JPS5710270A - Semiconductor capacitor type pressure sensor - Google Patents
Semiconductor capacitor type pressure sensorInfo
- Publication number
- JPS5710270A JPS5710270A JP8294480A JP8294480A JPS5710270A JP S5710270 A JPS5710270 A JP S5710270A JP 8294480 A JP8294480 A JP 8294480A JP 8294480 A JP8294480 A JP 8294480A JP S5710270 A JPS5710270 A JP S5710270A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- capacitance
- concave notch
- notch part
- cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
- H10D48/50—Devices controlled by mechanical forces, e.g. pressure
Landscapes
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Abstract
PURPOSE:To eliminate the influence of temperature on a semiconductor capacitor type pressure sensor by a method wherein an amplifier is provided at a part of the upper face of an Si substrate, and a concave notch part at another part, capacitor electrodes are provided on the face of an insulating cap to be joined to the substrate facing with the concave notch part, and pressure is detected and amplified as electric capacity. CONSTITUTION:B ions are made to diffuse in a part of the Si substrate 20 to provide an IC amplifier 21, and another part of the substrate is etched with alkali to form the concave notch part 22. An oxide film 23 and a polycrystalline Si layer 24 are formed in order on the whole surface of the substrate excluding the concave notch part 22, and the cap 25 consisted of Pyrex glass is adhered on the polycrystalline Si layer 24 to seal. The electrodes 27, 28 are provided on the face of the cap 25 facing with the concave notch part to form capacitance between substrate 20, deformation of the substrate 20 by pressure A is detected as capacitance, and is amplified to be outputted to outside terminals 36, 37. Accordingly because no component of P-N junction capacitance is contained in the detected value of capacitance, variation of capacitance to be caused by the circumferential temperature can be reduced, and the sensor having high accuracy can be obtained.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8294480A JPS5710270A (en) | 1980-06-20 | 1980-06-20 | Semiconductor capacitor type pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8294480A JPS5710270A (en) | 1980-06-20 | 1980-06-20 | Semiconductor capacitor type pressure sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5710270A true JPS5710270A (en) | 1982-01-19 |
| JPS6154266B2 JPS6154266B2 (en) | 1986-11-21 |
Family
ID=13788319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8294480A Granted JPS5710270A (en) | 1980-06-20 | 1980-06-20 | Semiconductor capacitor type pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5710270A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59206567A (en) * | 1983-05-09 | 1984-11-22 | 富士重工業株式会社 | Keyless entry apparatus |
| JPS6016681A (en) * | 1983-07-08 | 1985-01-28 | 富士重工業株式会社 | Keyless entry apparatus of car |
| JPH01253627A (en) * | 1988-04-01 | 1989-10-09 | Res Dev Corp Of Japan | Pressure sensor and manufacture thereof |
| US5041900A (en) * | 1987-08-06 | 1991-08-20 | Hamilton Standard Controls, Inc. | Semiconductor device having sealed electrical feedthrough |
| US5072288A (en) * | 1989-02-21 | 1991-12-10 | Cornell Research Foundation, Inc. | Microdynamic release structure |
| US5149673A (en) * | 1989-02-21 | 1992-09-22 | Cornell Research Foundation, Inc. | Selective chemical vapor deposition of tungsten for microdynamic structures |
| JPH06201504A (en) * | 1993-11-22 | 1994-07-19 | Nissan Motor Co Ltd | Manufacture of semiconductor dynamical amount sensor |
| US5406108A (en) * | 1992-11-17 | 1995-04-11 | Sumitomo Electric Industries, Ltd. | Interconnection construction of semiconductor device |
| US5596219A (en) * | 1994-05-25 | 1997-01-21 | Siemens Aktiengesellschaft | Thermal sensor/actuator in semiconductor material |
| JP2015087131A (en) * | 2013-10-28 | 2015-05-07 | 国立大学法人東北大学 | Sensor device and manufacturing method thereof |
-
1980
- 1980-06-20 JP JP8294480A patent/JPS5710270A/en active Granted
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59206567A (en) * | 1983-05-09 | 1984-11-22 | 富士重工業株式会社 | Keyless entry apparatus |
| JPS6016681A (en) * | 1983-07-08 | 1985-01-28 | 富士重工業株式会社 | Keyless entry apparatus of car |
| US5041900A (en) * | 1987-08-06 | 1991-08-20 | Hamilton Standard Controls, Inc. | Semiconductor device having sealed electrical feedthrough |
| JPH01253627A (en) * | 1988-04-01 | 1989-10-09 | Res Dev Corp Of Japan | Pressure sensor and manufacture thereof |
| US5072288A (en) * | 1989-02-21 | 1991-12-10 | Cornell Research Foundation, Inc. | Microdynamic release structure |
| US5149673A (en) * | 1989-02-21 | 1992-09-22 | Cornell Research Foundation, Inc. | Selective chemical vapor deposition of tungsten for microdynamic structures |
| US5406108A (en) * | 1992-11-17 | 1995-04-11 | Sumitomo Electric Industries, Ltd. | Interconnection construction of semiconductor device |
| JPH06201504A (en) * | 1993-11-22 | 1994-07-19 | Nissan Motor Co Ltd | Manufacture of semiconductor dynamical amount sensor |
| US5596219A (en) * | 1994-05-25 | 1997-01-21 | Siemens Aktiengesellschaft | Thermal sensor/actuator in semiconductor material |
| EP0684462A3 (en) * | 1994-05-25 | 1997-05-07 | Siemens Ag | Sensor / actuator made of semiconductor material. |
| JP2015087131A (en) * | 2013-10-28 | 2015-05-07 | 国立大学法人東北大学 | Sensor device and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6154266B2 (en) | 1986-11-21 |
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