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JPS5540075A - Carrier separating coupling mechanism of automatic soldering device - Google Patents

Carrier separating coupling mechanism of automatic soldering device

Info

Publication number
JPS5540075A
JPS5540075A JP11333378A JP11333378A JPS5540075A JP S5540075 A JPS5540075 A JP S5540075A JP 11333378 A JP11333378 A JP 11333378A JP 11333378 A JP11333378 A JP 11333378A JP S5540075 A JPS5540075 A JP S5540075A
Authority
JP
Japan
Prior art keywords
carrier
attachment
coupling
point
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11333378A
Other languages
Japanese (ja)
Inventor
Takehiro Kudo
Sueo Yamada
Tomohiro Kita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11333378A priority Critical patent/JPS5540075A/en
Publication of JPS5540075A publication Critical patent/JPS5540075A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0669—Solder baths with dipping means
    • B23K3/0676—Conveyors therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:The marking separating coupling mechanism which performs the flow process smoothly and also is able to exactly carry out soldering, etc., by performing soldering, etc. separating the carrier from the flow process and coupling it to its original flow precess again. CONSTITUTION:When the carrier 12 is led to above the solder tank 16 and reaches the point I, the attachment 39 is moved downward. At this time, the fitting parts 391, 392 of the attachment 39 are separated from the coupling pin mounted at the coupling part 27 of the carrier 12. And the side end part 124 of the carrier 12 turns ON the switch 47, the chains 44, 46 are moved faster than the belt 38, and make the carrier 12 move from the point I to above the solder tank 16. Subsequently, the carrier 12 is lowered to above the solder tank 16 by the regular method, soldering is made to the printing distributing board, and the carrier 12 is raised again and is returned to its original position. In this case, the chains 44, 46 are moved again, the projecting part of the chain 46 pushes out the carrier 12 to the right by fitting with the fitting part 481 and it is coupled with the attachment 39 again at the point II.
JP11333378A 1978-09-14 1978-09-14 Carrier separating coupling mechanism of automatic soldering device Pending JPS5540075A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11333378A JPS5540075A (en) 1978-09-14 1978-09-14 Carrier separating coupling mechanism of automatic soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11333378A JPS5540075A (en) 1978-09-14 1978-09-14 Carrier separating coupling mechanism of automatic soldering device

Publications (1)

Publication Number Publication Date
JPS5540075A true JPS5540075A (en) 1980-03-21

Family

ID=14609575

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11333378A Pending JPS5540075A (en) 1978-09-14 1978-09-14 Carrier separating coupling mechanism of automatic soldering device

Country Status (1)

Country Link
JP (1) JPS5540075A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3111809A1 (en) * 1981-03-25 1982-12-30 Zevatron GmbH Gesellschaft für Fertigungseinrichtungen der Elektronik, 3548 Arolsen METHOD AND DEVICE FOR MACHINE SOLDERING WORKPIECES
JPS5815382U (en) * 1981-07-22 1983-01-31 有限会社東邦電子機器製作所 Printed circuit board lead wire cutting device
US4776508A (en) * 1985-06-28 1988-10-11 Unit Design Inc. Electronic component lead tinning device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3111809A1 (en) * 1981-03-25 1982-12-30 Zevatron GmbH Gesellschaft für Fertigungseinrichtungen der Elektronik, 3548 Arolsen METHOD AND DEVICE FOR MACHINE SOLDERING WORKPIECES
JPS5815382U (en) * 1981-07-22 1983-01-31 有限会社東邦電子機器製作所 Printed circuit board lead wire cutting device
JPS6345040Y2 (en) * 1981-07-22 1988-11-22
US4776508A (en) * 1985-06-28 1988-10-11 Unit Design Inc. Electronic component lead tinning device

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