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JPS53110370A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS53110370A
JPS53110370A JP2560377A JP2560377A JPS53110370A JP S53110370 A JPS53110370 A JP S53110370A JP 2560377 A JP2560377 A JP 2560377A JP 2560377 A JP2560377 A JP 2560377A JP S53110370 A JPS53110370 A JP S53110370A
Authority
JP
Japan
Prior art keywords
substrate
semiconductor device
film substrate
reniforce
handing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2560377A
Other languages
Japanese (ja)
Other versions
JPS5826667B2 (en
Inventor
Masaharu Noyori
Hiroaki Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP52025603A priority Critical patent/JPS5826667B2/en
Priority to US05/882,152 priority patent/US4246595A/en
Priority to GB8586/78A priority patent/GB1588377A/en
Priority to CA298,234A priority patent/CA1108305A/en
Priority to DE2810054A priority patent/DE2810054C2/en
Publication of JPS53110370A publication Critical patent/JPS53110370A/en
Priority to US06/168,418 priority patent/US4356374A/en
Publication of JPS5826667B2 publication Critical patent/JPS5826667B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To enable the use of a thin film substrate and thus to reduce the cost as well as to facilitate the handing, by securing a connection between the external lead-out wiring provided on the insulating resin film substrate and the electrode terminal of the semiconductor element and then providing a supporter to the element periphery on the substrate to reniforce the substrate.
COPYRIGHT: (C)1978,JPO&Japio
JP52025603A 1977-03-08 1977-03-08 semiconductor equipment Expired JPS5826667B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP52025603A JPS5826667B2 (en) 1977-03-08 1977-03-08 semiconductor equipment
US05/882,152 US4246595A (en) 1977-03-08 1978-02-28 Electronics circuit device and method of making the same
GB8586/78A GB1588377A (en) 1977-03-08 1978-03-03 Electronic circuit devices and methods of making the same
CA298,234A CA1108305A (en) 1977-03-08 1978-03-06 Electronic circuit device and method of making the same
DE2810054A DE2810054C2 (en) 1977-03-08 1978-03-08 Electronic circuit arrangement and method for its manufacture
US06/168,418 US4356374A (en) 1977-03-08 1980-07-10 Electronics circuit device and method of making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52025603A JPS5826667B2 (en) 1977-03-08 1977-03-08 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS53110370A true JPS53110370A (en) 1978-09-27
JPS5826667B2 JPS5826667B2 (en) 1983-06-04

Family

ID=12170474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52025603A Expired JPS5826667B2 (en) 1977-03-08 1977-03-08 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5826667B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57145354A (en) * 1980-11-21 1982-09-08 Gao Ges Automation Org Carrier element for ic module
US7673434B2 (en) 2004-12-17 2010-03-09 Tetra Laval Holdings & Finance S.A. Filling machine and filling monitoring method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS519587A (en) * 1974-07-12 1976-01-26 Sharp Kk Handotaisochino seizoho

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS519587A (en) * 1974-07-12 1976-01-26 Sharp Kk Handotaisochino seizoho

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57145354A (en) * 1980-11-21 1982-09-08 Gao Ges Automation Org Carrier element for ic module
US7673434B2 (en) 2004-12-17 2010-03-09 Tetra Laval Holdings & Finance S.A. Filling machine and filling monitoring method

Also Published As

Publication number Publication date
JPS5826667B2 (en) 1983-06-04

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