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JPS5420662A - Semiconductor wafer cleavaging device - Google Patents

Semiconductor wafer cleavaging device

Info

Publication number
JPS5420662A
JPS5420662A JP8463677A JP8463677A JPS5420662A JP S5420662 A JPS5420662 A JP S5420662A JP 8463677 A JP8463677 A JP 8463677A JP 8463677 A JP8463677 A JP 8463677A JP S5420662 A JPS5420662 A JP S5420662A
Authority
JP
Japan
Prior art keywords
cleavaging
semiconductor wafer
wafer
observing
microscope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8463677A
Other languages
Japanese (ja)
Other versions
JPS575051B2 (en
Inventor
Keisuke Shimada
Ganzo Iwane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP8463677A priority Critical patent/JPS5420662A/en
Publication of JPS5420662A publication Critical patent/JPS5420662A/en
Publication of JPS575051B2 publication Critical patent/JPS575051B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE: To minimize the effect of the degree of skill and achieve the improvement in the performance of cleavaging operation by fixing a wafer on a rest base with a vacuum pump and operating a mechanical cleavaging means composed of a device including a blade and a pressing mechanism while observing a microscope.
COPYRIGHT: (C)1979,JPO&Japio
JP8463677A 1977-07-16 1977-07-16 Semiconductor wafer cleavaging device Granted JPS5420662A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8463677A JPS5420662A (en) 1977-07-16 1977-07-16 Semiconductor wafer cleavaging device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8463677A JPS5420662A (en) 1977-07-16 1977-07-16 Semiconductor wafer cleavaging device

Publications (2)

Publication Number Publication Date
JPS5420662A true JPS5420662A (en) 1979-02-16
JPS575051B2 JPS575051B2 (en) 1982-01-28

Family

ID=13836165

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8463677A Granted JPS5420662A (en) 1977-07-16 1977-07-16 Semiconductor wafer cleavaging device

Country Status (1)

Country Link
JP (1) JPS5420662A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4813260A (en) * 1971-06-04 1973-02-19

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4813260A (en) * 1971-06-04 1973-02-19

Also Published As

Publication number Publication date
JPS575051B2 (en) 1982-01-28

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