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JPS5449074A - Plasma processing unit - Google Patents

Plasma processing unit

Info

Publication number
JPS5449074A
JPS5449074A JP11597577A JP11597577A JPS5449074A JP S5449074 A JPS5449074 A JP S5449074A JP 11597577 A JP11597577 A JP 11597577A JP 11597577 A JP11597577 A JP 11597577A JP S5449074 A JPS5449074 A JP S5449074A
Authority
JP
Japan
Prior art keywords
working chamber
plasma
cooling
cooling pipe
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11597577A
Other languages
Japanese (ja)
Inventor
Tsuneo Yoshida
Takashi Itasaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP11597577A priority Critical patent/JPS5449074A/en
Publication of JPS5449074A publication Critical patent/JPS5449074A/en
Pending legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

PURPOSE: To prevent a chemical change due to the heat of a resist film formed on a processed material, by dividing an unit into a plasma generating chamber and plasma working chamber and by providing a cooling unit for cooling processed materials installed in the working chamber to the working chamber.
CONSTITUTION: To the side where plasma generating chamber 11 wound with high-frequency coil 7 confronts to plasma working chamber 3, radical cooling pipe 14 is provided which has path 16 for flowing cooling water 15. This cooling pipe, formed of highly-pure Al, Al alloy, ceramic, etc., has through holes 17 for carrying radicals from generating chamber 11 to working chamber 3. Around the external circumference of working chamber 3, cooling pipe 13 of the same materials as cooling pipe 14 is wound, where water flow, so that semiconductor wafers or hard maks positives 1 will be kept below a fixed temperature which have been installed in working chamber 3. Consequently, no chemical change due to heat occurs to the resist film provided to the wafer, and the plasma process without defect can be made possilbe
COPYRIGHT: (C)1979,JPO&Japio
JP11597577A 1977-09-26 1977-09-26 Plasma processing unit Pending JPS5449074A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11597577A JPS5449074A (en) 1977-09-26 1977-09-26 Plasma processing unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11597577A JPS5449074A (en) 1977-09-26 1977-09-26 Plasma processing unit

Publications (1)

Publication Number Publication Date
JPS5449074A true JPS5449074A (en) 1979-04-18

Family

ID=14675755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11597577A Pending JPS5449074A (en) 1977-09-26 1977-09-26 Plasma processing unit

Country Status (1)

Country Link
JP (1) JPS5449074A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58202533A (en) * 1982-05-21 1983-11-25 Hitachi Ltd Surface treatment device
JPS5954227A (en) * 1982-09-21 1984-03-29 Tokyo Denshi Kagaku Kabushiki Dry type pattern forming method
JPS5966123A (en) * 1982-10-08 1984-04-14 Hitachi Ltd Dry processing apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58202533A (en) * 1982-05-21 1983-11-25 Hitachi Ltd Surface treatment device
JPH0542813B2 (en) * 1982-05-21 1993-06-29 Hitachi Ltd
JPS5954227A (en) * 1982-09-21 1984-03-29 Tokyo Denshi Kagaku Kabushiki Dry type pattern forming method
JPS5966123A (en) * 1982-10-08 1984-04-14 Hitachi Ltd Dry processing apparatus

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