JPS55122666A - Solder fusion-connecting method - Google Patents
Solder fusion-connecting methodInfo
- Publication number
- JPS55122666A JPS55122666A JP3002079A JP3002079A JPS55122666A JP S55122666 A JPS55122666 A JP S55122666A JP 3002079 A JP3002079 A JP 3002079A JP 3002079 A JP3002079 A JP 3002079A JP S55122666 A JPS55122666 A JP S55122666A
- Authority
- JP
- Japan
- Prior art keywords
- circuit element
- connecting portions
- wiring substrate
- solder alloy
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title abstract 5
- 229910045601 alloy Inorganic materials 0.000 abstract 5
- 239000000956 alloy Substances 0.000 abstract 5
- 239000004020 conductor Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 238000007747 plating Methods 0.000 abstract 2
- 238000005476 soldering Methods 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 230000008030 elimination Effects 0.000 abstract 1
- 238000003379 elimination reaction Methods 0.000 abstract 1
- 230000004907 flux Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 238000009736 wetting Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE: To achieve the elimination of need for pre-soldering work on a wiring substrate by aligning the solder alloy electrodes of a circuit element on the specific metal layer provided on the wiring conductor surface of the wiring substrate and heating the same to fuse.
CONSTITUTION: In the case of fusion-connecting the solder alloy electrodes 2 of a circuit element 1 to the wiring conductors 4 of a wiring substrate 3, hitherto the connecting portions 5 of the conductors segmented by an insulation layer 6 are coated thereon with flux and are then dipped in a solder tank, by which they are subjected pre-soldering, but since the connecting portions are fine, the wetting of the alloy is poor. Thereupon, the plating layer composed of the metal of the single composition which is well wetted by alloys of gole, copper, tin, etc. is beforehand formed on the connecting portions and the solder alloy electrodes are contacted onto this plating layer, thence they are directly heated to fuse, whereby the circuit element may be connected readily and surely.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3002079A JPS55122666A (en) | 1979-03-16 | 1979-03-16 | Solder fusion-connecting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3002079A JPS55122666A (en) | 1979-03-16 | 1979-03-16 | Solder fusion-connecting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55122666A true JPS55122666A (en) | 1980-09-20 |
Family
ID=12292149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3002079A Pending JPS55122666A (en) | 1979-03-16 | 1979-03-16 | Solder fusion-connecting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55122666A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6318695A (en) * | 1986-07-11 | 1988-01-26 | 株式会社日立製作所 | Wiring board |
| JPS63107087A (en) * | 1986-05-19 | 1988-05-12 | 株式会社デンソー | Hybrid integrated circuit board |
| US5829665A (en) * | 1992-12-09 | 1998-11-03 | Nippondenso Co., Ltd. | Fluxless soldering process |
| KR100906710B1 (en) | 2008-01-24 | 2009-07-07 | 대덕전자 주식회사 | Copper foil pad structure and processing method for chip surface mounting |
-
1979
- 1979-03-16 JP JP3002079A patent/JPS55122666A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63107087A (en) * | 1986-05-19 | 1988-05-12 | 株式会社デンソー | Hybrid integrated circuit board |
| US5383093A (en) * | 1986-05-19 | 1995-01-17 | Nippondenso Co., Ltd. | Hybrid integrated circuit apparatus |
| US5897724A (en) * | 1986-05-19 | 1999-04-27 | Nippondenso Co., Ltd. | Method of producing a hybrid integrated circuit |
| JPS6318695A (en) * | 1986-07-11 | 1988-01-26 | 株式会社日立製作所 | Wiring board |
| US5829665A (en) * | 1992-12-09 | 1998-11-03 | Nippondenso Co., Ltd. | Fluxless soldering process |
| KR100906710B1 (en) | 2008-01-24 | 2009-07-07 | 대덕전자 주식회사 | Copper foil pad structure and processing method for chip surface mounting |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4487654A (en) | Method of manufacturing printed wiring boards | |
| US4967313A (en) | Electronic circuit and method of production thereof | |
| US3786172A (en) | Printed circuit board method and apparatus | |
| KR910011110A (en) | Solder layer formation method to pad of circuit board and electronic component mounting method to circuit board | |
| JPS55122666A (en) | Solder fusion-connecting method | |
| JPS5586130A (en) | Connection of semiconductor element | |
| JPS6486527A (en) | Ccb tape carrier | |
| JPH0254618B2 (en) | ||
| JPS6472590A (en) | Method of mounting component of aluminum conductor circuit substrate | |
| US5814203A (en) | Process to decrease the strength of an electric field produced by a high voltage conductive path of a printed circuit board and printed circuit assembly using same | |
| US12125618B2 (en) | Chip component production method | |
| JPS58221667A (en) | Soldering method of chip parts | |
| JPS6019680B2 (en) | How to solder to an insulation board | |
| JPS6028003Y2 (en) | Insulated conductor | |
| JP3468876B2 (en) | Printed wiring board and method of manufacturing the same | |
| JPS5892291A (en) | Method of producing printed circuit board | |
| JPS6419794A (en) | Method of soldering electronic component | |
| KR860000476B1 (en) | Manufacturing method of lead wire for electronic parts | |
| JPS588157B2 (en) | Printed wiring board and its manufacturing method | |
| JP2769160B2 (en) | Electronic component mounting method | |
| JPS5460557A (en) | Solder electrode forming method | |
| JPS6441299A (en) | Method of mounting electronic component | |
| JPS587076B2 (en) | Atsumaku Kairo Banno Seizouhou | |
| JPS54160526A (en) | Manufacture of printing distributing board embedded with metal core having contact plug | |
| JP2001291950A (en) | Conductor surface treatment for circuit board |