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JPS5556155A - Thermoplastic polymer composition and filmy adhesive - Google Patents

Thermoplastic polymer composition and filmy adhesive

Info

Publication number
JPS5556155A
JPS5556155A JP12839478A JP12839478A JPS5556155A JP S5556155 A JPS5556155 A JP S5556155A JP 12839478 A JP12839478 A JP 12839478A JP 12839478 A JP12839478 A JP 12839478A JP S5556155 A JPS5556155 A JP S5556155A
Authority
JP
Japan
Prior art keywords
mixture
thermoplastic polymer
polymer composition
ethylene
give
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12839478A
Other languages
Japanese (ja)
Inventor
Kazuo Saotome
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP12839478A priority Critical patent/JPS5556155A/en
Publication of JPS5556155A publication Critical patent/JPS5556155A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: The title composition having improved adhesiveness to metals, prepared by crosslinking a mixture of a specific polyamide resin and an ethylene-unsaturated carboxylic acid copolymer, using an organic peroxide.
CONSTITUTION: (B) 0.1W1.0 parts by wt. of an organic peroxide is added to (A) 100 parts by wt. of a mixture of (a) 50% or more of a polyamide resin having a melting point ≤200°C, synthesized from a dimer acid consisting of a fatty acid dimer which consists mainly of a 36C dibasic acid, and (b) 50% or less of an ethylene-unsaturated carboxylic acid copolymer having an MI ≤20, including the carboxyl groups linked to metallic ions. The mixture is then heated at a temperature of the decomposition point of (B) or above in a short time to give a thermoplastic polymer composition crosslinked to such a degree as not to contain gels. The composition is then melt molded to give a filmy adhesive.
COPYRIGHT: (C)1980,JPO&Japio
JP12839478A 1978-10-20 1978-10-20 Thermoplastic polymer composition and filmy adhesive Pending JPS5556155A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12839478A JPS5556155A (en) 1978-10-20 1978-10-20 Thermoplastic polymer composition and filmy adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12839478A JPS5556155A (en) 1978-10-20 1978-10-20 Thermoplastic polymer composition and filmy adhesive

Publications (1)

Publication Number Publication Date
JPS5556155A true JPS5556155A (en) 1980-04-24

Family

ID=14983713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12839478A Pending JPS5556155A (en) 1978-10-20 1978-10-20 Thermoplastic polymer composition and filmy adhesive

Country Status (1)

Country Link
JP (1) JPS5556155A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5643378A (en) * 1979-09-17 1981-04-22 Sumitomo Electric Ind Ltd Hot-melt adhesive composition
JPS57160612A (en) * 1981-03-30 1982-10-04 Toray Ind Inc Thermoplastic film
JPS5971378A (en) * 1982-10-19 1984-04-23 Du Pont Mitsui Polychem Co Ltd Heat-sensitive film adhesive
JPH07119337B1 (en) * 1987-11-20 1995-12-20 Mitsui Du Pont Polychemical
JP2016535808A (en) * 2013-11-08 2016-11-17 アーケマ・インコーポレイテッド Modification of polyamide
WO2021117635A1 (en) * 2019-12-11 2021-06-17 三井・ダウ ポリケミカル株式会社 Resin composition production method and molded article production method

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5643378A (en) * 1979-09-17 1981-04-22 Sumitomo Electric Ind Ltd Hot-melt adhesive composition
JPS57160612A (en) * 1981-03-30 1982-10-04 Toray Ind Inc Thermoplastic film
JPS6154338B2 (en) * 1981-03-30 1986-11-21 Toray Industries
JPS5971378A (en) * 1982-10-19 1984-04-23 Du Pont Mitsui Polychem Co Ltd Heat-sensitive film adhesive
JPH0324509B2 (en) * 1982-10-19 1991-04-03 Mitsui Du Pont Polychemical
JPH07119337B1 (en) * 1987-11-20 1995-12-20 Mitsui Du Pont Polychemical
JP2016535808A (en) * 2013-11-08 2016-11-17 アーケマ・インコーポレイテッド Modification of polyamide
WO2021117635A1 (en) * 2019-12-11 2021-06-17 三井・ダウ ポリケミカル株式会社 Resin composition production method and molded article production method
CN114787280A (en) * 2019-12-11 2022-07-22 三井-陶氏聚合化学株式会社 Method for producing resin composition and method for producing molded article
CN114787280B (en) * 2019-12-11 2024-03-05 三井-陶氏聚合化学株式会社 Method for producing resin composition and method for producing molded article

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