JPS5577164A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5577164A JPS5577164A JP15163878A JP15163878A JPS5577164A JP S5577164 A JPS5577164 A JP S5577164A JP 15163878 A JP15163878 A JP 15163878A JP 15163878 A JP15163878 A JP 15163878A JP S5577164 A JPS5577164 A JP S5577164A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- paste
- shortcircuit
- joining
- lead strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 239000008188 pellet Substances 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To join fine electrode pattern, without allowing occurrence of shortcircuit, by joining a semiconductor's electrode section with a matching lead terminal by coating electroconductive paste on them.
CONSTITUTION: AgPd paste is screen-printed at an electrode section 2 surrounding a pellet 1 formed with Al wire 5 through an SiO2 film on an Si substrate 3. Ag paste is print-coated onto a lead strip piece 7 of a lead frame 6. After completion of positioning of a group of lead strip pieces 7 and pellet electrodes 2, top-end section of the lead strip piece is pressured, adhered and thermally hardened. By using this method, it is possible to prevent occurrence of shortcircuit even in the case of joining of fine electrode.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15163878A JPS5577164A (en) | 1978-12-07 | 1978-12-07 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15163878A JPS5577164A (en) | 1978-12-07 | 1978-12-07 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5577164A true JPS5577164A (en) | 1980-06-10 |
Family
ID=15522918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15163878A Pending JPS5577164A (en) | 1978-12-07 | 1978-12-07 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5577164A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4507675A (en) * | 1981-03-05 | 1985-03-26 | Matsushita Electronics Corporation | Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor |
| JPS647645A (en) * | 1987-06-30 | 1989-01-11 | Hitachi Ltd | Semiconductor device and manufacture thereof |
| JPH01232735A (en) * | 1988-03-11 | 1989-09-18 | Matsushita Electric Ind Co Ltd | Semiconductor device |
| JPH0465441U (en) * | 1990-10-19 | 1992-06-08 | ||
| US6646355B2 (en) | 1997-07-10 | 2003-11-11 | International Business Machines Corporation | Structure comprising beam leads bonded with electrically conductive adhesive |
-
1978
- 1978-12-07 JP JP15163878A patent/JPS5577164A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4507675A (en) * | 1981-03-05 | 1985-03-26 | Matsushita Electronics Corporation | Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor |
| JPS647645A (en) * | 1987-06-30 | 1989-01-11 | Hitachi Ltd | Semiconductor device and manufacture thereof |
| JPH0775253B2 (en) * | 1987-06-30 | 1995-08-09 | 株式会社日立製作所 | Semiconductor device and manufacturing method thereof |
| JPH01232735A (en) * | 1988-03-11 | 1989-09-18 | Matsushita Electric Ind Co Ltd | Semiconductor device |
| JPH0465441U (en) * | 1990-10-19 | 1992-06-08 | ||
| US6646355B2 (en) | 1997-07-10 | 2003-11-11 | International Business Machines Corporation | Structure comprising beam leads bonded with electrically conductive adhesive |
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