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JPS5397370A - Trasfer mold device for semiconductor device - Google Patents

Trasfer mold device for semiconductor device

Info

Publication number
JPS5397370A
JPS5397370A JP1160577A JP1160577A JPS5397370A JP S5397370 A JPS5397370 A JP S5397370A JP 1160577 A JP1160577 A JP 1160577A JP 1160577 A JP1160577 A JP 1160577A JP S5397370 A JPS5397370 A JP S5397370A
Authority
JP
Japan
Prior art keywords
trasfer
mold
semiconductor device
radiation plate
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1160577A
Other languages
Japanese (ja)
Other versions
JPS5952539B2 (en
Inventor
Toshikatsu Tsunehiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP1160577A priority Critical patent/JPS5952539B2/en
Publication of JPS5397370A publication Critical patent/JPS5397370A/en
Publication of JPS5952539B2 publication Critical patent/JPS5952539B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To provide the through-hole opening to the air on one surface of the cavity in the mold metal fittings touching the radiation plate, and to prevent the flash by insulating the injection force of the resin via radiation plate at the molding time.
COPYRIGHT: (C)1978,JPO&Japio
JP1160577A 1977-02-07 1977-02-07 Transfer molding equipment for semiconductor devices Expired JPS5952539B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1160577A JPS5952539B2 (en) 1977-02-07 1977-02-07 Transfer molding equipment for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1160577A JPS5952539B2 (en) 1977-02-07 1977-02-07 Transfer molding equipment for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS5397370A true JPS5397370A (en) 1978-08-25
JPS5952539B2 JPS5952539B2 (en) 1984-12-20

Family

ID=11782527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1160577A Expired JPS5952539B2 (en) 1977-02-07 1977-02-07 Transfer molding equipment for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5952539B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54111281A (en) * 1978-02-20 1979-08-31 Mitsubishi Electric Corp Resin seal forming mold of semiconductor device
JPS55128835A (en) * 1979-03-28 1980-10-06 Hitachi Ltd Molding method and mold used therefor
JPS63211638A (en) * 1988-01-08 1988-09-02 Nec Home Electronics Ltd Manufacture of resin seal type semiconductor device
JP2014143240A (en) * 2013-01-22 2014-08-07 Shindengen Electric Mfg Co Ltd Mold, method of manufacturing resin sealed type semiconductor device using the same, and resin sealed type semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54111281A (en) * 1978-02-20 1979-08-31 Mitsubishi Electric Corp Resin seal forming mold of semiconductor device
JPS5625779B2 (en) * 1978-02-20 1981-06-15
JPS55128835A (en) * 1979-03-28 1980-10-06 Hitachi Ltd Molding method and mold used therefor
JPS63211638A (en) * 1988-01-08 1988-09-02 Nec Home Electronics Ltd Manufacture of resin seal type semiconductor device
JP2014143240A (en) * 2013-01-22 2014-08-07 Shindengen Electric Mfg Co Ltd Mold, method of manufacturing resin sealed type semiconductor device using the same, and resin sealed type semiconductor device

Also Published As

Publication number Publication date
JPS5952539B2 (en) 1984-12-20

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