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JPS5527362A - Thermosetting resin compostion - Google Patents

Thermosetting resin compostion

Info

Publication number
JPS5527362A
JPS5527362A JP10077278A JP10077278A JPS5527362A JP S5527362 A JPS5527362 A JP S5527362A JP 10077278 A JP10077278 A JP 10077278A JP 10077278 A JP10077278 A JP 10077278A JP S5527362 A JPS5527362 A JP S5527362A
Authority
JP
Japan
Prior art keywords
parts
straight
branched chain
compound
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10077278A
Other languages
Japanese (ja)
Inventor
Isao Kaetsu
Minoru Kumakura
Eiichi Sekine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Atomic Energy Agency
Ichikoh Industries Ltd
Original Assignee
Japan Atomic Energy Research Institute
Ichikoh Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Atomic Energy Research Institute, Ichikoh Industries Ltd filed Critical Japan Atomic Energy Research Institute
Priority to JP10077278A priority Critical patent/JPS5527362A/en
Publication of JPS5527362A publication Critical patent/JPS5527362A/en
Pending legal-status Critical Current

Links

Landscapes

  • Paints Or Removers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Silicon Polymers (AREA)

Abstract

PURPOSE: A thermosetting resin composition capable of forming films having improved abrasion and chemical resistance and surface hardness on metals, comprising a specific aminosilane compound, an epoxy group-containing silane compound, and an epoxy compound.
CONSTITUTION: A composition comprising (A) 100 parts by wt. of one or more types of aminosilane compounds of formulas I, II, and III: (R1 is ≤6C straight or branched chain alkylene group; R2 is ≤4C straight or branched chain alkyl group; R3 is OR2 or ≤4C straight or branched chain alkylene group), (B) 1W100 parts by wt. of one or more types of epoxy group-containing silane compounds selected from formulas IV and V, (C) 1W80 parts by wt. of an epoxy group-containing vinyl compound monomer or its polymer, and, if necessary, (D) 0.5W1 part by wt. per 100 parts by wt. of (B) or its mixture with (C) of a ring opening polymerization catalyst, e.g. BF3 or a carboxylic acid.
COPYRIGHT: (C)1980,JPO&Japio
JP10077278A 1978-08-18 1978-08-18 Thermosetting resin compostion Pending JPS5527362A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10077278A JPS5527362A (en) 1978-08-18 1978-08-18 Thermosetting resin compostion

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10077278A JPS5527362A (en) 1978-08-18 1978-08-18 Thermosetting resin compostion

Publications (1)

Publication Number Publication Date
JPS5527362A true JPS5527362A (en) 1980-02-27

Family

ID=14282770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10077278A Pending JPS5527362A (en) 1978-08-18 1978-08-18 Thermosetting resin compostion

Country Status (1)

Country Link
JP (1) JPS5527362A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1179571A1 (en) * 1999-03-23 2002-02-13 Kaneka Corporation Curable resin compositions
JP2003064308A (en) * 2001-08-29 2003-03-05 Satoshi Sawamura Transparent silicone-based film-forming composition and method for curing the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1179571A1 (en) * 1999-03-23 2002-02-13 Kaneka Corporation Curable resin compositions
EP1179571A4 (en) * 1999-03-23 2002-06-05 Kaneka Corp Curable resin compositions
US6569980B1 (en) 1999-03-23 2003-05-27 Kaneka Corporation Curable resin compositions
JP2003064308A (en) * 2001-08-29 2003-03-05 Satoshi Sawamura Transparent silicone-based film-forming composition and method for curing the same

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