en) * 1984-07-10 1989-06-20 Nec Corporation Transistor devices for microwave oscillator elements
EP0334273A2 (en) * 1988-03-23 1989-09-27 CSELT Centro Studi e Laboratori Telecomunicazioni S.p.A. A fixture for measuring the static characteristics of microwave 3-terminal active components
EP0725441A2 (en) * 1995-01-31 1996-08-07 Hughes Aircraft Company Microwave monolithic integrated circuit package with improved RF ports

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5365613A (en) * 1976-11-24 1978-06-12 Fujitsu Ltd Bias circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5365613A (en) * 1976-11-24 1978-06-12 Fujitsu Ltd Bias circuit

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4612566A (en) * 1983-11-30 1986-09-16 Alps Electric Co., Ltd. Microwave transistor mounting structure
US4841353A (en) * 1984-07-10 1989-06-20 Nec Corporation Transistor devices for microwave oscillator elements
EP0334273A2 (en) * 1988-03-23 1989-09-27 CSELT Centro Studi e Laboratori Telecomunicazioni S.p.A. A fixture for measuring the static characteristics of microwave 3-terminal active components
EP0725441A2 (en) * 1995-01-31 1996-08-07 Hughes Aircraft Company Microwave monolithic integrated circuit package with improved RF ports
EP0725441A3 (en) * 1995-01-31 1998-10-21 Hughes Aircraft Company Microwave monolithic integrated circuit package with improved RF ports

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