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JPS5626454A - Integrated circuit device - Google Patents

Integrated circuit device

Info

Publication number
JPS5626454A
JPS5626454A JP10204179A JP10204179A JPS5626454A JP S5626454 A JPS5626454 A JP S5626454A JP 10204179 A JP10204179 A JP 10204179A JP 10204179 A JP10204179 A JP 10204179A JP S5626454 A JPS5626454 A JP S5626454A
Authority
JP
Japan
Prior art keywords
resin
concave section
packaging container
coating
immersed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10204179A
Other languages
Japanese (ja)
Inventor
Shigeo Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10204179A priority Critical patent/JPS5626454A/en
Publication of JPS5626454A publication Critical patent/JPS5626454A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain a high reliability device by providing a concave section on the surface of a packaging container wherein a resin for coating is poured into the concave section and the face forming a semiconductor element is placed downwardly and a thick film substrate is put in the concave section and immersed in the resin for seal. CONSTITUTION:A concave section 11 opening upwardly is provided in a plastic packaging container 10 and a resin 12 for coating is poured into the concave section. Next, the element side of the a thick film substrate providing a semiconductor element, wirings is placed downwardly so that the element side may oppose to the bottom of the concave section and the substrate is immersed in the resin 12. The resin is hardened by heating and resin seal completes at the same time of the fixing of the concave section 11 to the packaging container. In this composition, the parts required resin coating are buried in the resin in the concave section of the packaging container. Therefore, the amount of resin is kept constantly and the exposure of the parts and the overflow of the resin will be prevented.
JP10204179A 1979-08-09 1979-08-09 Integrated circuit device Pending JPS5626454A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10204179A JPS5626454A (en) 1979-08-09 1979-08-09 Integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10204179A JPS5626454A (en) 1979-08-09 1979-08-09 Integrated circuit device

Publications (1)

Publication Number Publication Date
JPS5626454A true JPS5626454A (en) 1981-03-14

Family

ID=14316679

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10204179A Pending JPS5626454A (en) 1979-08-09 1979-08-09 Integrated circuit device

Country Status (1)

Country Link
JP (1) JPS5626454A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0522716U (en) * 1991-09-06 1993-03-26 ミサワホーム株式会社 Floor panel surface alignment structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0522716U (en) * 1991-09-06 1993-03-26 ミサワホーム株式会社 Floor panel surface alignment structure

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