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JPS5212572A - Semi-conductor device - Google Patents

Semi-conductor device

Info

Publication number
JPS5212572A
JPS5212572A JP50088756A JP8875675A JPS5212572A JP S5212572 A JPS5212572 A JP S5212572A JP 50088756 A JP50088756 A JP 50088756A JP 8875675 A JP8875675 A JP 8875675A JP S5212572 A JPS5212572 A JP S5212572A
Authority
JP
Japan
Prior art keywords
semi
conductor device
conductur
electrode
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50088756A
Other languages
Japanese (ja)
Inventor
Masaharu Noyori
Isamu Kitahiro
Hiroaki Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP50088756A priority Critical patent/JPS5212572A/en
Publication of JPS5212572A publication Critical patent/JPS5212572A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To easily connect an electrode on a semi-conductur element with a conductor wiring on a film.
COPYRIGHT: (C)1977,JPO&Japio
JP50088756A 1975-07-18 1975-07-18 Semi-conductor device Pending JPS5212572A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50088756A JPS5212572A (en) 1975-07-18 1975-07-18 Semi-conductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50088756A JPS5212572A (en) 1975-07-18 1975-07-18 Semi-conductor device

Publications (1)

Publication Number Publication Date
JPS5212572A true JPS5212572A (en) 1977-01-31

Family

ID=13951722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50088756A Pending JPS5212572A (en) 1975-07-18 1975-07-18 Semi-conductor device

Country Status (1)

Country Link
JP (1) JPS5212572A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53111662A (en) * 1977-03-10 1978-09-29 Tokyo Denken Kougiyou Kk Washing apparatus for rolled substance
JPS63143989A (en) * 1986-12-08 1988-06-16 三菱化学株式会社 Method for cleaning the outer peripheral surface of a tubular body for electrophotographic photoreceptor
JPH01254989A (en) * 1988-04-04 1989-10-11 Fuji Photo Film Co Ltd Method and device for cleaning

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53111662A (en) * 1977-03-10 1978-09-29 Tokyo Denken Kougiyou Kk Washing apparatus for rolled substance
JPS63143989A (en) * 1986-12-08 1988-06-16 三菱化学株式会社 Method for cleaning the outer peripheral surface of a tubular body for electrophotographic photoreceptor
JPH01254989A (en) * 1988-04-04 1989-10-11 Fuji Photo Film Co Ltd Method and device for cleaning

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