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JPS55140252A - Header - Google Patents

Header

Info

Publication number
JPS55140252A
JPS55140252A JP4795979A JP4795979A JPS55140252A JP S55140252 A JPS55140252 A JP S55140252A JP 4795979 A JP4795979 A JP 4795979A JP 4795979 A JP4795979 A JP 4795979A JP S55140252 A JPS55140252 A JP S55140252A
Authority
JP
Japan
Prior art keywords
heat sink
solder
flange
plating layer
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4795979A
Other languages
Japanese (ja)
Inventor
Mitsuo Ito
Usuke Enomoto
Haruo Kugimiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4795979A priority Critical patent/JPS55140252A/en
Publication of JPS55140252A publication Critical patent/JPS55140252A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H01L23/4924—Bases or plates or solder therefor characterised by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To provide an inexpensive header capable of readily soldering to the first plating layer of heat sink engaged with a flange by coating the first plating layer with a metal plating layer having preferable solder wettability. CONSTITUTION:A copper heat sink 8 is engaged with an opening perforated at the center of a flange 7 of iron, copper or aluminum plate. The flange and the surface of a heat sink are plated with nickel 9, a silver is further plated at 10 on the heat sink 8. A circuit element is plated through a solder foil on the heat sink 8, heated in N2, and fixed to the heat sink. Since the silver has high wettability with solder according to this method, it is difficult to contain air bubble in the molten solder bonding layer. Since it can use solder containing no flux, no gas is generated to preferably bond therebetween for inexpensive cost.
JP4795979A 1979-04-20 1979-04-20 Header Pending JPS55140252A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4795979A JPS55140252A (en) 1979-04-20 1979-04-20 Header

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4795979A JPS55140252A (en) 1979-04-20 1979-04-20 Header

Publications (1)

Publication Number Publication Date
JPS55140252A true JPS55140252A (en) 1980-11-01

Family

ID=12789876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4795979A Pending JPS55140252A (en) 1979-04-20 1979-04-20 Header

Country Status (1)

Country Link
JP (1) JPS55140252A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63137461A (en) * 1986-11-28 1988-06-09 Nec Corp Semiconductor device
US6326678B1 (en) * 1993-09-03 2001-12-04 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
US6552417B2 (en) 1993-09-03 2003-04-22 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63137461A (en) * 1986-11-28 1988-06-09 Nec Corp Semiconductor device
US6326678B1 (en) * 1993-09-03 2001-12-04 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
US6552417B2 (en) 1993-09-03 2003-04-22 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
US6724071B2 (en) 1993-09-03 2004-04-20 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance

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