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JPS55116432A - Vacuum apparatus - Google Patents

Vacuum apparatus

Info

Publication number
JPS55116432A
JPS55116432A JP2478679A JP2478679A JPS55116432A JP S55116432 A JPS55116432 A JP S55116432A JP 2478679 A JP2478679 A JP 2478679A JP 2478679 A JP2478679 A JP 2478679A JP S55116432 A JPS55116432 A JP S55116432A
Authority
JP
Japan
Prior art keywords
vacuum
substrate
supporting mechanism
door
vessel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2478679A
Other languages
Japanese (ja)
Inventor
Taketo Handa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
U P ARU KK
Canon Anelva Corp
Original Assignee
U P ARU KK
Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by U P ARU KK, Anelva Corp filed Critical U P ARU KK
Priority to JP2478679A priority Critical patent/JPS55116432A/en
Publication of JPS55116432A publication Critical patent/JPS55116432A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/006—Processes utilising sub-atmospheric pressure; Apparatus therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To obtain a vacuum apparatus having high reliability by a constitution wherein there are provided vacuum vessels containing substrates to be treated, a supporting mechanism for the substrates to be treated, a mechanism for moving the supporting mechanism and vacuum valves being unitary with the supporting mechanism. CONSTITUTION:Vacuum vessels 11, 21, 31 are evacuated to a predetermined level of pressure by means of a vacuum pump. A door 22 is opened, a substrate 411 is placed, and the door 22 is shut. Then the vacuum vessel 11 is evacuated. A substrate-supporting mechanism 40 is moved in the direction of an arrow 26. Treatments such as vacuum metallizing, sputering are carried out within the vacuum vessel 11. In a vacuum vessel 31, a door 32 is opened and a substrate 413 is exchanged for untreated substrate. In this case, each vacuum vessel is kept tightly in the vacuum state by each vacuum valve provided in combination with the substrate- supporting mechanism. Each vacuum valve is constructed by a simple structure by fixing valve seats 44, 48, 51 and O-rings 45, 49, 52 to the substrate-supporting mechanism.
JP2478679A 1979-03-02 1979-03-02 Vacuum apparatus Pending JPS55116432A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2478679A JPS55116432A (en) 1979-03-02 1979-03-02 Vacuum apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2478679A JPS55116432A (en) 1979-03-02 1979-03-02 Vacuum apparatus

Publications (1)

Publication Number Publication Date
JPS55116432A true JPS55116432A (en) 1980-09-08

Family

ID=12147860

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2478679A Pending JPS55116432A (en) 1979-03-02 1979-03-02 Vacuum apparatus

Country Status (1)

Country Link
JP (1) JPS55116432A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5794338A (en) * 1980-12-04 1982-06-11 Tdk Corp Vapor deposition device
JPS57159534A (en) * 1981-02-13 1982-10-01 Ramu Research Corp Load lock
JPS6051537A (en) * 1983-08-31 1985-03-23 Anelva Corp Substance transfer apparatus between vacuum system and atmospheric pressure part
JPS6316832U (en) * 1986-07-16 1988-02-04
US4728252A (en) * 1986-08-22 1988-03-01 Lam Research Corporation Wafer transport mechanism

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5794338A (en) * 1980-12-04 1982-06-11 Tdk Corp Vapor deposition device
JPS57159534A (en) * 1981-02-13 1982-10-01 Ramu Research Corp Load lock
JPS6051537A (en) * 1983-08-31 1985-03-23 Anelva Corp Substance transfer apparatus between vacuum system and atmospheric pressure part
JPS6316832U (en) * 1986-07-16 1988-02-04
US4728252A (en) * 1986-08-22 1988-03-01 Lam Research Corporation Wafer transport mechanism

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