JPS56292A - Improving soldering property of nickel plating - Google Patents
Improving soldering property of nickel platingInfo
- Publication number
- JPS56292A JPS56292A JP7700979A JP7700979A JPS56292A JP S56292 A JPS56292 A JP S56292A JP 7700979 A JP7700979 A JP 7700979A JP 7700979 A JP7700979 A JP 7700979A JP S56292 A JPS56292 A JP S56292A
- Authority
- JP
- Japan
- Prior art keywords
- acid
- soldering
- aliphatic
- nickel plating
- acethylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title abstract 4
- 238000005476 soldering Methods 0.000 title abstract 4
- 238000007747 plating Methods 0.000 title abstract 3
- 229910052759 nickel Inorganic materials 0.000 title abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 4
- DFPAKSUCGFBDDF-UHFFFAOYSA-N Nicotinamide Chemical compound NC(=O)C1=CC=CN=C1 DFPAKSUCGFBDDF-UHFFFAOYSA-N 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 2
- 239000000654 additive Substances 0.000 abstract 2
- 230000000996 additive effect Effects 0.000 abstract 2
- 150000001298 alcohols Chemical class 0.000 abstract 2
- 125000001931 aliphatic group Chemical group 0.000 abstract 2
- 150000001370 alpha-amino acid derivatives Chemical class 0.000 abstract 2
- 235000008206 alpha-amino acids Nutrition 0.000 abstract 2
- -1 aromatic primary amine Chemical class 0.000 abstract 2
- 239000002932 luster Substances 0.000 abstract 2
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 abstract 2
- FUSNOPLQVRUIIM-UHFFFAOYSA-N 4-amino-2-(4,4-dimethyl-2-oxoimidazolidin-1-yl)-n-[3-(trifluoromethyl)phenyl]pyrimidine-5-carboxamide Chemical compound O=C1NC(C)(C)CN1C(N=C1N)=NC=C1C(=O)NC1=CC=CC(C(F)(F)F)=C1 FUSNOPLQVRUIIM-UHFFFAOYSA-N 0.000 abstract 1
- BIVUUOPIAYRCAP-UHFFFAOYSA-N aminoazanium;chloride Chemical compound Cl.NN BIVUUOPIAYRCAP-UHFFFAOYSA-N 0.000 abstract 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 abstract 1
- 229910000377 hydrazine sulfate Inorganic materials 0.000 abstract 1
- 239000012493 hydrazine sulfate Substances 0.000 abstract 1
- 235000005152 nicotinamide Nutrition 0.000 abstract 1
- 239000011570 nicotinamide Substances 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
PURPOSE: To enhance luster soldering prperties by adding in a plating bath one or more of α-amino acid, aromatic primary amine as a soldering improving agent, an acethylene alcohol derivative as a secondary brightener, sulfamic acid as a third additive agent, etc.
CONSTITUTION: In a nickel plating basic bath, a solder-improving agent uses at least one selected from the group consisting of α-amino acid, aromatic primary amine, aliphatic amine, hydrazine hydrochloride, hydrazine sulfate, and nicotinic acid amide. The amount of adding to the basic bath is 0.01W10g/l. As a result, the soldering property is improved, but luster is not; so at least one of acethylene alcohol derivatives are added in 0.1W1g/l as a secondary brightener. Also, to prevent the plated surface from cracks, at least one of sulfamic acid, aliphatic arboxylic acid, aliphatic hydrocarboxylic acid, and their salts may be added in the range of 0.5W300g/l as a third additive agent.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7700979A JPS56292A (en) | 1979-06-18 | 1979-06-18 | Improving soldering property of nickel plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7700979A JPS56292A (en) | 1979-06-18 | 1979-06-18 | Improving soldering property of nickel plating |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56292A true JPS56292A (en) | 1981-01-06 |
JPH0220715B2 JPH0220715B2 (en) | 1990-05-10 |
Family
ID=13621751
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7700979A Granted JPS56292A (en) | 1979-06-18 | 1979-06-18 | Improving soldering property of nickel plating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56292A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000295693A (en) * | 1999-04-05 | 2000-10-20 | Citizen Electronics Co Ltd | Yoke for electromagnetic sounder and its manufacture |
JP2015029991A (en) * | 2013-07-31 | 2015-02-16 | Dowaメタルテック株式会社 | METHOD FOR JOINING Ni-PLATED MATERIAL |
CN111910225A (en) * | 2020-06-22 | 2020-11-10 | 西安交通大学 | Method for simultaneously depositing nickel-iron modified titanium dioxide nanotube electrode |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5325538A (en) * | 1976-08-23 | 1978-03-09 | Sumitomo Chem Co Ltd | Preparation of 3-methyl-2-(4-halogenophenyl)butyronitril |
-
1979
- 1979-06-18 JP JP7700979A patent/JPS56292A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5325538A (en) * | 1976-08-23 | 1978-03-09 | Sumitomo Chem Co Ltd | Preparation of 3-methyl-2-(4-halogenophenyl)butyronitril |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000295693A (en) * | 1999-04-05 | 2000-10-20 | Citizen Electronics Co Ltd | Yoke for electromagnetic sounder and its manufacture |
JP2015029991A (en) * | 2013-07-31 | 2015-02-16 | Dowaメタルテック株式会社 | METHOD FOR JOINING Ni-PLATED MATERIAL |
CN111910225A (en) * | 2020-06-22 | 2020-11-10 | 西安交通大学 | Method for simultaneously depositing nickel-iron modified titanium dioxide nanotube electrode |
Also Published As
Publication number | Publication date |
---|---|
JPH0220715B2 (en) | 1990-05-10 |
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