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JPS56159266A - Laminating adhesive composition - Google Patents

Laminating adhesive composition

Info

Publication number
JPS56159266A
JPS56159266A JP6316780A JP6316780A JPS56159266A JP S56159266 A JPS56159266 A JP S56159266A JP 6316780 A JP6316780 A JP 6316780A JP 6316780 A JP6316780 A JP 6316780A JP S56159266 A JPS56159266 A JP S56159266A
Authority
JP
Japan
Prior art keywords
radically polymerizable
1w45wt
prepolymer
molecule
unsaturated bonds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6316780A
Other languages
Japanese (ja)
Other versions
JPS6216236B2 (en
Inventor
Mitsuharu Nakamoto
Koichi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP6316780A priority Critical patent/JPS56159266A/en
Publication of JPS56159266A publication Critical patent/JPS56159266A/en
Publication of JPS6216236B2 publication Critical patent/JPS6216236B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Laminated Bodies (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)

Abstract

PURPOSE: The titled composition, containing a prepolymer having a specific amount of radically polymerizable unsaturated bonds in the molecule and a polyurethane resin in a specified proportion, having a suitable curability, and capable of giving an adhesive layer having improved flexibility and adhesive property.
CONSTITUTION: A composition prepared by mixing (A) 50wt% or more, preferably 60W90wt%, prepolymer having 1W2 radically polymerizable unsaturated bonds in the molecule, preferably an unsaturated polyester modified with urethane having a molecular weight of 500W4,000, with (B) 1W45wt% polyurethane resin, preferably a di- or polyfunctional saturated polyester having a molecular weight of 10,000W 300,000, and preferably (C) 1W45wt% prepolymer having 3 or more radically polymerizable unsaturated bonds in the molecule and (D) 1W45wt% radically polymerizable monomer. The resultant composition is applied between substrate films, laminated and cured by irradiation with electron rays to give laminated films.
COPYRIGHT: (C)1981,JPO&Japio
JP6316780A 1980-05-13 1980-05-13 Laminating adhesive composition Granted JPS56159266A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6316780A JPS56159266A (en) 1980-05-13 1980-05-13 Laminating adhesive composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6316780A JPS56159266A (en) 1980-05-13 1980-05-13 Laminating adhesive composition

Publications (2)

Publication Number Publication Date
JPS56159266A true JPS56159266A (en) 1981-12-08
JPS6216236B2 JPS6216236B2 (en) 1987-04-11

Family

ID=13221412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6316780A Granted JPS56159266A (en) 1980-05-13 1980-05-13 Laminating adhesive composition

Country Status (1)

Country Link
JP (1) JPS56159266A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6362800A (en) * 1986-09-04 1988-03-19 大日本印刷株式会社 China-painting method
JPH0625634A (en) * 1991-09-06 1994-02-01 Huber & Suhner Ag Thermosetting reactive adhesive
JP2008202020A (en) * 2007-01-23 2008-09-04 Hitachi Chem Co Ltd Adhesive composition, circuit connecting structure, and semiconductor device
WO2012165201A1 (en) * 2011-06-02 2012-12-06 株式会社きもと Easily releasable adhesive film
JP2021501223A (en) * 2017-10-25 2021-01-14 サン・ケミカル・コーポレーション Chemical ray-curable adhesive composition with improved properties

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6362800A (en) * 1986-09-04 1988-03-19 大日本印刷株式会社 China-painting method
JPH0625634A (en) * 1991-09-06 1994-02-01 Huber & Suhner Ag Thermosetting reactive adhesive
JP2008202020A (en) * 2007-01-23 2008-09-04 Hitachi Chem Co Ltd Adhesive composition, circuit connecting structure, and semiconductor device
WO2012165201A1 (en) * 2011-06-02 2012-12-06 株式会社きもと Easily releasable adhesive film
JPWO2012165201A1 (en) * 2011-06-02 2015-02-23 株式会社きもと Easy-release adhesive film
JP2021501223A (en) * 2017-10-25 2021-01-14 サン・ケミカル・コーポレーション Chemical ray-curable adhesive composition with improved properties

Also Published As

Publication number Publication date
JPS6216236B2 (en) 1987-04-11

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