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JPS5558584A - Manufacture of solid display device - Google Patents

Manufacture of solid display device

Info

Publication number
JPS5558584A
JPS5558584A JP13135978A JP13135978A JPS5558584A JP S5558584 A JPS5558584 A JP S5558584A JP 13135978 A JP13135978 A JP 13135978A JP 13135978 A JP13135978 A JP 13135978A JP S5558584 A JPS5558584 A JP S5558584A
Authority
JP
Japan
Prior art keywords
reverse
main surface
electrodes
wafer
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13135978A
Other languages
Japanese (ja)
Inventor
Yukihiro Hosomi
Masanobu Nojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP13135978A priority Critical patent/JPS5558584A/en
Priority to PCT/JP1979/000175 priority patent/WO1980000897A1/en
Publication of JPS5558584A publication Critical patent/JPS5558584A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Led Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE: To arrange easily and orderly many LEDs on a substrate by providing predetermined grooves beforehand on a reverse main surface of a wafer and applying cuts on a front main surface corresponding to the grooves.
CONSTITUTION: A GaP wafer 4 has pn-junctions parallel to a main surface, and on its reverse main surface provided are reverse electrodes 6 being arranged in a matrix from and on its front main surface windows 7 corresponding to the reverse electrodes 6 and front electrodes (n side) 8 continuously in the line direction. Grooves 9, 10 extending in a matrix form are provided on the reverse main surface of the wafer 4, and pn-junctions under the reverse electrodes are separated to each other. After that, the reverse surface of the wafter is fixed on a substrate 1. At this time the reverse electrodes in the same column are fixed and aligned to the corresponding column of the electrodes 2 on the substrate with use of a conductive adhesive. Next, cuts 11 corresponding to the grooves 9 in the line derection are provided on the front surface of the wafer 4 to divide it at every line, and each electrode 8 is connected 12 to a corresponding line electrode 3, respectively.
COPYRIGHT: (C)1980,JPO&Japio
JP13135978A 1978-10-24 1978-10-24 Manufacture of solid display device Pending JPS5558584A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP13135978A JPS5558584A (en) 1978-10-24 1978-10-24 Manufacture of solid display device
PCT/JP1979/000175 WO1980000897A1 (en) 1978-10-24 1979-07-02 Method of manufacturing display devices utilizing light-emitting diodes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13135978A JPS5558584A (en) 1978-10-24 1978-10-24 Manufacture of solid display device

Publications (1)

Publication Number Publication Date
JPS5558584A true JPS5558584A (en) 1980-05-01

Family

ID=15056074

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13135978A Pending JPS5558584A (en) 1978-10-24 1978-10-24 Manufacture of solid display device

Country Status (2)

Country Link
JP (1) JPS5558584A (en)
WO (1) WO1980000897A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018519665A (en) * 2015-07-16 2018-07-19 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ Optoelectronic device and manufacturing method of optoelectronic device

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2780981B2 (en) * 1988-06-27 1998-07-30 三菱電機株式会社 Multipoint emission type semiconductor laser and method of manufacturing the same
US5102824A (en) * 1990-11-05 1992-04-07 California Institute Of Technology Method of manufacturing a distributed light emitting diode flat-screen display for use in televisions
NL1029688C2 (en) * 2005-08-05 2007-02-06 Lemnis Lighting Ip Gmbh Method for manufacturing an electrical circuit provided with a plurality of LEDs.
RU2465683C1 (en) * 2011-08-09 2012-10-27 Вячеслав Николаевич Козубов Method of forming light-emitting arrays
RU2474920C1 (en) * 2011-11-14 2013-02-10 Вячеслав Николаевич Козубов Method to generate light-emitting matrices
RU2492550C1 (en) * 2012-05-22 2013-09-10 Вячеслав Николаевич Козубов Method of forming light-emitting arrays
DE102015115812A1 (en) 2015-09-18 2017-03-23 Osram Opto Semiconductors Gmbh Component and method for producing a device
CN105742446B (en) * 2016-04-29 2018-09-04 京东方科技集团股份有限公司 Light-emitting component and preparation method thereof
DE102021102332A1 (en) * 2021-02-02 2022-08-04 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung METHOD OF MANUFACTURING AN ARRAY OF SEMICONDUCTOR CHIPS AND ARRANGEMENT OF SEMICONDUCTOR CHIPS

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3800177A (en) * 1971-12-20 1974-03-26 Motorola Inc Integrated light emitting diode display device with housing
JPS5068497A (en) * 1973-10-18 1975-06-07
JPS50120284A (en) * 1974-03-05 1975-09-20
JPS5837997B2 (en) * 1976-04-20 1983-08-19 松下電器産業株式会社 semiconductor display device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018519665A (en) * 2015-07-16 2018-07-19 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ Optoelectronic device and manufacturing method of optoelectronic device
US10854783B2 (en) 2015-07-16 2020-12-01 Osram Oled Gmbh Optoelectronic arrangement and method for producing an optoelectronic arrangement
US11527678B2 (en) 2015-07-16 2022-12-13 Osram Oled Gmbh Optoelectronic arrangement and method for producing an optoelectronic arrangement

Also Published As

Publication number Publication date
WO1980000897A1 (en) 1980-05-01

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