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JPS55123139A - Integrated circuit device - Google Patents

Integrated circuit device

Info

Publication number
JPS55123139A
JPS55123139A JP3023379A JP3023379A JPS55123139A JP S55123139 A JPS55123139 A JP S55123139A JP 3023379 A JP3023379 A JP 3023379A JP 3023379 A JP3023379 A JP 3023379A JP S55123139 A JPS55123139 A JP S55123139A
Authority
JP
Japan
Prior art keywords
pad
width
pattern
potential
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3023379A
Other languages
Japanese (ja)
Other versions
JPS6157698B2 (en
Inventor
Yoshinari Kitamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3023379A priority Critical patent/JPS55123139A/en
Publication of JPS55123139A publication Critical patent/JPS55123139A/en
Publication of JPS6157698B2 publication Critical patent/JPS6157698B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)

Abstract

PURPOSE:To measure width of a slender conductor pattern easily without using a layer resistance by a method wherein a wide pattern is connected in series to a parallel-connected slender conductor pattern, and a pad for potential measuring and voltage feeding is provided at each contact and the pattern end. CONSTITUTION:There are a conductor W1 in width and L1 in length and another conductor W2 in width and L2 in length on an insulating film of a semiconductor substrate, an Al common potential measuring pad 24 is provided through a window opened on the insulating film, and voltage feeding pads 23, 25 are provided on the other ends of both conductors. The pad 25 is earthed and when +10V is applied on the pad 23, a potential of the pad 24 is obtained at VX<R2/(R1+R2)X10. Where a layer resistance is rhoS, R1=rhoSXL1/W1 and R2=rhoSXL2/W2, and VX has nothing to do with rhoS. To maximize a change of VX against width fluctuation DELTAW, VX at a design center value will have to be selected at 1/2 of the voltage on both ends with R1=R2. According to this method, potential of the pad 24 is measured on an automatic measuring equipment to obtain a discrepancy of the pattern width easily, thus serving for production management.
JP3023379A 1979-03-15 1979-03-15 Integrated circuit device Granted JPS55123139A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3023379A JPS55123139A (en) 1979-03-15 1979-03-15 Integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3023379A JPS55123139A (en) 1979-03-15 1979-03-15 Integrated circuit device

Publications (2)

Publication Number Publication Date
JPS55123139A true JPS55123139A (en) 1980-09-22
JPS6157698B2 JPS6157698B2 (en) 1986-12-08

Family

ID=12297987

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3023379A Granted JPS55123139A (en) 1979-03-15 1979-03-15 Integrated circuit device

Country Status (1)

Country Link
JP (1) JPS55123139A (en)

Also Published As

Publication number Publication date
JPS6157698B2 (en) 1986-12-08

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