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JPS5636148A - Semiconductor device and its manufacture - Google Patents

Semiconductor device and its manufacture

Info

Publication number
JPS5636148A
JPS5636148A JP11114679A JP11114679A JPS5636148A JP S5636148 A JPS5636148 A JP S5636148A JP 11114679 A JP11114679 A JP 11114679A JP 11114679 A JP11114679 A JP 11114679A JP S5636148 A JPS5636148 A JP S5636148A
Authority
JP
Japan
Prior art keywords
chips
semiconductor device
semiconductor substrate
wiring
transistors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11114679A
Other languages
Japanese (ja)
Inventor
Tetsuo Ide
Hiroshi Iwamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP11114679A priority Critical patent/JPS5636148A/en
Publication of JPS5636148A publication Critical patent/JPS5636148A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10—Integrated device layouts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Semiconductor Integrated Circuits (AREA)

Abstract

PURPOSE:To enable the formation of semiconductor chips with greater circuit functions by means of a simple process by a method wherein proper wiring is made up on a plurality of chips of an existing semiconductor substrate to which function elements are completely formed. CONSTITUTION:When forming wiring to two chips, differential amplifying circuits are made up in each chip region of a semiconductor substrate consisting of a plurality of chip regions C1, C2,...CX partitioned by scribe streets 1 by three transistors Tr1, Tr2, Tr3. Wiring mutually connecting each region of the transistors on the adjacent two chips is built up in place of a process forming the bonding pads 5', 6' of such a semiconductor device, and multiplexer chips shown in the figure are obtained. Thus, the semiconductor device with a greater circuit scale can be prepared by using the semiconductor substrate worked in order to prepare the existing semiconductor device.
JP11114679A 1979-08-31 1979-08-31 Semiconductor device and its manufacture Pending JPS5636148A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11114679A JPS5636148A (en) 1979-08-31 1979-08-31 Semiconductor device and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11114679A JPS5636148A (en) 1979-08-31 1979-08-31 Semiconductor device and its manufacture

Publications (1)

Publication Number Publication Date
JPS5636148A true JPS5636148A (en) 1981-04-09

Family

ID=14553617

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11114679A Pending JPS5636148A (en) 1979-08-31 1979-08-31 Semiconductor device and its manufacture

Country Status (1)

Country Link
JP (1) JPS5636148A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59121850U (en) * 1983-02-04 1984-08-16 シャープ株式会社 LSI chip
JPS6039256U (en) * 1983-08-24 1985-03-19 日本電気株式会社 Monolithic microwave IC
US4688070A (en) * 1983-05-24 1987-08-18 Kabushiki Kaisha Toshiba Semiconductor integrated circuit device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5342575A (en) * 1976-09-29 1978-04-18 Nec Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5342575A (en) * 1976-09-29 1978-04-18 Nec Corp Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59121850U (en) * 1983-02-04 1984-08-16 シャープ株式会社 LSI chip
US4688070A (en) * 1983-05-24 1987-08-18 Kabushiki Kaisha Toshiba Semiconductor integrated circuit device
JPS6039256U (en) * 1983-08-24 1985-03-19 日本電気株式会社 Monolithic microwave IC

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