JPS5550994A - Brazed joint - Google Patents
Brazed jointInfo
- Publication number
- JPS5550994A JPS5550994A JP12255578A JP12255578A JPS5550994A JP S5550994 A JPS5550994 A JP S5550994A JP 12255578 A JP12255578 A JP 12255578A JP 12255578 A JP12255578 A JP 12255578A JP S5550994 A JPS5550994 A JP S5550994A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- brazing
- copper
- less
- brazed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910045601 alloy Inorganic materials 0.000 abstract 5
- 239000000956 alloy Substances 0.000 abstract 5
- 238000005219 brazing Methods 0.000 abstract 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 4
- 229910052802 copper Inorganic materials 0.000 abstract 4
- 239000010949 copper Substances 0.000 abstract 4
- 230000005496 eutectics Effects 0.000 abstract 2
- 229910000765 intermetallic Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 229910015363 Au—Sn Inorganic materials 0.000 abstract 1
- 229910000881 Cu alloy Inorganic materials 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 239000013078 crystal Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 239000007791 liquid phase Substances 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
Landscapes
- Ceramic Products (AREA)
Abstract
PURPOSE: To obtain brazed joint and brazed alloy having high creep strength, by constituting te brazing part of which one side at least is copper substrate with an alloy having liquid phase temperature of less than softening temperature of the copper substrate and having an inermetallic compound formed therein.
CONSTITUTION: The liquid line of an alloy of brazing of metals of which one at least is copper or copper alloy and other metal should be less than 350°C, not causing the copper to soften. As the brazing alloy to form intermetallic compound, Au-Sn, Au-In, etc. are considered. When brazing with such brazing alloys, eutectic structure crystallizes, and intermetallic compound may be formed around the eutectic crystal. Therefore, the tensile strength and creep rupture strength of the joint part may be improved.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12255578A JPS5550994A (en) | 1978-10-06 | 1978-10-06 | Brazed joint |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12255578A JPS5550994A (en) | 1978-10-06 | 1978-10-06 | Brazed joint |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5550994A true JPS5550994A (en) | 1980-04-14 |
Family
ID=14838775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12255578A Pending JPS5550994A (en) | 1978-10-06 | 1978-10-06 | Brazed joint |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5550994A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003504209A (en) * | 1999-07-09 | 2003-02-04 | オウトクンプ オサケイティオ ユルキネン | Hole plugging method and cooling element manufactured by the method |
-
1978
- 1978-10-06 JP JP12255578A patent/JPS5550994A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003504209A (en) * | 1999-07-09 | 2003-02-04 | オウトクンプ オサケイティオ ユルキネン | Hole plugging method and cooling element manufactured by the method |
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