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JPS55113351A - Integrated circuit module - Google Patents

Integrated circuit module

Info

Publication number
JPS55113351A
JPS55113351A JP1979979A JP1979979A JPS55113351A JP S55113351 A JPS55113351 A JP S55113351A JP 1979979 A JP1979979 A JP 1979979A JP 1979979 A JP1979979 A JP 1979979A JP S55113351 A JPS55113351 A JP S55113351A
Authority
JP
Japan
Prior art keywords
chips
heat discharge
wiring substrate
fixed
flexible leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1979979A
Other languages
Japanese (ja)
Other versions
JPS6159660B2 (en
Inventor
Kanji Otsuka
Masao Sekihashi
Tamotsu Usami
Hiroshi Hososaka
Akira Mizuno
Tomiro Yasuda
Tasao Soga
Masakatsu Ishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1979979A priority Critical patent/JPS55113351A/en
Publication of JPS55113351A publication Critical patent/JPS55113351A/en
Publication of JPS6159660B2 publication Critical patent/JPS6159660B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To increase assembly density and heat discharge effect by a structure wherein a plurality of IC chips are bonded on a wiring substrate by using flexible leads and a heat discharge body is fitted on the chip surface.
CONSTITUTION: A plurality of IC chips 1 including bipolar LSI for high speed logic use are fixed on multi-layered wiring substrate 1 made of alumina ceramic and provided with a plurality of terminal pins 6 projecting on its back surface, by means of flexible leads 5. Next, heatsink 3 having heat discharge fin 3A is fixed on the whole body of these chips, and its end is connected to the end of substrate 1 by means of bolt 7. When an IC module is constructed in this way, good heat discharge effect is obtained, and even if thermal stress is produced due to the difference of thermal expansion coefficients, no crack occurs in the chips.
COPYRIGHT: (C)1980,JPO&Japio
JP1979979A 1979-02-23 1979-02-23 Integrated circuit module Granted JPS55113351A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979979A JPS55113351A (en) 1979-02-23 1979-02-23 Integrated circuit module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979979A JPS55113351A (en) 1979-02-23 1979-02-23 Integrated circuit module

Publications (2)

Publication Number Publication Date
JPS55113351A true JPS55113351A (en) 1980-09-01
JPS6159660B2 JPS6159660B2 (en) 1986-12-17

Family

ID=12009387

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979979A Granted JPS55113351A (en) 1979-02-23 1979-02-23 Integrated circuit module

Country Status (1)

Country Link
JP (1) JPS55113351A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57153457A (en) * 1981-03-17 1982-09-22 Nec Corp Semiconductor mounting apparatus
JPS629640A (en) * 1985-07-08 1987-01-17 Nec Corp Mounting structure of semiconductor parts
US5138521A (en) * 1985-04-05 1992-08-11 Omron Tateisi Electronics Co. Electronic component assembly with direct mounting for proper and effective cooling
JP2017511609A (en) * 2014-04-18 2017-04-20 レイセオン カンパニー Method for aligning surface mount packages for thermal improvement
CN113539995A (en) * 2021-07-16 2021-10-22 威星国际半导体(深圳)有限公司 High-thermal-conductivity silicon carbide device packaging structure and method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4566895B2 (en) * 2005-11-30 2010-10-20 株式会社ダイヘン Impedance converter

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57153457A (en) * 1981-03-17 1982-09-22 Nec Corp Semiconductor mounting apparatus
JPS6217872B2 (en) * 1981-03-17 1987-04-20 Nippon Electric Co
US5138521A (en) * 1985-04-05 1992-08-11 Omron Tateisi Electronics Co. Electronic component assembly with direct mounting for proper and effective cooling
JPS629640A (en) * 1985-07-08 1987-01-17 Nec Corp Mounting structure of semiconductor parts
JP2017511609A (en) * 2014-04-18 2017-04-20 レイセオン カンパニー Method for aligning surface mount packages for thermal improvement
CN113539995A (en) * 2021-07-16 2021-10-22 威星国际半导体(深圳)有限公司 High-thermal-conductivity silicon carbide device packaging structure and method
CN113539995B (en) * 2021-07-16 2024-04-12 威星国际半导体(深圳)有限公司 High-thermal-conductivity silicon carbide device packaging structure and method

Also Published As

Publication number Publication date
JPS6159660B2 (en) 1986-12-17

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