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JPS57105684A - Device for heat transfer - Google Patents

Device for heat transfer

Info

Publication number
JPS57105684A
JPS57105684A JP18261980A JP18261980A JPS57105684A JP S57105684 A JPS57105684 A JP S57105684A JP 18261980 A JP18261980 A JP 18261980A JP 18261980 A JP18261980 A JP 18261980A JP S57105684 A JPS57105684 A JP S57105684A
Authority
JP
Japan
Prior art keywords
heating
heat
balloons
passage
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18261980A
Other languages
Japanese (ja)
Inventor
Yoshiyuki Matsukawa
Akizo Tazoe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Radio Co Ltd
Nihon Musen KK
Original Assignee
Japan Radio Co Ltd
Nihon Musen KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Radio Co Ltd, Nihon Musen KK filed Critical Japan Radio Co Ltd
Priority to JP18261980A priority Critical patent/JPS57105684A/en
Publication of JPS57105684A publication Critical patent/JPS57105684A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Details Of Measuring And Other Instruments (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE: To optionally form a heating passage in various forms, by composing of a continuous heating passage, by closely arranging a number of heating balloons and by changing the arrangement of these closely contacted ones.
CONSTITUTION: Heating space between heat generating, electronic parts 5a, 5b and 5c provided to a printed circuit board 4 and a heat sink 6 for dissipating heat is filled with heating balloons 1, and neighboring heating balloons are jointed together by an adhesive 8. With such an arrangement, a heat passage, consisting of a cluster of heating balloons, is formed between the heat generating, electronic parts 5a, 5b and 5c and a heat sink 6 for dissipating heat, and heat is transferred directly by each heating balloon, so that high heat conductivity can be obtained by radiation.
COPYRIGHT: (C)1982,JPO&Japio
JP18261980A 1980-12-23 1980-12-23 Device for heat transfer Pending JPS57105684A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18261980A JPS57105684A (en) 1980-12-23 1980-12-23 Device for heat transfer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18261980A JPS57105684A (en) 1980-12-23 1980-12-23 Device for heat transfer

Publications (1)

Publication Number Publication Date
JPS57105684A true JPS57105684A (en) 1982-07-01

Family

ID=16121449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18261980A Pending JPS57105684A (en) 1980-12-23 1980-12-23 Device for heat transfer

Country Status (1)

Country Link
JP (1) JPS57105684A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62129693A (en) * 1985-11-29 1987-06-11 Japan Radio Co Ltd heat transfer device
WO2004114737A1 (en) * 2003-06-25 2004-12-29 Eaton Corporation Dissipating heat in an array of circuit components

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62129693A (en) * 1985-11-29 1987-06-11 Japan Radio Co Ltd heat transfer device
WO2004114737A1 (en) * 2003-06-25 2004-12-29 Eaton Corporation Dissipating heat in an array of circuit components
US6920046B2 (en) 2003-06-25 2005-07-19 Eaton Corporation Dissipating heat in an array of circuit components

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