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JPS55117271A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55117271A
JPS55117271A JP2317079A JP2317079A JPS55117271A JP S55117271 A JPS55117271 A JP S55117271A JP 2317079 A JP2317079 A JP 2317079A JP 2317079 A JP2317079 A JP 2317079A JP S55117271 A JPS55117271 A JP S55117271A
Authority
JP
Japan
Prior art keywords
electrodes
semiconductor device
vicinity
pads
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2317079A
Other languages
Japanese (ja)
Inventor
Chihiro Minatogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP2317079A priority Critical patent/JPS55117271A/en
Publication of JPS55117271A publication Critical patent/JPS55117271A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/0555Shape
    • H01L2224/05552Shape in top view
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01015Phosphorus [P]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Bipolar Transistors (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To prevent crack at the neck of an electrode in a semiconductor device upon connection of wries by eliminating P-As film on a leading electrode in the vicinity of an injection pad. CONSTITUTION:No P-As films 7, 8 are coated on electrodes 3, 5 in the vicinity of junction pads 4, 6, and the electrodes are spaced at an interval l>20mu. According to this configuration since no crack occurs at the electrodes 3, 5 by the stress applied to the pads 4, 6 when wires are connected, electrodes are not opened to improve the reliability.
JP2317079A 1979-02-28 1979-02-28 Semiconductor device Pending JPS55117271A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2317079A JPS55117271A (en) 1979-02-28 1979-02-28 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2317079A JPS55117271A (en) 1979-02-28 1979-02-28 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS55117271A true JPS55117271A (en) 1980-09-09

Family

ID=12103143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2317079A Pending JPS55117271A (en) 1979-02-28 1979-02-28 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55117271A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58158965A (en) * 1982-03-17 1983-09-21 Hitachi Ltd semiconductor equipment
JP2007252258A (en) * 2006-03-22 2007-10-04 Daiwa Seiko Inc Fishing weight

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4926750A (en) * 1972-07-04 1974-03-09
JPS49100965A (en) * 1973-01-29 1974-09-24
JPS5179572A (en) * 1975-01-06 1976-07-10 Hitachi Ltd HANDOTA ISOCHI

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4926750A (en) * 1972-07-04 1974-03-09
JPS49100965A (en) * 1973-01-29 1974-09-24
JPS5179572A (en) * 1975-01-06 1976-07-10 Hitachi Ltd HANDOTA ISOCHI

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58158965A (en) * 1982-03-17 1983-09-21 Hitachi Ltd semiconductor equipment
JP2007252258A (en) * 2006-03-22 2007-10-04 Daiwa Seiko Inc Fishing weight

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