[go: up one dir, main page]

JPS5434762A - Resin-sealing metal mold - Google Patents

Resin-sealing metal mold

Info

Publication number
JPS5434762A
JPS5434762A JP10046277A JP10046277A JPS5434762A JP S5434762 A JPS5434762 A JP S5434762A JP 10046277 A JP10046277 A JP 10046277A JP 10046277 A JP10046277 A JP 10046277A JP S5434762 A JPS5434762 A JP S5434762A
Authority
JP
Japan
Prior art keywords
resin
metal mold
sealing metal
witout
void
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10046277A
Other languages
Japanese (ja)
Inventor
Hideo Inayoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10046277A priority Critical patent/JPS5434762A/en
Publication of JPS5434762A publication Critical patent/JPS5434762A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
    • B29C45/568—Applying vibrations to the mould parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
    • B29C45/568—Applying vibrations to the mould parts
    • B29C2045/5685—Applying vibrations to the mould parts for eliminating internal voids in the moulding material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve the dielectric strength of a semiconductor device witout the generation of a void by improving leakage by decreasing the viscosity of a resin, by providing an ultrasonic vibrator to a metal mold used at the time of resin sealing by putting in a sealed body.
JP10046277A 1977-08-24 1977-08-24 Resin-sealing metal mold Pending JPS5434762A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10046277A JPS5434762A (en) 1977-08-24 1977-08-24 Resin-sealing metal mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10046277A JPS5434762A (en) 1977-08-24 1977-08-24 Resin-sealing metal mold

Publications (1)

Publication Number Publication Date
JPS5434762A true JPS5434762A (en) 1979-03-14

Family

ID=14274565

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10046277A Pending JPS5434762A (en) 1977-08-24 1977-08-24 Resin-sealing metal mold

Country Status (1)

Country Link
JP (1) JPS5434762A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56110799A (en) * 1980-02-05 1981-09-02 Kao Corp Creamy detergent composition
EP0904923A1 (en) * 1997-09-30 1999-03-31 Texas Instruments Incorporated Method and system for molding
US6033203A (en) * 1996-12-09 2000-03-07 The Boeing Company Tooling for vibration assisted processing of viscous thermoplastics

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56110799A (en) * 1980-02-05 1981-09-02 Kao Corp Creamy detergent composition
JPS5827319B2 (en) * 1980-02-05 1983-06-08 花王株式会社 Creamy cleaning composition
US6033203A (en) * 1996-12-09 2000-03-07 The Boeing Company Tooling for vibration assisted processing of viscous thermoplastics
US6592799B1 (en) 1996-12-09 2003-07-15 The Boeing Company Vibration assisted processing of viscous thermoplastics
EP0904923A1 (en) * 1997-09-30 1999-03-31 Texas Instruments Incorporated Method and system for molding
SG89265A1 (en) * 1997-09-30 2002-06-18 Texas Instruments Inc Method and system for molding

Similar Documents

Publication Publication Date Title
SE7500366L (en)
JPS5434762A (en) Resin-sealing metal mold
JPS5263095A (en) Press-in type hermetic seal
JPS53143656A (en) Resin seal-forming of electronic parts
JPS5240184A (en) Temperature compensation circuit for pressure transducers
JPS53124075A (en) Manufacture of resin sealing type semiconductor device and metal mold used for said manufacture
JPS5253665A (en) Semiconductor device
JPS5275180A (en) Package for integrated circuits
JPS5379381A (en) Production of resin seal type semiconductor device and lead frame used forthe same
JPS5320840A (en) Acoustic surface wave device
JPS53139973A (en) Production of lead frame for semiconductor device
JPS5341108A (en) Broadcasting device
JPS5279774A (en) Forming method for lead frame for resin sealing
JPS5236451A (en) Crystal oscillator
JPS5410674A (en) Resin sealing method of semiconductor device
JPS5214359A (en) Process for sealing of the semiconductor and lead-frame used in this method
JPS51127692A (en) Elastic surgace wave device
JPS5353381A (en) Electronic wristwatch
JPS5210652A (en) Elastic surface wave device
JPS5720437A (en) Resin sealing metal mold for semiconductor device
JPS51134074A (en) Method to manufacture the semiconductor unit
JPS545635A (en) Semiconductor memory device
JPS5313357A (en) Formation of connector lead of semiconductor device
JPS5425164A (en) Semiconductor device
JPS5358767A (en) Production of semiconductor device