JPS55117271A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS55117271A JPS55117271A JP2317079A JP2317079A JPS55117271A JP S55117271 A JPS55117271 A JP S55117271A JP 2317079 A JP2317079 A JP 2317079A JP 2317079 A JP2317079 A JP 2317079A JP S55117271 A JPS55117271 A JP S55117271A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- semiconductor device
- vicinity
- pads
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Bipolar Transistors (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To prevent crack at the neck of an electrode in a semiconductor device upon connection of wries by eliminating P-As film on a leading electrode in the vicinity of an injection pad. CONSTITUTION:No P-As films 7, 8 are coated on electrodes 3, 5 in the vicinity of junction pads 4, 6, and the electrodes are spaced at an interval l>20mu. According to this configuration since no crack occurs at the electrodes 3, 5 by the stress applied to the pads 4, 6 when wires are connected, electrodes are not opened to improve the reliability.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2317079A JPS55117271A (en) | 1979-02-28 | 1979-02-28 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2317079A JPS55117271A (en) | 1979-02-28 | 1979-02-28 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55117271A true JPS55117271A (en) | 1980-09-09 |
Family
ID=12103143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2317079A Pending JPS55117271A (en) | 1979-02-28 | 1979-02-28 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55117271A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58158965A (en) * | 1982-03-17 | 1983-09-21 | Hitachi Ltd | semiconductor equipment |
JP2007252258A (en) * | 2006-03-22 | 2007-10-04 | Daiwa Seiko Inc | Fishing weight |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4926750A (en) * | 1972-07-04 | 1974-03-09 | ||
JPS49100965A (en) * | 1973-01-29 | 1974-09-24 | ||
JPS5179572A (en) * | 1975-01-06 | 1976-07-10 | Hitachi Ltd | HANDOTA ISOCHI |
-
1979
- 1979-02-28 JP JP2317079A patent/JPS55117271A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4926750A (en) * | 1972-07-04 | 1974-03-09 | ||
JPS49100965A (en) * | 1973-01-29 | 1974-09-24 | ||
JPS5179572A (en) * | 1975-01-06 | 1976-07-10 | Hitachi Ltd | HANDOTA ISOCHI |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58158965A (en) * | 1982-03-17 | 1983-09-21 | Hitachi Ltd | semiconductor equipment |
JP2007252258A (en) * | 2006-03-22 | 2007-10-04 | Daiwa Seiko Inc | Fishing weight |
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