[go: up one dir, main page]

JPS57110691A - Spot plating device - Google Patents

Spot plating device

Info

Publication number
JPS57110691A
JPS57110691A JP18666280A JP18666280A JPS57110691A JP S57110691 A JPS57110691 A JP S57110691A JP 18666280 A JP18666280 A JP 18666280A JP 18666280 A JP18666280 A JP 18666280A JP S57110691 A JPS57110691 A JP S57110691A
Authority
JP
Japan
Prior art keywords
plating
sheet
plated
nozzles
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18666280A
Other languages
Japanese (ja)
Other versions
JPS5849640B2 (en
Inventor
Shozo Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP55186662A priority Critical patent/JPS5849640B2/en
Publication of JPS57110691A publication Critical patent/JPS57110691A/en
Publication of JPS5849640B2 publication Critical patent/JPS5849640B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To apply plating uniformly over the entire surface of the exposed parts of a blank material to be plated by interposing a wire net sheet for distributing the flow of a plating soln. and diffusing the same uniformly between a mask and nozzles in a spot plating device of applying plating partially.
CONSTITUTION: A wire net sheet 2 is disposed in a joined state to the top end faces of nozzles 1, 1W, and anode is conducted to part thereof. A blank material 5 to be plated is conducted with cathode on a mask 3 and is pressed by a pressing plate 6 to the mask 3. Thereupon, a plating soln. (a) is injected through nozzles 1, 1W, and the soln. (a) is sprayed through the sheet 2 then through through-holes 7, 7' to the material 5, so that the material is plated only at the parts exposed through the holes 7, 7'. The sheet 2 distributes the flow of the liquid (a), and the distance between both cathode and anode is formed constant by the spacing between the exposed parts of the blank material and the sheet 2, whereby uniform plating current is conducted over the entire surface.
COPYRIGHT: (C)1982,JPO&Japio
JP55186662A 1980-12-27 1980-12-27 spot plating equipment Expired JPS5849640B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55186662A JPS5849640B2 (en) 1980-12-27 1980-12-27 spot plating equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55186662A JPS5849640B2 (en) 1980-12-27 1980-12-27 spot plating equipment

Publications (2)

Publication Number Publication Date
JPS57110691A true JPS57110691A (en) 1982-07-09
JPS5849640B2 JPS5849640B2 (en) 1983-11-05

Family

ID=16192474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55186662A Expired JPS5849640B2 (en) 1980-12-27 1980-12-27 spot plating equipment

Country Status (1)

Country Link
JP (1) JPS5849640B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100860262B1 (en) 2006-10-11 2008-09-25 (주)우신엠.에스 Structure of masks and strips for continuous partial gold plating

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60161938U (en) * 1984-04-05 1985-10-28 三洋電機株式会社 hot plate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4853544A (en) * 1971-11-05 1973-07-27

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4853544A (en) * 1971-11-05 1973-07-27

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100860262B1 (en) 2006-10-11 2008-09-25 (주)우신엠.에스 Structure of masks and strips for continuous partial gold plating

Also Published As

Publication number Publication date
JPS5849640B2 (en) 1983-11-05

Similar Documents

Publication Publication Date Title
JPS5696098A (en) Plating apparatus
JPS57110691A (en) Spot plating device
ES8406229A1 (en) Applicator nozzle.
JPS592117Y2 (en) spot plating equipment
EP0105606A3 (en) High throughput, high uniformity field emission devices
JPS56150833A (en) Method for application of solder
JPS5530155A (en) Welding of battery plate lug group
JPS571714A (en) Heater
JPS5735359A (en) Lead frame for semiconductor device
JPS575898A (en) Surface treating method
JPS5799763A (en) Manufacture of lead frame for integrated circuit
JPS571228A (en) Resist developing device
JPS54119342A (en) Partially plating method
JPS57162268A (en) Manufacture of electrode plate for lead-acid battery
JPS6320378B2 (en)
JPS54138831A (en) One-side electrolytic treatment method for metal sheet
JPS5583164A (en) Manufacturing method of sintering type electrode
JPS57140886A (en) Partial plating device
JPS5714488A (en) Ultrasonic depositing method
JPS6031089Y2 (en) Concave presser roller
JPS61106377U (en)
JPS5586769A (en) Ink jet recording head
JPS54121237A (en) Electroplating
JPS55130148A (en) Forming method of bump electrode
JPS54143450A (en) Roll coater