JPS55133557A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS55133557A JPS55133557A JP3981279A JP3981279A JPS55133557A JP S55133557 A JPS55133557 A JP S55133557A JP 3981279 A JP3981279 A JP 3981279A JP 3981279 A JP3981279 A JP 3981279A JP S55133557 A JPS55133557 A JP S55133557A
- Authority
- JP
- Japan
- Prior art keywords
- cap
- package
- plate
- active region
- secured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
-
- H10W42/25—
-
- H10W70/682—
-
- H10W72/07551—
-
- H10W72/381—
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- H10W72/50—
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- H10W72/884—
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- H10W90/756—
Abstract
PURPOSE:To prevent the soft error of a semiconductor memory by disposing a semiconductor chip active region in a package nearer to the cap side from the plane of a sealed glass layer to largely reduce alpha ray dosage incident to the active region. CONSTITUTION:Insulating base and cap 1 mand 8 made of high alumina formation ceramic for forming a package are prepared. An alpha ray shield 7 made of high purity material plate is secured into the central recess of a cap 8. An intermediate plate 4 having low thermal expansion coefficient is disposed at the central recess of the base 1, and a silicon chip 5 is secured onto the plate 4. The cap 8 is then secured to the base 1, and a package is airtightly sealed. Since the plate 4 is interposed to approach the active region 5A of a semiconductor chip 5 nearer to the cap side from the plane of the sealed glass layers 2a, 2c, it can prevent the erroneous operation of a semiconductor memory owing to alpha rays irradiated from the sealing glasses 2a, 2c.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3981279A JPS55133557A (en) | 1979-04-04 | 1979-04-04 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3981279A JPS55133557A (en) | 1979-04-04 | 1979-04-04 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55133557A true JPS55133557A (en) | 1980-10-17 |
Family
ID=12563372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3981279A Pending JPS55133557A (en) | 1979-04-04 | 1979-04-04 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55133557A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55140250A (en) * | 1979-04-18 | 1980-11-01 | Fujitsu Ltd | Semiconductor device |
| JPS5632416U (en) * | 1979-08-21 | 1981-03-30 | ||
| JPS59169955A (en) * | 1983-03-14 | 1984-09-26 | Mitsubishi Metal Corp | Low-melting glass for sealing of semi-conductor device |
| JPS62281358A (en) * | 1986-05-29 | 1987-12-07 | Nec Kyushu Ltd | Semiconductor device |
| JPS6356842A (en) * | 1986-08-27 | 1988-03-11 | Canon Inc | Rotary head type recording or reproducing device |
-
1979
- 1979-04-04 JP JP3981279A patent/JPS55133557A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55140250A (en) * | 1979-04-18 | 1980-11-01 | Fujitsu Ltd | Semiconductor device |
| JPS5632416U (en) * | 1979-08-21 | 1981-03-30 | ||
| JPS59169955A (en) * | 1983-03-14 | 1984-09-26 | Mitsubishi Metal Corp | Low-melting glass for sealing of semi-conductor device |
| JPS62281358A (en) * | 1986-05-29 | 1987-12-07 | Nec Kyushu Ltd | Semiconductor device |
| JPS6356842A (en) * | 1986-08-27 | 1988-03-11 | Canon Inc | Rotary head type recording or reproducing device |
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