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JPS54140465A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS54140465A
JPS54140465A JP4777178A JP4777178A JPS54140465A JP S54140465 A JPS54140465 A JP S54140465A JP 4777178 A JP4777178 A JP 4777178A JP 4777178 A JP4777178 A JP 4777178A JP S54140465 A JPS54140465 A JP S54140465A
Authority
JP
Japan
Prior art keywords
lead
tab
lead frame
malformation
fringe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4777178A
Other languages
Japanese (ja)
Inventor
Akira Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4777178A priority Critical patent/JPS54140465A/en
Publication of JPS54140465A publication Critical patent/JPS54140465A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To decrease the malformation and to omit the wire bonding by increasing the mechanical strength of the lead frame used for assembly of the semiconductor device, and thus to avoid the breakage of the wire caused by the malformation of the lead frame.
CONSTITUTION: Tab 5 to attach circuit element 21 to lead frame 1, lead 4 extending from the fringe of tab 5 to the ambient area, and tie bar 6 linking lead 4 are provided respectively. Tie bar 6 is put between lead 4 and frame 2 to increase the mechanical strength. And the upper and lower layers 9 and 10 except for inner layer 8 at cross-hatching region 7 enclosed by bar 6 are changed into deteriorated insulator layer 11, and hatching region 12 is turned to insulator layer 13. At the same time, vamps 14 with the metal layer formed is provided on the upper surface of tab 5 independently from each other and on electrode terminals 15 dotted along the fringe of tab 5, and terminal 15 is connected to inner layer 8 of each lead 4.
COPYRIGHT: (C)1979,JPO&Japio
JP4777178A 1978-04-24 1978-04-24 Lead frame Pending JPS54140465A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4777178A JPS54140465A (en) 1978-04-24 1978-04-24 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4777178A JPS54140465A (en) 1978-04-24 1978-04-24 Lead frame

Publications (1)

Publication Number Publication Date
JPS54140465A true JPS54140465A (en) 1979-10-31

Family

ID=12784633

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4777178A Pending JPS54140465A (en) 1978-04-24 1978-04-24 Lead frame

Country Status (1)

Country Link
JP (1) JPS54140465A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4612564A (en) * 1984-06-04 1986-09-16 At&T Bell Laboratories Plastic integrated circuit package
US4754912A (en) * 1984-04-05 1988-07-05 National Semiconductor Corporation Controlled collapse thermocompression gang bonding
US5096852A (en) * 1988-06-02 1992-03-17 Burr-Brown Corporation Method of making plastic encapsulated multichip hybrid integrated circuits
US5438222A (en) * 1989-08-28 1995-08-01 Semiconductor Energy Laboratory Co., Ltd. Electronic device with plural pad connection of semiconductor chip to leads
US5973388A (en) * 1998-01-26 1999-10-26 Motorola, Inc. Leadframe, method of manufacturing a leadframe, and method of packaging an electronic component utilizing the leadframe

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4754912A (en) * 1984-04-05 1988-07-05 National Semiconductor Corporation Controlled collapse thermocompression gang bonding
US4612564A (en) * 1984-06-04 1986-09-16 At&T Bell Laboratories Plastic integrated circuit package
US5096852A (en) * 1988-06-02 1992-03-17 Burr-Brown Corporation Method of making plastic encapsulated multichip hybrid integrated circuits
US5438222A (en) * 1989-08-28 1995-08-01 Semiconductor Energy Laboratory Co., Ltd. Electronic device with plural pad connection of semiconductor chip to leads
US5973388A (en) * 1998-01-26 1999-10-26 Motorola, Inc. Leadframe, method of manufacturing a leadframe, and method of packaging an electronic component utilizing the leadframe

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